Abstract: A game board device is provided for carrying and identifying game pieces that are divided into different piece types. The game board device includes a board, a plurality of optically identifying modules, and a processing module electrically coupled to the optically identifying modules. The optically identifying modules respectively correspond in position to detection regions of the board. Each of the optically identifying modules includes a light emitter that can emit light toward the corresponding detection region and a light receiver that can receive light reflected by the corresponding detection region. When any one of the detection regions is in an unoccupied mode, the corresponding optically identifying module can emit an unoccupied signal. When any one of the detection regions is in an occupied mode, the corresponding optically identifying module enables an identification signal that corresponds to the piece type of the corresponding game piece to be emitted therefrom.

Abstract: An arc processing method is provided. Firstly, a machining program code is provided, wherein the machining program code includes a control code for machining an arc having a start point and an end point. Then, the machining program code is analyzed to obtain a first start point vector and a first end point vector, both defined by a first coordinate system, of a tool. Then, the first start point vector is converted to a second start point vector defined by a second coordinate system. Then, the first end point vector is converted to a second end point vector defined by the second coordinate system. Then, a plurality of first interpolation vectors of interpolation points, defined by the second coordinate system and interposed between the second start point vector and the second end point vector, are obtained. Then, all the first interpolation vectors are converted into corresponding second interpolation vectors.

Abstract: A detection device, detection method, and compensation method for tool wear, applied to a machine tool including a spindle connected to a tool. A first parameter set including a first cutting depth having a zero cutting depth is set, and the machine tool performs a cutting procedure with the first parameter set to record a first loading rate of the spindle. A second parameter set including a second cutting depth having a non-zero cutting depth is set, and the machine tool performs the cutting procedure with the second parameter set to record a second loading rate of the spindle. A processing device calculates an estimated cutting force according to the loading rates and a machine performance database. A fuzzy logic unit outputs a wear level according to a tool wear database and the estimated cutting force. The machine tool adjusts a cutting locus according to the wear level.

Abstract: A detection device, detection method, and compensation method for tool wear, applied to a machine tool including a spindle connected to a tool. A first parameter set including a first cutting depth having a zero cutting depth is set, and the machine tool performs a cutting procedure with the first parameter set to record a first loading rate of the spindle. A second parameter set including a second cutting depth having a non-zero cutting depth is set, and the machine tool performs the cutting procedure with the second parameter set to record a second loading rate of the spindle. A processing device calculates an estimated cutting force according to the loading rates and a machine performance database. A fuzzy logic unit outputs a wear level according to a tool wear database and the estimated cutting force. The machine tool adjusts a cutting locus according to the wear level.

Abstract: An LED light source includes a connecting body and a mounting base. The mounting base includes a mounting platform having a top surface, and an LED unit connected to the top surface, the top surface having good heat-dissipating properties. The LED unit includes LEDs, an LED driving device, and a circuit board. The circuit board includes a first portion for mounting the driving device and a second portion for mounting the LEDs. The first portion is connected to the top surface. The second portion is bent away from the first portion; the LEDs being mounted to outer surface of the integral second portion.

Abstract: An LED light source includes a connecting body and a mounting base. The mounting base includes a mounting platform having a top surface, and an LED unit connected to the top surface, the top surface having good heat-dissipating properties. The LED unit includes LEDs, an LED driving device, and a circuit board. The circuit board includes a first portion for mounting the driving device and a second portion for mounting the LEDs. The first portion is connected to the top surface. The second portion is bent away from the first portion; the LEDs being mounted to outer surface of the integral second portion.

Abstract: A reflector configured for reflecting light emitted from a light emitting diode (LED) toward a desired area is provided. The reflector defines a groove therein for accommodating the LED. Light emitted from the LED is reflected by an inner surface of the reflector toward a desired area located below the reflector, wherein the light reflected out of the reflector travels along a direction opposite to the main emitting direction of the LED. An LED illumination device incorporating the reflector is also provided.

Abstract: A lens includes a substrate, a light concentrating portion mounted on the substrate. The substrate includes a first substrate and a second substrate, the light concentrating portion includes a first light concentrating portion and a second light concentrating portion. The first light concentrating portion extends outward from the first substrate, the second light concentrating portion extends outward from the second substrate. The first light concentrating portion has a first axis, the second light concentrating portion has a second axis. The first axis and the second axis are configured in an angle and intersect in an extending direction thereof.

