Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.

Abstract: A semiconductor device and methods of forming the same are disclosed. The semiconductor device includes a substrate, first and second source/drain (S/D) regions, a channel between the first and second S/D regions, a gate engaging the channel, and a contact feature connecting to the first S/D region. The contact feature includes first and second contact layers. The first contact layer has a conformal cross-sectional profile and is in contact with the first S/D region on at least two sides thereof. In embodiments, the first contact layer is in direct contact with three or four sides of the first S/D region so as to increase the contact area. The first contact layer includes one of a semiconductor-metal alloy, an III-V semiconductor, and germanium.

Abstract: A LED driving topology includes a LED array and a current source connected in series between two power inputs receiving a positive voltage and a negative voltage respectively. This topology increases the voltage difference across the LED array and hence has the capability of lighting up more serially connected LEDs, without requiring an additional boost circuit or a high voltage. In addition, the circuit of the current source can be made by a low-voltage manufacturing process.

Abstract: A method for applying an asphalt layer on a construction surface comprises the steps of placing an asphalt lattice having an admixture of fibrous and particulate matter onto the construction surface, and heating the lattice with a flame so as to melt the asphalt mixture causing it to flow over the surface and fill any depressions and cracks thereon. The asphalt layer thus formed is in intimate contact with the surface and can be used as waterproofing or as a primer layer for further applications of asphalt.