Abstract: A package structure including a semiconductor die, a redistribution layer structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution layer structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution layer structure includes a backside dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the backside dielectric layer and the inter-dielectric layers. The electronic device is disposed over the backside dielectric layer and electrically connected to an outermost redistribution conductive layer among the redistribution conductive layers, wherein the outermost redistribution conductive layer is embedded in the backside dielectric layer, and the backside dielectric layer comprises a ring-shaped recess covered by the outermost redistribution conductive layer.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: An integrated fan-out package includes a first redistribution structure, a die, conductive structures, an encapsulant, and a second redistribution structure. The first redistribution structure has first regions and a second region surrounding the first regions. A metal density in the first regions is smaller than a metal density in the second region. The die is disposed over the first redistribution structure. The conductive structures are disposed on the first redistribution structure to surround the die. Vertical projections of the conductive structures onto the first redistribution structure fall within the first regions of the first redistribution structure. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant, the die, and the conductive structures.

Abstract: A semiconductor device includes a substrate, an interfacial layer formed on the semiconductor substrate, and a high-k dielectric layer formed on the interfacial layer. At least one of the high-k dielectric layer and the interfacial layer is doped with: a first dopant species, a second dopant species, and a third dopant species. The first dopant species and the second dopant species form a plurality of first dipole elements having a first polarity. The third dopant species forms a plurality of second dipole elements having a second polarity. A first concentration ratio of the first concentration of the first dopant species to the second concentration of the second dopant species of the p-type transistor is different from a second concentration ratio of the first concentration of the first dopant species to the second concentration of the second dopant species of the n-type transistor.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A semiconductor device includes a substrate, a gate structure on the substrate, a source/drain (S/D) region and a contact. The S/D region is located in the substrate and on a side of the gate structure. The contact lands on and connected to the S/D region. The contact wraps around the S/D region.

Abstract: A semiconductor device with different configurations of gate structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a gate opening on the fin structure, forming a metallic oxide layer within the gate opening, forming a first dielectric layer on the metallic oxide layer, forming a second dielectric layer on the first dielectric layer, forming a work function metal (WFM) layer on the second dielectric layer, and forming a gate metal fill layer on the WFM layer. The forming the first dielectric layer includes depositing an oxide material with an oxygen areal density less than an oxygen areal density of the metallic oxide layer.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first source/drain epitaxial feature formed over a substrate, a second source/drain epitaxial feature formed over the substrate, two or more semiconductor layers disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature, a gate electrode layer surrounding a portion of one of the two or more semiconductor layers, a first dielectric region disposed in the substrate and in contact with a first side of the first source/drain epitaxial feature, and a second dielectric region disposed in the substrate and in contact with a first side of the second source/drain epitaxial feature, the second dielectric region being separated from the first dielectric region by a substrate.

Abstract: An electrode controls transmittance of a blocking layer over a photodiode of a pixel sensor (e.g., a photodiode of a small pixel detector) by changing oxidation of a metal material included in the blocking layer. By using the electrode to adjust transmittance of the blocking layer, pixel sensors for different uses and/or products may be produced using a single manufacturing process. As a result, power and processing resources are conserved that otherwise would have been expended in switching manufacturing processes. Additionally, production time is decreased (e.g., by eliminating downtime that would otherwise have been used to reconfigure fabrication machines.

Abstract: A die suction assistance device is provided to a wafer. The wafer is diced into multiple dies, and a tape is taped on a bottom side of the wafer. The die suction assistance device includes a platform and multiple support structures mounted in the platform. Multiple air ducts are formed among adjacent support structures. When the wafer is air-tightly mounted on the platform, the wafer is supported by the support structures. When an external vacuum device vacuums air out of the platform, a vacuum environment with negative pressure is created in the air ducts. This allows the tape to partially separate from a backside of each of the dies towards the air ducts, and allows the dies to be picked up respectively by a suction nozzle with less chance of being damaged, securing integrities of dies.

Abstract: An electrode controls transmittance of a blocking layer over a photodiode of a pixel sensor (e.g., a photodiode of a small pixel detector) by changing oxidation of a metal material included in the blocking layer. By using the electrode to adjust transmittance of the blocking layer, pixel sensors for different uses and/or products may be produced using a single manufacturing process. As a result, power and processing resources are conserved that otherwise would have been expended in switching manufacturing processes. Additionally, production time is decreased (e.g., by eliminating downtime that would otherwise have been used to reconfigure fabrication machines.

Abstract: In an embodiment, a device includes: an integrated circuit die; an encapsulant at least partially surrounding the integrated circuit die, the encapsulant including fillers having an average diameter; a through via extending through the encapsulant, the through via having a lower portion of a constant width and an upper portion of a continuously decreasing width, a thickness of the upper portion being greater than the average diameter of the fillers; and a redistribution structure including: a dielectric layer on the through via, the encapsulant, and the integrated circuit die; and a metallization pattern having a via portion extending through the dielectric layer and a line portion extending along the dielectric layer, the metallization pattern being electrically coupled to the through via and the integrated circuit die.