Abstract: A light emitting diode (LED) lamp includes a hollow connector, an LED module mounted on the connector, and a fin unit received in the connector. The connector has an inlet and an outlet couple to the inlet. Heat generated from the LED module is transferred to the connector to dissipate. The fan unit includes a first fan and a second fan rotating along contrary directions.

Abstract: A light emitting diode package includes a substrate, several light emitting diodes mounted on the substrate, and a package member enveloping the light emitting diodes. The light emitting diodes are electrically coupled to the substrate. The package member includes at least two layers, the first layer and the second layer. The first layer is spread on the substrate and completely covers the light emitting diodes and the wires. The second layer is formed on the first layer. Fluidity of colloid forming the second layer is worse than that of the first layer. A method is also provided to manufacture the present light emitting diode package.

Abstract: An light emitting diode (LED) module includes a circuit board, a plurality of LED chips arranged on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a plurality of first recesses defined in a first surface of the circuit board.

Abstract: An LED light bulb includes a holder for electrically connecting with a power source, an LED mounted on the holder, an envelope mounted on the holder and covering the LED, and a light dispersing plate attached to an inner surface of the envelope. The light dispersing plate is made of a transparent material with a plurality of irregular air bubbles therein. Light generated by the LED and radiating to the envelope is refracted, reflected and scattered by the bulbs before the light emits out of the LED light bulb.

Abstract: A light emitting diode package includes a substrate, several light emitting diodes mounted on the substrate, and a package member enveloping the light emitting diodes. The light emitting diodes are electrically coupled to the substrate. The package member includes at least two layers, the first layer and the second layer. The first layer is spread on the substrate and completely covers the light emitting diodes and the wires. The second layer is formed on the first layer. Fluidity of colloid forming the second layer is worse than that of the first layer. A method is also provided to manufacture the present light emitting diode package.

Abstract: A lens includes a substrate, a light concentrating portion mounted on the substrate. The substrate includes a first substrate and a second substrate, the light concentrating portion includes a first light concentrating portion and a second light concentrating portion. The first light concentrating portion extends outward from the first substrate, the second light concentrating portion extends outward from the second substrate. The first light concentrating portion has a first axis, the second light concentrating portion has a second axis. The first axis and the second axis are configured in an angle and intersect in an extending direction thereof.

Abstract: A reflector configured for reflecting light emitted from a light emitting diode (LED) toward a desired area is provided. The reflector defines a groove therein for accommodating the LED. Light emitted from the LED is reflected by an inner surface of the reflector toward a desired area located below the reflector, wherein the light reflected out of the reflector travels along a direction opposite to the main emitting direction of the LED. An LED illumination device incorporating the reflector is also provided.

Abstract: An light emitting diode (LED) module includes a circuit board, a set of LED chips formed on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a set of first recesses defined in a top surface of the encapsulant.

Abstract: An exemplary light emitting device includes a blue-green light source and a orange-red light source. The blue-green light source emits blue-green light and the orange-red light source emits orange-red light when they are activated. The blue-green light and the orange-red light are mixed together to obtain white light.

Abstract: An LED light emitting apparatus includes an LED light source, a light guiding device and an emitting window. The emitting window is covered with a phosphor layer. Light emitted directly from the LED light source is first transmitted to the light guiding device and then guided by the light guiding device towards the emitting window to evenly excite the phosphor layer.

Abstract: An LED lamp includes an envelope, a circuit board, a plurality of LEDs, a lamp body and a lamp holder. The LEDs are arranged on the circuit board. The envelope covers the LEDs. The lamp body is connected between the envelope and the lamp holder. The lamp body includes a first chamber and a second chamber. The lamp body defines therein a plurality of first channels and a second channels. The first channels are defined adjacent to the envelope. The second channels are defined in the vicinity of the lamp holder.

Abstract: A light emitting diode (LED) package includes a substrate with a flat top surface, an LED chip mounted on the substrate, and a group of blocking structure and encapsulation body. The LED chip electrically connects with the substrate. The blocking structure surrounds the LED chip. The encapsulation body covers the LED chip. A bottom of the encapsulation body is enclosed by the blocking structure; the encapsulation body has a light outputting surface, and an outer surface of the blocking structure is continuously connected with the light outputting surface. The light outputting surface has a semispherical profile. An angle between a normal line extending from the outer surface of the blocking structure and perpendicular to the substrate and a tangent line tangent to the light outputting surface at a point thereof adjacent to the outer surface is smaller than 60 degrees.