Patents by Inventor Chung-Hsin Lai

Chung-Hsin Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • VIOLATION CHECKING METHOD BY MACHINE LEARNING BASED CLASSIFIER
    Publication number: 20240152671
    Abstract: A violation checking method includes generating a violation log report for a design, classifying violation logs in the violation log report into high-risk logs and low-risk logs by a machine learning model, reviewing the high-risk logs, and modifying the design if at least one bug is identified in the high-risk logs.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Applicant: MEDIATEK INC.
    Inventors: Chi-Ming Lee, Chung-An Wang, Cheok Yan Goh, Chia-Cheng Tsai, Chien-Hsin Yeh, Chia-Shun Yeh, Chin-Tang Lai
  • Throttle Control Method and System for Mobile Device
    Publication number: 20240129766
    Abstract: A throttle control method for a mobile device include collecting input data, generating a first set of user experience indices according to the input data, and checking whether a user experience index of the first set of user experience indices satisfies a UEI threshold. The input data includes common information data, current configuration data and a plurality of throttle control parameters. Each user experience index of the first set of user experience indices is corresponding to at least one of throttle control parameter of the plurality of throttle control parameters.
    Type: Application
    Filed: April 10, 2023
    Publication date: April 18, 2024
    Applicant: MediaTek Singapore Pte. Ltd.
    Inventors: Hung-Yueh Chen, Byeng Hyun Kim, JUNG SHUP SHIN, Shih-Hsin Chen, Chih-Chieh Lai, Chung-Pi Lee, JUNGWOO LEE, Yu-Lun Chang
  • Method of monitoring semiconductor process
    Patent number: 11887898
    Abstract: A method of monitoring a semiconductor process includes the following steps. A process parameter is set to a first condition. A first process is performed to form a first film layer on a first wafer. The first film layer does not cover a wafer edge region of the first wafer. The first wafer having the first film layer is photographed by an image capturing device to obtain a first wafer image. Image recognition is performed to the first wafer image to obtain first data. Whether a position of the first film layer is offset is determined according to the first data.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: January 30, 2024
    Assignee: Winbond Electronics Corp.
    Inventors: Chien-Yen Liu, Cheng-Chieh Shen, Chung-Hsin Lai, Chen-Wei Liao
  • METHOD OF MONITORING SEMICONDUCTOR PROCESS
    Publication number: 20210125880
    Abstract: A method of monitoring a semiconductor process includes the following steps. A process parameter is set to a first condition. A first process is performed to form a first film layer on a first wafer. The first film layer does not cover a wafer edge region of the first wafer. The first wafer having the first film layer is photographed by an image capturing device to obtain a first wafer image. Image recognition is performed to the first wafer image to obtain first data. Whether a position of the first film layer is offset is determined according to the first data.
    Type: Application
    Filed: March 24, 2020
    Publication date: April 29, 2021
    Applicant: Winbond Electronics Corp.
    Inventors: Chien-Yen Liu, Cheng-Chieh Shen, Chung-Hsin Lai, Chen-Wei Liao