Abstract: An embodiment is a device including a first fin extending from a substrate, a first gate stack over and along sidewalls of the first fin, a first gate spacer disposed along a sidewall of the first gate stack, a first epitaxial source/drain region in the first fin and adjacent the first gate spacer, the first epitaxial source/drain region, and a protection layer between the first epitaxial source/drain region and the first gate spacer and between the first gate spacer and the first gate stack.

Abstract: The disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a package structure, a circuit structure, a bonding structure and an external element. The circuit structure is disposed on the package structure and is electrically connected to the package structure. The circuit structure has a recess. The bonding structure includes a first bonding pad and a second bonding pad. The second bonding pad is disposed in the recess, and the second bonding pad is disposed on the first bonding pad. The bonding structure is disposed between the circuit structure and the external element. The external element is electrically connected to the circuit structure through the bonding structure. A width of the first bonding pad is smaller than a width of the second bonding pad.

Abstract: The present invention provides a container for a product, which comprises: a bottom portion; side walls connected to edges of the bottom portion; at least one first supporting portion protruding from the bottom portion of the container. The first supporting portion includes at least one convex surface to support the product, at least one concave surface, and a side surface, and both the convex surface and the concave surface are connected to the side surface. When the product is received within the container, the convex surface can support the product, and the product is spaced apart from the concave surface; thus, the cushioning effect of the container is greatly improved.

Abstract: An ejector apparatus of a tray device is provided. The tray device movably seats within the space of an electronic equipment. The ejector apparatus includes a support and an ejector. The support has a attachment apparatus adapted to mount on a chassis of the electronic equipment. The ejector pushes the tray device out of the electronic equipment in response to a force applied from the outside of the electronic equipment. The ejector is pivotally connected to the support.

Abstract: An ejector apparatus of a tray device is provided. The tray device movably seats within the space of an electronic equipment. The ejector apparatus includes a support and an ejector. The support has a attachment apparatus adapted to mount on a chassis of the electronic equipment. The ejector pushes the tray device out of the electronic equipment in response to a force applied from the outside of the electronic equipment. The ejector is pivotally connected to the support.