Patents by Inventor Chung-An Wu
Chung-An Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12000193Abstract: An electric supporting rod includes a driving unit and an actuating unit. The driving unit has a first outer cylinder and a driver disposed in the first outer cylinder. The first outer cylinder has an opening and elastic latching hooks disposed on an inner wall thereof, and the driver has a transmission slot. The actuating unit has a second outer cylinder and a transmission screw rod sheathed in the second outer cylinder. The second outer cylinder has an insertion part inserted into the opening, the transmission screw rod has a passive end engaged with the transmission slot, the insertion part has connection pieces surrounding the passive end, and the connection pieces are latched with the elastic latching hooks to longitudinally lock driving unit and the actuating unit. Accordingly, the electric supporting rod has a simple structure and is easily assembled.Type: GrantFiled: March 1, 2022Date of Patent: June 4, 2024Assignees: HSIN CHONG MACHINERY WORKS CO. LTD., FUZHOU MINGFANG AUTOMOBILE PARTS INDUSTRY CO., LTD.Inventors: Chi-Wang Wu, Feng-Lin Yang, Jeffrey Chung-Chiang Hsi
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Publication number: 20240177055Abstract: A judging method for a module peeling time of a soft electronic fabric module is provided. The method includes: preselecting a plurality of module material combinations, the plurality of module material combinations respectively comprising a substrate material, a wire material and a packaging material; extracting the plurality of module material combinations to generate a plurality of module material combination parameters; generating a plurality of machine learning training data based on the plurality of module material combination parameters and a plurality of module pre-processing conditions; and training a machine learning model according to the plurality of machine learning training data to provide an optimized prediction model for judging a module peeling time.Type: ApplicationFiled: December 27, 2022Publication date: May 30, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Cheng-Hung SAN, Hsin-Chung WU, Ming-Hong CHIUEH
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Publication number: 20240178765Abstract: A voltage conversion device includes a filter circuit, a first inductor, a second inductor a first conversion module, a second conversion module, and a control circuit. The filter circuit is electrically connected to a first AC terminal and a second AC terminal. The first inductor is electrically connected to the first AC terminal and a first conversion terminal. The second inductor is electrically connected to the second AC terminal and a second conversion terminal. The first conversion module is electrically connected to a first DC voltage terminal, a second DC voltage terminal, and the first conversion terminal. The second conversion module is electrically connected to the first DC voltage terminal, the second DC voltage terminal, and the second conversion terminal. The control circuit transmits switch-control signals to the first conversion module and the second conversion module. A voltage conversion method is used with the voltage conversion device.Type: ApplicationFiled: December 27, 2022Publication date: May 30, 2024Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Chih-Chung CHIU, Yan-Fu JHOU, Chih-Chang LEE, Chih-Cheng WU
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Publication number: 20240174765Abstract: The present invention relates to antibodies that bind to ENO1 and applications thereof. The applications encompass therapies and diagnostics of diseases or disorders associated with ENO1 activation and progression thereof using such antibodies. Specifically, the antibodies of the present invention bind to ENO1 on the surface of cancer cells and are useful in reducing cancer cell growth and metastasis and prolonging survival time. The antibodies of the present invention may also be used in detecting ENO1, diagnosis and prognosis of cancer and monitoring cancer progression. The present invention also provides a method for screening for a candidate agent for cancer therapy.Type: ApplicationFiled: March 22, 2022Publication date: May 30, 2024Applicant: Academia SinicaInventors: Han-Chung WU, Hsin-Jung LI
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Patent number: 11996283Abstract: The present disclosure provides a method for forming an integrated circuit (IC) structure. The method includes providing a metal gate (MG), an etch stop layer (ESL) formed on the MG, and a dielectric layer formed on the ESL. The method further includes etching the ESL and the dielectric layer to form a trench. A surface of the MG exposed in the trench is oxidized to form a first oxide layer on the MG. The method further includes removing the first oxide layer using a H3PO4 solution.Type: GrantFiled: July 26, 2022Date of Patent: May 28, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shich-Chang Suen, Li-Chieh Wu, Chi-Jen Liu, He Hui Peng, Liang-Guang Chen, Yung-Chung Chen
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Publication number: 20240170603Abstract: The present disclosure provides a semiconductor device package. The semiconductor device package includes a substrate having a first surface and a second surface opposite to the first surface, an optical device disposed on the first surface of the substrate, and an electronic device disposed on the second surface of the substrate. A power of the electronic device is greater than a power of the optical device. A vertical projection of the optical device on the first surface is spaced apart from a vertical projection of the electronic device on the second surface by a distance greater than zero.Type: ApplicationFiled: January 30, 2024Publication date: May 23, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Yi WU, Chang Chin TSAI, Bo-Yu HUANG, Ying-Chung CHEN
