Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: Provided is a headphone that can readily adjust the frequency response characteristics corresponding to the shape of a housing. The headphone includes a first sound emission unit and a head band. The first sound emission unit includes a driver unit, a baffle plate, a housing cover, and an acoustic resistor disposed between the driver unit and the housing cover. The housing cover defines a space together with the driver unit, and the baffle plate. The driver unit includes a diaphragm and a communication hole. The space has a first region and a second region. The diaphragm includes a main dome and an auxiliary dome. The communication hole includes a first communication hole facing the main dome and introducing first sound waves from the main dome to the first region and a second communication hole facing the auxiliary dome and introducing second sound waves from the auxiliary dome to the second region.

Abstract: A condenser microphone comprising: a mic capsule in which a capacitor is composed of a diaphragm and a counter electrode, and which effects electroacoustic conversion; a FET for impedance-converting audio signals output from the mic capsule; and a CR circuit composed of a resistor and a capacitor, and connected to the FET to adjust a signal level in a low frequency range, and in the condenser microphone, an output terminal may be drawn out from a drain of the FET; and the CR circuit may be connected in between a source of the FET and the ground, furthermore, in the condenser microphone, there may be provided a changeover switch for switching a mode in which the CR circuit is connected in between the source of the FET and the ground into another mode in which the CR circuit is short-circuited to connect the source of the FET to the ground.

Abstract: A condenser microphone comprising: a mic capsule in which a capacitor is composed of a diaphragm and a counter electrode, and which effects electroacoustic conversion; a FET for impedance-converting audio signals output from the mic capsule; and a CR circuit composed of a resistor and a capacitor, and connected to the FET to adjust a signal level in a low frequency range, and in the condenser microphone, an output terminal may be drawn out from a drain of the FET; and the CR circuit may be connected in between a source of the FET and the ground, furthermore, in the condenser microphone, there may be provided a changeover switch for switching a mode in which the CR circuit is connected in between the source of the FET and the ground into another mode in which the CR circuit is short-circuited to connect the source of the FET to the ground.