Patents by Inventor Chung-Chi Lai
Chung-Chi Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11996165Abstract: A memory chip includes a first decoding device and a memory device. The first decoding device is configured to generate multiple word line signals. The memory device is configured to generate a third data signal based on a first data signal and a second data signal. The memory device includes a first memory circuit and a second memory circuit. The first memory circuit is configured to generate the first data signal at a first node according to the word line signals during a first period. The second memory circuit is configured to generate the second data signal at a second node different from the first node according to the word line signals during a second period after the first period. A method of operating a memory chip is also disclosed herein.Type: GrantFiled: May 17, 2022Date of Patent: May 28, 2024Assignee: AU OPTRONICS CORPORATIONInventors: Hsiang-Chi Cheng, Shyh-Bin Kuo, Yi-Cheng Lai, Chung-Hung Chen, Shih-Hsien Yang, Yu-Chih Wang, Kuo-Hsiang Chen
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Patent number: 11961866Abstract: A method of forming an image sensor includes forming a photodiode within a semiconductor substrate. The method further includes disposing an interconnect structure over the semiconductor substrate. The interconnect structure includes a contact etch stop layer (CESL) over the photodiode; and a plurality of dielectric layers over the CESL, wherein at least one dielectric layer of the plurality of dielectric layers comprises a low dielectric constant (low-k) material. The method further includes patterning at least the plurality of dielectric layers, wherein patterning at least the plurality of dielectric layers comprises defining an opening above an active region of the photodiode. The method further includes depositing a cap layer on sidewalls of the opening, wherein the cap layer includes a dielectric material having a higher moisture resistance than the low-k dielectric material.Type: GrantFiled: October 27, 2020Date of Patent: April 16, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chiao-Chi Wang, Chia-Ping Lai, Chung-Chuan Tseng
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Patent number: 10924845Abstract: A microphone includes an outer casing, a carrier disposed in the outer casing, and a sound receiving module connected to the carrier. The carrier has a through hole opposite to the sound receiving module. An airtight unit includes a shock absorber and an airtight member cooperating with the outer casing and the carrier to define an airtight back chamber configured to generate a pneumatic wave when a mechanical vibration wave is transmitted to the outer casing. A damping material closes the through hole and is configured to change the phase of the pneumatic wave when the latter passes therethrough such that the pneumatic wave and the mechanical vibration wave can offset each other when they are transmitted to the sound receiving module.Type: GrantFiled: March 20, 2020Date of Patent: February 16, 2021Assignee: Taiwan Carol Electronics Co., LtdInventors: Tzu-Huan Peng, Chung-Chi Lai, Chao-Chih Chang
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Publication number: 20200366985Abstract: A microphone includes an outer casing, a carrier disposed in the outer casing, and a sound receiving module connected to the carrier. The carrier has a through hole opposite to the sound receiving module. An airtight unit includes a shock absorber and an airtight member cooperating with the outer casing and the carrier to define an airtight back chamber configured to generate a pneumatic wave when a mechanical vibration wave is transmitted to the outer casing. A damping material closes the through hole and is configured to change the phase of the pneumatic wave when the latter passes therethrough such that the pneumatic wave and the mechanical vibration wave can offset each other when they are transmitted to the sound receiving module.Type: ApplicationFiled: March 20, 2020Publication date: November 19, 2020Inventors: Tzu-Huan Peng, Chung-Chi Lai, Chao-Chih Chang
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Patent number: 9634637Abstract: Method for performing dynamic impedance matching and communication apparatus thereof are provided. With respect to an operating band of an impedance matching circuit of a communication device, a first number of times of tuning are performed on a first element of an impedance matching circuit, and a second number of times of tuning are performed on a second element of the impedance matching circuit, wherein the first number is different from the second number.Type: GrantFiled: April 3, 2015Date of Patent: April 25, 2017Assignee: HTC CORPORATIONInventors: Chien-Ting Ho, Chun-Wei Hsu, Chung-Chi Lai, Chih-Chin Su, Wan-Ming Chen
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Publication number: 20170018835Abstract: An antenna control circuit and a corresponding antenna control method are provided. The antenna control circuit includes an antenna and a diode. An anode of the diode is coupled to the antenna. A cathode of the diode is grounded. The anode receives a negative voltage when the antenna receives an alternating current (AC) voltage signal. The antenna control circuit and the antenna control method can increase antenna bandwidth by switching the diode. In addition, the antenna control circuit and the antenna control method can provide better radiation efficiency.Type: ApplicationFiled: July 17, 2015Publication date: January 19, 2017Inventors: Chung-Chi Lai, Wei-Yang Wu, Tiao-Hsing Tsai
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Publication number: 20150214917Abstract: Method for performing dynamic impedance matching and communication apparatus thereof are provided. With respect to an operating band of an impedance matching circuit of a communication device, a first number of times of tuning are performed on a first element of an impedance matching circuit, and a second number of times of tuning are performed on a second element of the impedance matching circuit, wherein the first number is different from the second number.Type: ApplicationFiled: April 3, 2015Publication date: July 30, 2015Applicant: HTC CORPORATIONInventors: Chien-Ting HO, Chun-Wei HSU, Chung-Chi LAI, Chih-Chin SU, Wan-Ming CHEN
