Patents by Inventor Chung-Hung Wang

Chung-Hung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240086610
    Abstract: A partitioning method for partitioning a group of power-ground (PG) cells is disclosed. The method includes: placing at least one out-boundary PG cell on a substrate, wherein power strips of the at least one out-boundary PG cell are aligned with corresponding power rails on the substrate; and placing at least one in-boundary PG cell on the substrate, wherein power strips of the at least one in-boundary PG cell are aligned with corresponding power rails on the substrate.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Yen-Hung LIN, Yuan-Te HOU, Chung-Hsing WANG
  • Patent number: 11916022
    Abstract: Various embodiments of the present disclosure are directed towards a semiconductor processing system including an overlay (OVL) shift measurement device. The OVL shift measurement device is configured to determine an OVL shift between a first wafer and a second wafer, where the second wafer overlies the first wafer. A photolithography device is configured to perform one or more photolithography processes on the second wafer. A controller is configured to perform an alignment process on the photolithography device according to the determined OVL shift. The photolithography device performs the one or more photolithography processes based on the OVL shift.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: February 27, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yeong-Jyh Lin, Ching I Li, De-Yang Chiou, Sz-Fan Chen, Han-Jui Hu, Ching-Hung Wang, Ru-Liang Lee, Chung-Yi Yu
  • Publication number: 20050275422
    Abstract: A testing method for testing an integrated circuit device includes the steps of forming compliant bumps on bonding pads on a substrate of the device such that each of the compliant bumps has a polymeric body formed on a corresponding one of the bonding pads and a metal layer formed on the polymeric body, and such that the metal layer has a probe-contacting surface formed with a plurality of recesses, and testing electrical continuity between the metal layer of each of the compliant bumps and a corresponding circuit of the device by contacting a probe of a testing apparatus with the recessed probe-contacting surface of the metal layer.
    Type: Application
    Filed: October 12, 2004
    Publication date: December 15, 2005
    Inventors: Song-Ping Luh, Kun-Yung Huang, Chung-Hung Wang
  • Patent number: 6098291
    Abstract: A pipe cutter includes a first handle and a second handle with a pivotable blade connected thereto which has teeth defined in a lateral side thereof. The second handle has a fixed jaw extending laterally therefrom to which the first handle is pivotally connected. A control member is pivotally connected to the first handle and has an initial pawl extend therefrom so as to engage with the teeth when the blade is not pivoted relative to the fixed jaw. The distal end of the control member has a pawls so as to engage with the teeth when the blade is pivoted toward the fixed jaw. A link mechanism is connected between the blade and the second handle so that when pushing the link mechanism by a cam device extending from the first handle, the blade is pivoted toward the fixed jaw to position a pipe to be cut between the fixed jaw and the blade.
    Type: Grant
    Filed: March 11, 1999
    Date of Patent: August 8, 2000
    Inventor: Chung-Hung Wang