Abstract: DIN rail installation kit including main body, spring hook, latch fastener and elastic element and combined with electronic device. When latch fastener is pulled down first to move to second position, buckle of latch fastener pushes down on hook body of spring hook, and after passing under hook body, hook end of hook body can be temporarily positioned on side wall of latch fastener. When user releases latch fastener, elastic element returns latch fastener, buckle is then buckled on buckle portion of hook body, and second buckle means of latch fastener is kept away from first buckle means of main body to present a removable state. When latch fastener is pulled down secondarily to return to first position, buckle is separated from buckle portion of hook body, and second buckle means and first buckle means are relatively buckled on DIN rail to exhibit a state of tight coupling.

Abstract: DIN rail installation kit including main body, spring hook, latch fastener and elastic element and combined with electronic device. When latch fastener is pulled down first to move to second position, buckle of latch fastener pushes down on hook body of spring hook, and after passing under hook body, hook end of hook body can be temporarily positioned on side wall of latch fastener. When user releases latch fastener, elastic element returns latch fastener, buckle is then buckled on buckle portion of hook body, and second buckle means of latch fastener is kept away from first buckle means of main body to present a removable state. When latch fastener is pulled down secondarily to return to first position, buckle is separated from buckle portion of hook body, and second buckle means and first buckle means are relatively buckled on DIN rail to exhibit a state of tight coupling.

Abstract: A multi-function peripheral having an automatic document feeding device (ADF) suited for being configured in a body of an apparatus is provided. The apparatus has a first and second power sources to drive the ADF to transmit a paper in or out of the body. The ADF includes a limiting structure, a swinging member and a blocking member. The first and second power sources drive the limiting structure and the swinging member to swing respectively. The blocking member has a first end connected to the swinging member and a second end extending toward the limiting structure. When the limiting structure is at a second position and the swinging member swings toward a third position, the second end is trapped into the limiting space. When the limiting structure moves toward a first position and the swinging member swings toward the third position, the second end escapes from the limiting space.

Abstract: A multi-function peripheral having an automatic document feeding device (ADF) suited for being configured in a body of an apparatus is provided. The apparatus has a first and second power sources to drive the ADF to transmit a paper in or out of the body. The ADF includes a limiting structure, a swinging member and a blocking member. The first and second power sources drive the limiting structure and the swinging member to swing respectively. The blocking member has a first end connected to the swinging member and a second end extending toward the limiting structure. When the limiting structure is at a second position and the swinging member swings toward a third position, the second end is trapped into the limiting space. When the limiting structure moves toward a first position and the swinging member swings toward the third position, the second end escapes from the limiting space.

Abstract: A paper-feeding device and a multi-function printer (MFP) using the paper-feeding device are provided. The MFP includes a housing with the paper-feeding device installed thereon. The paper-feeding device includes an outer case, an inner case and a retainer. The outer case has first side-walls, openings and slots, in which each opening and each slot on the opening are correspondingly disposed on each first side-wall. The inner case is located beside the first side-walls of the outer case and has a second side-wall. The second side-wall has a position-limiting rib protruding towards the first side-walls. The retainer is located between the first side-walls and has a body, a protrusion and a pivot, in which the protrusion is disposed at a top-portion of the body and correspondingly located in the slots, and the pivot is located between the protrusion and a retaining-portion of the body and correspondingly locked in the openings.

Abstract: A multi-function peripheral having an automatic document feeding device (ADF) suited for being configured in a body of an apparatus is provided. The apparatus has a first and second power sources to drive the ADF to transmit a paper in or out of the body. The ADF includes a limiting structure, a swinging member and a blocking member. The first and second power sources drive the limiting structure and the swinging member to swing respectively. The blocking member has a first end connected to the swinging member and a second end extending toward the limiting structure. When the limiting structure is at a second position and the swinging member swings toward a third position, the second end is trapped into the limiting space. When the limiting structure moves toward a first position and the swinging member swings toward the third position, the second end escapes from the limiting space.

Abstract: A multi-function peripheral having an automatic document feeding device (ADF) suited for being configured in a body of an apparatus is provided. The apparatus has a first and second power sources to drive the ADF to transmit a paper in or out of the body. The ADF includes a limiting structure, a swinging member and a blocking member. The first and second power sources drive the limiting structure and the swinging member to swing respectively. The blocking member has a first end connected to the swinging member and a second end extending toward the limiting structure. When the limiting structure is at a second position and the swinging member swings toward a third position, the second end is trapped into the limiting space. When the limiting structure moves toward a first position and the swinging member swings toward the third position, the second end escapes from the limiting space.

Abstract: A multi-function peripheral having an automatic document feeding device (ADF) suited for being configured in a body of an apparatus is provided. The apparatus has a first and second power sources to drive the ADF to transmit a paper in or out of the body. The ADF includes a limiting structure, a swinging member and a blocking member. The first and second power sources drive the limiting structure and the swinging member to swing respectively. The blocking member has a first end connected to the swinging member and a second end extending toward the limiting structure. When the limiting structure is at a second position and the swinging member swings toward a third position, the second end is trapped into the limiting space. When the limiting structure moves toward a first position and the swinging member swings toward the third position, the second end escapes from the limiting space.