Abstract: Disclosed is an optical module, including a circuit board, a thermally conductive substrate, a structural adhesive, a silicon photonic chip, a laser assembly, and a fiber array assembly coupled to the silicon photonic chip. The thermally conductive substrate includes a first surface, a second surface, and a first bearing seat, a second bearing seat and a third bearing seat disposed on the first surface and exposed from the opening of the circuit board. The area of the second surface is smaller than that of the first surface. Part of the first surface contacts the circuit board. The thermally conductive substrate is fixed to the circuit board by the structural adhesive. The silicon photonic chip is disposed on the first bearing seat, the laser assembly is disposed on the second bearing seat, and a joint of the fiber array assembly is disposed on the third bearing seat.

Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.

Abstract: Disclosed are a co-packaged integrated optoelectronic module and a co-packaged optoelectronic switch chip. The co-packaged integrated optoelectronic module includes a carrier board, and an optoelectronic submodule, a slave microprocessor and a master microprocessor disposed on and electrically connected to the carrier board. In the optoelectronic submodule, a digital signal processing chip converts an electrical analog signal into an electrical digital signal, an optoelectronic signal analog conversion chip converts an optical analog signal into the electrical analog signal to the digital signal processing chip, and an optical transceiver chip receives and transmits the optical analog signal to the optoelectronic signal analog conversion chip. The slave microprocessor monitors operation of the optoelectronic submodule.

Abstract: A composite connector for optical power meter is provided, which includes a fixation base and an active connection base. The fixation base is installed on an optical power meter; the fixation base includes a left hole, a right hole and a central hole. The active connection base includes a bottom plate, an active pin, a first fiber socket and a second fiber socket. The first fiber socket and the second fiber socket are disposed on the bottom plate. The active pin penetrates through the bottom plate and is inserted into the left hole, whereby a first circle, whose center is at the active pin and circumference passes through the first fiber socket as well as the second fiber socket, overlaps a second circle, whose center is at the left hole and circumference passes through the central hole, in the normal direction of the active connection base.

Abstract: A composite connector for optical power meter is provided, which includes a fixation base and an active connection base. The fixation base is installed on an optical power meter; the fixation base includes a left hole, a right hole and a central hole. The active connection base includes a bottom plate, an active pin, a first fiber socket and a second fiber socket. The first fiber socket and the second fiber socket are disposed on the bottom plate. The active pin penetrates through the bottom plate and is inserted into the left hole, whereby a first circle, whose center is at the active pin and circumference passes through the first fiber socket as well as the second fiber socket, overlaps a second circle, whose center is at the left hole and circumference passes through the central hole, in the normal direction of the active connection base.

Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.

Abstract: An optical transmitter with a heat dissipation structure is provided. The heat dissipation structure comprises a substrate and an optical transmitter unit. The substrate comprises a base body, a heat dissipation well disposed on the base body, and a thermal conductive block inserted into and fixed to the heat dissipation well. The thermal conductive block has on one side thereof a heat guiding plane. The optical transmitter unit comprises a heat dissipating substrate directly disposed on the heat guiding plane, and a laser diode directly disposed on the heat dissipating substrate. The laser diode features an active region whose height is lowered to shorten a heat conduction path wherein heat is transferred from the active region through the heat dissipating substrate to the heat guiding plane. The heat already transferred to the heat guiding plane is transferred horizontally by the thermal conductive block to the base body which encloses the heat dissipation well.

Abstract: The invention provides a package structure of optical connector, comprising: an input circuit board, an output circuit board, a flexible circuit board, an optical transceiver module, and an enclosure for packing the above components. The input/output circuit board comprises a connecting terminal and an input/output terminal comprising a plurality of input/output ports, wherein the input circuit board and the output circuit board are fixed by the two opposite sides of the enclosure to create a specific space between the input circuit board and the output circuit board. The flexible circuit board is electrically connected to the connecting terminal of the input circuit board and/or the connecting terminal of the output circuit board. The optical transceiver module is electrically connected to the input circuit board and the output circuit board. The enclosure comprises an electrical connecting opening and an optical connecting opening corresponding to the electrical connecting opening.

Abstract: A replaceable transmitting module is disposed on an optical connector. The replaceable transmitting module comprises a plurality of optical sub-assemblies disposed independently respectively, and at least one positioning mount disposed on the optical connector. The optical sub-assemblies comprises at least one edge-emitting laser diode, a second cover disposed on the edge-emitting laser diode, and a second lens disposed on the second cover and corresponding to the edge-emitting laser diode. The positioning mount comprises a base and a plurality of positioning portions which are disposed on the base and to fix the optical sub-assemblies, respectively.

