Abstract: A method for manufacturing a multichip module deposited substrate board utilizing alternating layers of high density thin-film metal and either preimidized or non-preimidized organic polymer insulating material wherein the insulating material is cured during manufacture using either ultraviolet radiation, ion beam radiation or electron beam radiation. This method eliminates subjecting the in-process substrate board to temperatures in excess of the recrystalization temperature of the thin-film metal, thereby eliminating the source of warpage and metal interdiffusion and corrosion at the metal to insulating material interface. This process enables successful manufacture of large format multichip module deposited substrate boards in sizes up to approximately 24 inches square.

Abstract: Optical waveguides for use in planar structures, such as dielectric layers in multichip modules exhibit low optical loss. The optical waveguides are provided by methods that involve doping of the dielectric layers. The waveguides can be used to interconnect electronic elements and transmit signals at speeds that are compatible with high speed electronic elements.

Abstract: A method of photolithographically patterning a layer of a dielectric composition including a photosensitive polyimide provides patterned dielectric features that have vertical wall profiles that are free of distortions normally associated with high temperature production conditions and shrinkage of the dielectric composition. The method is useful in the production of integrated circuits and high density multiconnect structures.

Abstract: Photosensitive polyimides used in microelectronic structures are cross-linked without exposing the associated microelectronic structures to elevated temperatures that can lower the process yield and reduce the reliability of the microelectronic structures. The photosensitive polyimides are cured by exposing them to deep ultraviolet radiation that has a spectral output effective to crosslink the polyimide. The cross-linking hardens the polyimide and renders it insoluble in solvents such as photoresist strippers.

Abstract: A zinc-based temporary electrical connection (e.g., a microfuse) useful in electroplating isolated conductor (i.e., copper) structures and copper/polyimide high-density interconnect structures are disclosed. The microfuse includes a zinc conductor layer, and in some embodiments, additional silicon adhesion and silicon protection layers. The microfuse is conductive, and therefore useful in an electroplating process, until it is treated (e.g., heated to about 400.degree. C. for one hour), to convert it into an insulator due to zinc oxidation, and remains in this state.