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Publication number: 20240166845Abstract: A high-efficiency far-infrared radiation emitting composition manufacturing method includes the steps of: preparing a far-infrared radiation emitting composition by a formula including a far-infrared material, an additive containing a dispersant and a thermal stabilizer, and a thermoplastic; and obtaining a product of the high-efficiency far-infrared radiation emitting composition according to the formula by a blending and kneading process; and the product includes the far-infrared radiation emitting composition; at least one substrate provided to be attached to the far-infrared radiation emitting composition; and the product is formed according to a predetermined proportion of the far-infrared radiation emitting composition formula by the blending and kneading process and attached to the substrate.Type: ApplicationFiled: May 12, 2023Publication date: May 23, 2024Inventors: Yang-Kun Ou, Shiao-Wu Lai, Yin-Lung Liou, Chung-I Chien
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Publication number: 20240170299Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.Type: ApplicationFiled: January 30, 2024Publication date: May 23, 2024Inventors: KUN-JU LI, ANG CHAN, HSIN-JUNG LIU, WEI-XIN GAO, JHIH-YUAN CHEN, CHUN-HAN CHEN, ZONG-SIAN WU, CHAU-CHUNG HOU, I-MING LAI, FU-SHOU TSAI
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Patent number: 11988831Abstract: A method of displaying a rear-view image and a mobile device using the method are provided. The method includes: receiving the rear-view image; displaying a virtual dashboard through a display; and displaying the rear-view image on a default area of the virtual dashboard in response to receiving a signal associated with a direction indicator light, wherein the default area corresponds to the direction indicator light.Type: GrantFiled: February 14, 2023Date of Patent: May 21, 2024Assignee: Kinpo Electronics, Inc.Inventors: Yu Chi Chen, Hsien Chung Chen, Sheng-Chang Wu
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Patent number: 11988867Abstract: The present disclosure provides a package structure having a photonic integrated circuit, the package structure includes a substrate, a chip and an optical module. The chip has an optical waveguide structure and a recessed portion. The optical waveguide structure is adjacent to the recessed portion. The recessed portion faces the substrate, and the chip is engaged to the substrate by flip chip. The optical module is provided in the recessed portion of the chip.Type: GrantFiled: August 6, 2021Date of Patent: May 21, 2024Assignee: Molex, LLCInventors: Chih-Wei Peng, Chih-Chung Hsu, Chih-Chung Wu, Zuon-Min Chuang
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Patent number: 11991859Abstract: An apparatus may include a heat pipe with a first portion residing in a first plane, a second portion residing in the first plane and a third portion positioned between the first portion and the second portion, the third portion residing in a second plane spaced-apart from the first plane. The apparatus further includes a base plate including an opening and a clip plate having a first region, a second region and a third region positioned between the first and the second regions. The third portion of the heat pipe is positioned within the opening, and the clip plate is coupled to the base plate such that i) the third region of the clip plate is in superimposition with the third portion of the heat pipe and ii) third region of the clip plate resides in the first plane.Type: GrantFiled: July 13, 2022Date of Patent: May 21, 2024Assignee: Dell Products L.P.Inventors: Chin-Chung Wu, Chun-Han Lin, Che-Jung Chang, Yueh Ching Lu
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Patent number: 11990429Abstract: A method includes bonding a second package component to a first package component, bonding a third package component to the first package component, attaching a dummy die to the first package component, encapsulating the second package component, the third package component, and the dummy die in an encapsulant, and performing a planarization process to level a top surface of the second package component with a top surface of the encapsulant. After the planarization process, an upper portion of the encapsulant overlaps the dummy die. The dummy die is sawed-through to separate the dummy die into a first dummy die portion and a second dummy die portion. The upper portion of the encapsulant is also sawed through.Type: GrantFiled: November 28, 2022Date of Patent: May 21, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chih-Wei Wu, Ying-Ching Shih, Kung-Chen Yeh, Li-Chung Kuo, Pu Wang, Szu-Wei Lu
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Patent number: 11981957Abstract: Biomarkers relevant to neurons in the brain, in particular at single cell levels, are identified by using olfactory neurons as the best surrogates from subjects so as to establish diagnosis, prognosis, and treatment of brain conditions.Type: GrantFiled: August 21, 2018Date of Patent: May 14, 2024Assignee: The Johns Hopkins UniversityInventors: Akira Sawa, Koko Ishizuka, YeeWen Candace Wu, Youjin Chung, Nao J. Gamo
