Abstract: The present invention provides an electrostatic charge detecting packaging device comprising a carrier, multiple dies, and multiple electrostatic-charge-sensitive components; the carrier has a surface; the dies are mounted on the surface of the carrier; and the electrostatic-charge-sensitive components are mounted on the surface of the carrier; since an electrostatic voltage tolerance of each of the electrostatic-charge-sensitive components is lower than an electrostatic voltage tolerance of each of the dies, accumulated electrostatic charges are more likely to discharge towards the electrostatic-charge-sensitive components than towards the dies, and as such, by electrically testing whether the electrostatic-charge-sensitive components are functioning normally when packaging the dies, the present invention allows personnel to debug for knowing which packaging steps exactly cause more serious problems that lead to damaging electrostatic discharges in the dies.

Abstract: The present invention discloses a piezoelectric loudspeaker. The piezoelectric loudspeaker comprises a sound producing plate, a resonant sound-box, a surround and a reflective sound-box. The sound producing plate comprises a piezoelectric ceramic element. The resonant sound-box includes a first opening comprising a first carrying part. The sound producing plate is disposed on the first carrying part. A cavity resonator is formed between the sound producing plate and the resonant sound-box. The surround is disposed between the first carrying part and the sound producing plate. The reflective sound-box includes a second opening and a reflective output opening. The second opening comprises a second carrying part. The resonant sound-box is disposed on the second carrying part. A reflective cavity body is formed between the resonant sound-box and the reflective sound-box, and the reflective cavity body is connected the reflective output opening.

Abstract: The present invention discloses a piezoelectric loudspeaker. The piezoelectric loudspeaker comprises a sound producing plate, a resonant sound-box, a surround and a reflective sound-box. The sound producing plate comprises a piezoelectric ceramic element. The resonant sound-box includes a first opening comprising a first carrying part. The sound producing plate is disposed on the first carrying part. A cavity resonator is formed between the sound producing plate and the resonant sound-box. The surround is disposed between the first carrying part and the sound producing plate. The reflective sound-box includes a second opening and a reflective output opening. The second opening comprises a second carrying part. The resonant sound-box is disposed on the second carrying part. A reflective cavity body is formed between the resonant sound-box and the reflective sound-box, and the reflective cavity body is connected the reflective output opening.

Abstract: A system and method for mitigating annealing fingerprints in semiconductor wafers is provided. An embodiment comprises aligning the semiconductor wafers prior to each annealing step. This alignment generates similar or identical fingerprints in each of the semiconductor wafers manufactured. With the fingerprint known, a single compensation model for a subsequent photoresist may be utilized to compensate for the fingerprint in each of the semiconductor wafers.

Abstract: A system and method for mitigating annealing fingerprints in semiconductor wafers is provided. An embodiment comprises aligning the semiconductor wafers prior to each annealing step. This alignment generates similar or identical fingerprints in each of the semiconductor wafers manufactured. With the fingerprint known, a single compensation model for a subsequent photoresist may be utilized to compensate for the fingerprint in each of the semiconductor wafers.