Abstract: An optical transmitter package structure, comprising: a base, a circuit substrate, and a cylindrical light-coupling mechanism. The optical transmitter package structure of the present invention has following advantageous effects: once the packaging process of the optical transmitter of the present invention is completed, the resulting structure is compact and airtight. Consequently, the optical transmitter is well protected against moisture during use and has a long service life; the optical transmitter of the present invention has a sturdy overall structure which is resistant to damage by improper operation during assembly.

Abstract: A transmitting device package structure comprises a base mounted with a transmitting module, a circuit board, and a cylindrical element. The base comprising a plane part mounted with a transmitting module, and an assembling part disposed on one side of the plane part. The circuit board comprises a board body, an electrical connection side disposed on one end of the board body and connected with the transmitting module, and an electrical connection port disposed an end of the board body opposite to the electrical connection side. The cylindrical element is mounted on the assembling part. The cylindrical element comprises a cylindrical body connected to the external optical fiber, and a coupling lens disposed inside the cylindrical body or one side of the cylindrical body, and the coupling lens couples the optical signal emitted from the transmitting module to the external optical fiber.

Abstract: A replaceable transmitting module is disposed on an optical connector. The replaceable transmitting module comprises a plurality of optical sub-assemblies disposed independently respectively, and at least one positioning mount disposed on the optical connector. The optical sub-assemblies comprises at least one edge-emitting laser diode, a second cover disposed on the edge-emitting laser diode, and a second lens disposed on the second cover and corresponding to the edge-emitting laser diode. The positioning mount comprises a base and a plurality of positioning portions which are disposed on the base and to fix the optical sub-assemblies, respectively.

Abstract: The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.

Abstract: The invention provides a package structure of optical connector, comprising: an input circuit board, an output circuit board, a flexible circuit board, an optical transceiver module, and an enclosure for packing the above components. The input/output circuit board comprises a connecting terminal and an input/output terminal comprising a plurality of input/output ports, wherein the input circuit board and the output circuit board are fixed by the two opposite sides of the enclosure to create a specific space between the input circuit board and the output circuit board. The flexible circuit board is electrically connected to the connecting terminal of the input circuit board and/or the connecting terminal of the output circuit board. The optical transceiver module is electrically connected to the input circuit board and the output circuit board. The enclosure comprises an electrical connecting opening and an optical connecting opening corresponding to the electrical connecting opening.

Abstract: The invention provides a package structure of optical transceiver component, comprising: a metal base; a plurality of pins, at least one optical emitting diode and/or at least one optical receiving diode; wherein the pins are provided and passed through the metal base and insulated with the metal base by using an insulating material; the optical emitting diode and the optical receiving diode are each mounted on the metal base through a sub-mount, respectively. The optical emitting diode/optical receiving diode is connected to the pins neighboring therewith by a wire directly or through the sub-mount, when set the top surface of the pins be a reference level, at least one of the top surfaces of the optical emitting diode, the optical receiving diode, and sub-mount is flush with the reference level.

Abstract: The present invention provides an optical transceiver module, comprising: a circuit substrate; a z-axis positioning base connected to the circuit substrate that, wherein the z-axis positioning base comprises two first sides respectively provided on two lateral sides of the optical transceiver sub-module, a second side provided between and connecting the two first sides, an opening corresponding in position to a side of the optical transceiver sub-module that faces away from the second side, and a step difference provided on each of the two first sides and the second side; a fiber-optic lens element provided on the z-axis positioning base and comprises a cover and a fiber-optic lens sub-module, wherein the cover comprises a recess and step differences surrounding the recess and respectively corresponding in position to the step differences provided on the z-axis positioning base, so as for the cover to be fitted on the z-axis positioning base.

Abstract: The present invention provides an optical transceiver module, comprising: a circuit substrate; a z-axis positioning base connected to the circuit substrate that, wherein the z-axis positioning base comprises two first sides respectively provided on two lateral sides of the optical transceiver sub-module, a second side provided between and connecting the two first sides, an opening corresponding in position to a side of the optical transceiver sub-module that faces away from the second side, and a step difference provided on each of the two first sides and the second side; a fiber-optic lens element provided on the z-axis positioning base and comprises a cover and a fiber-optic lens sub-module, wherein the cover comprises a recess and step differences surrounding the recess and respectively corresponding in position to the step differences provided on the z-axis positioning base, so as for the cover to be fitted on the z-axis positioning base.

Abstract: The present invention relates to an integrate optics for multiplexer transceiver module, comprising: a substrate, a multiplexer, a first waveguide coupling device, a second waveguide coupling device and a third waveguide coupling device. In the present invention, the semiconductor materials and the semiconductor process are used to integrate variety of optical devices on a single semiconductor substrate (chip) by way of modular design and miniaturization, so as to carry out an integrated optics communication framework with high efficiency and low cost. Moreover, in the present invention, a plurality of optical receivers are integrated on the substrate by means of flip-chip bonding, so that, not only the objective of integrating the optical devices is accomplished but also the intensity of laser optical signal is increased.