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Patent number: 11982798Abstract: A projection lens includes a first lens group, a second lens group and an aperture stop. The first lens group is disposed between a reduced side and a magnified side. The second lens is disposed between the first lens group and the magnified side. The second lens group has a light incident surface, a reflective surface and a light emitting surface, the light incident surface faces the first lens group, the light emitting surface faces a projection surface, the light incident surface, the light emitting surface and the first lens group are disposed at a single side of the reflective surface, and at least one of the light incident surface, the reflective surface and the light emitting surface is a freeform surface. The aperture stop is disposed between the first lens group and the second lens group. Moreover, a projection apparatus including the projection lens is also provided.Type: GrantFiled: November 5, 2021Date of Patent: May 14, 2024Assignee: Coretronic CorporationInventors: Hsin-Hsiang Lo, Wei-Ting Wu, Fu-Ming Chuang, Chuan-Chung Chang, Ching-Chuan Wei
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Patent number: 11974633Abstract: A multi-layer textile includes fabric tiles bonded to a base textile layer. The fabric tiles might be cut from one or more larger fabric pieces, which are textile remnants or scraps from prior manufacturing processes. The fabric tiles are bonded to the base textile layer in a manner that reduces the susceptibility of the fabric tiles to peel away from the base textile layer.Type: GrantFiled: October 7, 2020Date of Patent: May 7, 2024Assignee: Converse Inc.Inventors: Le Nguyen, Viet Tran, Jen Chung Wu
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Publication number: 20240139142Abstract: Provided is a method for preventing or treating a liver disease, including administering a therapeutically effective amount of pharmaceutical composition to a subject in need, and the pharmaceutical composition includes the isothiocyanate structural modified compound and a pharmaceutically acceptable carrier thereof.Type: ApplicationFiled: September 14, 2023Publication date: May 2, 2024Applicants: TAIPEI VETERANS GENERAL HOSPITAL, NATIONAL YANG MING CHIAO TUNG UNIVERSITY, PHARMAESSENTIA CORPORATIONInventors: Jaw-Ching WU, Yung-Sheng CHANG, Kuo-Hsi KAO, Chan-Kou HWANG, Ko-Chung LIN
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Publication number: 20240136174Abstract: In some embodiments, the present disclosure relates to an integrated chip fabrication device. The device includes a stealth laser apparatus arranged over a chuck configured to hold a substrate. An infrared camera is arranged over the chuck and configured to detect an alignment mark below the substrate. The alignment mark is used to align the stealth laser apparatus over the chuck. Control circuitry is configured to operate the stealth laser apparatus to form a stealth damage region at a location within the substrate that is determined based upon the alignment mark. The stealth damage region separates an inner region of the substrate from an outer region of the substrate.Type: ApplicationFiled: January 3, 2024Publication date: April 25, 2024Inventors: Ming-Tung Wu, Hsun-Chung Kuang, Tung-He Chou
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Publication number: 20240135553Abstract: A movement detection method, applied to a navigation input device with a navigation pattern comprising a center pattern and a radial pattern. The movement detection method comprises: (a)capturing a sensing image comprising a center pattern image and at least portion of a radial pattern image by an image sensor, wherein the center pattern image corresponds to the center pattern and the radial pattern image corresponding to the radial pattern; (b)computing a translation of the navigation input device according to shift of the center pattern image; and (c)computing a rotation angle of the navigation input device according to a first pattern relation between the center pattern image and a first portion of the radial pattern image. The translation and the rotation angle can be precisely and sensitively detected even if the joystick device is miniaturized, since the translation and the rotation angle are computed according to the navigation pattern.Type: ApplicationFiled: October 19, 2022Publication date: April 25, 2024Applicant: PixArt Imaging Inc.Inventors: Yi-Chung Chen, Chao-Chien Huang, Chung-Yuo Wu
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Patent number: 11967596Abstract: An integrated circuit includes a first-voltage power rail and a second-voltage power rail in a first connection layer, and includes a first-voltage underlayer power rail and a second-voltage underlayer power rail below the first connection layer. Each of the first-voltage and second-voltage power rails extends in a second direction that is perpendicular to a first direction. Each of the first-voltage and second-voltage underlayer power rails extends in the first direction. The integrated circuit includes a first via-connector connecting the first-voltage power rail with the first-voltage underlayer power rail, and a second via-connector connecting the second-voltage power rail with the second-voltage underlayer power rail.Type: GrantFiled: August 5, 2021Date of Patent: April 23, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Guo-Huei Wu, Shih-Wei Peng, Wei-Cheng Lin, Hui-Zhong Zhuang, Chih-Liang Chen, Li-Chun Tien, Lee-Chung Lu
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Patent number: D1024932Type: GrantFiled: March 10, 2022Date of Patent: April 30, 2024Assignee: WALSIN LIHWA CORPORATIONInventors: Ko-Ming Chen, Shih-Hsiang Wang, An-Hung Lin, Min-Chuan Wu, Shao-Pei Lin, Chien-Chung Ni, Chun-Ying Lin