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Patent number: 9048536Abstract: A mobile communication device and an impedance matching method thereof are provided. The mobile communication device includes an antenna, a power amplifier, a tunable matching circuit, a power detection circuit and a controller. The tunable matching circuit determines an output impedance encountered by a radio frequency (RF) signal transmitted by the power amplifier to the antenna when the RF signal enters the tunable matching circuit. The power detection circuit detects a forward power of the RF signal entering the antenna and a reflected power of the antenna. The controller tunes the tunable matching circuit according to a frequency range currently used by the mobile communication device, the forward power and the reflected power to steer the output impedance toward a corresponding load-pull impedance that the power amplifier has in the frequency range.Type: GrantFiled: July 9, 2012Date of Patent: June 2, 2015Assignee: HTC CorporationInventors: Chien-Ting Ho, Chun-Wei Hsu, Chung-Chi Lai, Chih-Chin Su, Wan-Ming Chen
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Patent number: 9048815Abstract: Method for performing dynamic impedance matching and communication apparatus thereof are provided. With respect to an operating band of an impedance matching circuit of a communication device, a first number of times of tuning are performed on a first element of an impedance matching circuit, and a second number of times of tuning are performed on a second element of the impedance matching circuit, wherein the first number is different from the second number.Type: GrantFiled: December 22, 2011Date of Patent: June 2, 2015Assignee: HTC CORPORATIONInventors: Chien-Ting Ho, Chun-Wei Hsu, Chung-Chi Lai, Chih-Chin Su, Wan-Ming Chen
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Patent number: 8811911Abstract: A radio-frequency (RF) processing device, for a wireless communication device, is disclosed. The RF processing device comprises an antenna, an RF-signal processing module, a controller, for generating a control signal according to a band switching signal, and a matching adjustment module for adjusting an impedance between the antenna and the RF-signal processing module according to the control signal.Type: GrantFiled: June 29, 2011Date of Patent: August 19, 2014Assignee: HTC CorporationInventors: Chih-Chin Su, Chung-Chi Lai, Chien-Ting Ho, Wan-Ming Chen
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Publication number: 20140009362Abstract: A mobile communication device and an impedance matching method thereof are provided. The mobile communication device includes an antenna, a power amplifier, a tunable matching circuit, a power detection circuit and a controller. The tunable matching circuit determines an output impedance encountered by a radio frequency (RF) signal transmitted by the power amplifier to the antenna when the RF signal enters the tunable matching circuit. The power detection circuit detects a forward power of the RF signal entering the antenna and a reflected power of the antenna. The controller tunes the tunable matching circuit according to a frequency range currently used by the mobile communication device, the forward power and the reflected power to steer the output impedance toward a corresponding load-pull impedance that the power amplifier has in the frequency range.Type: ApplicationFiled: July 9, 2012Publication date: January 9, 2014Applicant: HTC CORPORATIONInventors: Chien-Ting Ho, Chun-Wei Hsu, Chung-Chi Lai, Chih-Chin Su, Wan-Ming Chen
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Publication number: 20120249260Abstract: Method for performing dynamic impedance matching and communication apparatus thereof are provided. With respect to an operating band of an impedance matching circuit of a communication device, a first number of times of tuning are performed on a first element of an impedance matching circuit, and a second number of times of tuning are performed on a second element of the impedance matching circuit, wherein the first number is different from the second number.Type: ApplicationFiled: December 22, 2011Publication date: October 4, 2012Applicant: HTC CorporationInventors: Chien-Ting HO, Chun-Wei Hsu, Chung-Chi Lai, Chih-Chin Su, Wan-Ming Chen
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Publication number: 20120003947Abstract: A radio-frequency (RF) processing device, for a wireless communication device, is disclosed. The RF processing device comprises an antenna, an RF-signal processing module, a controller, for generating a control signal according to a band switching signal, and a matching adjustment module for adjusting an impedance between the antenna and the RF-signal processing module according to the control signal.Type: ApplicationFiled: June 29, 2011Publication date: January 5, 2012Inventors: Chih-Chin Su, Chung-Chi Lai, Chien-Ting Ho, Wan-Ming Chen
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Patent number: 7876159Abstract: A multi-frequency and multi-mode power amplifier is provided. The amplifier has a carrier power amplifier and a peaking power amplifier. The carrier power amplifier receives a first signal and outputs a first amplified signal, in which a first transistor size adjusting unit is included to adjust an equivalent transistor size based on a mode indication signal. The peaking power amplifier receives a second signal and outputs a second amplified signal, in which a second transistor size adjusting unit is included to adjust an equivalent transistor size based on the mode indication signal.Type: GrantFiled: January 30, 2008Date of Patent: January 25, 2011Assignee: Industrial Technology Research InstituteInventors: Shih-Ming Wang, Cheng-Chung Chen, Yu-Cheng Hsu, Chung-Chi Lai
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Publication number: 20090045877Abstract: A multi-frequency and multi-mode power amplifier is provided. The amplifier has a carrier power amplifier and a peaking power amplifier. The carrier power amplifier receives a first signal and outputs a first amplified signal, in which a first transistor size adjusting unit is included to adjust an equivalent transistor size based on a mode indication signal. The peaking power amplifier receives a second signal and outputs a second amplified signal, in which a second transistor size adjusting unit is included to adjust an equivalent transistor size based on the mode indication signal.Type: ApplicationFiled: January 30, 2008Publication date: February 19, 2009Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Shih-Ming Wang, Cheng-Chung Chen, Yu-Cheng Hsu, Chung-Chi Lai