Patents by Inventor Chung-Pui CHAN
Chung-Pui CHAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11031521Abstract: The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate formed by thermally curable or photo-curable polyermic resin layer, and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.Type: GrantFiled: June 17, 2019Date of Patent: June 8, 2021Assignee: New Asia Group Holdings LimitedInventors: Chung Pui Chan, Wing Hong Choi, Chien Chung
-
Patent number: 11003290Abstract: A flexible transparent sensing film with embedded electrodes is described in the present invention, which would greatly improve the optical transmittance, electrical conductivity and reliability. The present sensing film can also simultaneously enable multiple touches for distinct locations sensing and at least another set of electrical signal sensing. The present sensing film includes a top conductive electrode, a bottom conductive electrode (140) and a dielectric substrate or a functional substrate that would generate electrical signal response due to a specific input such as motion, light, chemical, or temperature. The present sensing film apparatus could be configured to have the top and bottom conductive electrodes which are partially or fully embedded onto the surfaces of the dielectric and/or functional substrates.Type: GrantFiled: October 11, 2018Date of Patent: May 11, 2021Assignee: New Asia Group Holdings LimitedInventors: Chung Pui Chan, Wing Hong Choi, Lai Fan Lai, Chien Chung
-
Publication number: 20200348775Abstract: The present invention provides a novel structure for a weathering-resistant transparent conductive film (TCF) which can be applied on most kinds of flexible electronics, telecommunication components, smart-window, sensing film, optoelectronic devices or display panel, etc. The present weathering-resistant TCF includes at least one transparent substrate, a deformable layer and a multi-layered conductive structure having a high aspect ratio being integrated into the deformable layer forming an enveloped structure such that at least one surface of the conductive network being exposed out of the surface. The enveloped TCF structure enables protection of the underneath conductive layer such that the present weathering-resistant TCF can withstand in extreme temperature, humidity and corrosive environment. The present invention also relates to methods of fabricating a weathering-resistant TCF, which facilitates large area thin film fabrication and large scale production.Type: ApplicationFiled: May 15, 2020Publication date: November 5, 2020Inventors: Chung Pui CHAN, Wing Hong CHOI, Chien CHUNG
-
Publication number: 20200233508Abstract: A flexible transparent sensing film with embedded electrodes is described in the present invention, which would greatly improve the optical transmittance, electrical conductivity and reliability. The present sensing film can also simultaneously enable multiple touches for distinct locations sensing and at least another set of electrical signal sensing. The present sensing film includes a top conductive electrode, a bottom conductive electrode (140) and a dielectric substrate or a functional substrate that would generate electrical signal response due to a specific input such as motion, light, chemical, or temperature. The present sensing film apparatus could be configured to have the top and bottom conductive electrodes which are partially or fully embedded onto the surfaces of the dielectric and/or functional substrates.Type: ApplicationFiled: October 11, 2018Publication date: July 23, 2020Inventors: Chung Pui CHAN, Wing Hong CHOI, Lai Fan LAI, Chien CHUNG
-
Patent number: 10572089Abstract: A flexible transparent sensing film with embedded electrodes is described in the present invention, which would greatly improve the optical transmittance, electrical conductivity and reliability. The present sensing film can also simultaneously enable multiple touches for distinct locations sensing and at least another set of electrical signal sensing. The present sensing film includes a top conductive electrode, a bottom conductive electrode and a dielectric substrate or a functional substrate that would generate electrical signal response due to a specific input such as motion, light, chemical, or temperature. The present sensing film apparatus could be configured to have the top and bottom conductive electrodes which are partially or fully embedded onto the surfaces of the dielectric and/or functional substrates.Type: GrantFiled: September 29, 2018Date of Patent: February 25, 2020Assignees: MIND TECHNOLOGY DEVELOPMENT LIMITED, NEW ASIA GROUP HOLDINGS LIMITEDInventors: Chung Pui Chan, Wing Hong Choi, Lai Fan Lai, Kwok Keung Paul Ho, Chien Chung
-
Publication number: 20190334055Abstract: The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate formed by thermally curable or photo-curable polyermic resin layer, and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.Type: ApplicationFiled: June 17, 2019Publication date: October 31, 2019Inventors: Chung Pui CHAN, Wing Hong CHOI, Chien CHUNG
-
Patent number: 10329660Abstract: The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate, a deformable layer and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.Type: GrantFiled: July 12, 2017Date of Patent: June 25, 2019Assignees: MIND TECHNOLOGY DEVELOPMENT LIMITED, NEW ASIA GROUP HOLDINGS LIMITEDInventors: Chung Pui Chan, Lai Fan Lai, Wing Hong Choi, Bin Zhang, Kwok Keung Paul Ho, Chien Chung, Chun Pong Lee
-
Publication number: 20190034008Abstract: A flexible transparent sensing film with embedded electrodes is described in the present invention, which would greatly improve the optical transmittance, electrical conductivity and reliability. The present sensing film can also simultaneously enable multiple touches for distinct locations sensing and at least another set of electrical signal sensing. The present sensing film includes a top conductive electrode, a bottom conductive electrode and a dielectric substrate or a functional substrate that would generate electrical signal response due to a specific input such as motion, light, chemical, or temperature. The present sensing film apparatus could be configured to have the top and bottom conductive electrodes which are partially or fully embedded onto the surfaces of the dielectric and/or functional substrates.Type: ApplicationFiled: September 29, 2018Publication date: January 31, 2019Inventors: Chung Pui CHAN, Wing Hong CHOI, Lai Fan LAI, Kwok Keung Paul HO, Chien Chung
-
Patent number: 10103282Abstract: The present invention provides transparent semiconducting films for constructing a translucent electrode that possess a high transparency and low sheet resistance. Further, the transparent semiconducting films have a high light diffusion property, which is capable to be a translucent front/back electrode in a light-emitting device for improving the light emission efficiency and a front/intermediate/back electrode in a multi-junction solar cell for improving the light trapping effect. Related fabrication method and how they are applied in different fields are also provided in the present invention.Type: GrantFiled: September 13, 2017Date of Patent: October 16, 2018Assignee: Nano and Advanced Materials Institute LimitedInventors: Chung Pui Chan, Wing Hong Choi, Kwok Keung Paul Ho
-
Publication number: 20180291498Abstract: The present invention provides a transparent conductive thin film which is flexible for suiting substantially all kinds of electronic and optoelectronic devices or display panel. The present conductive thin film includes at least one transparent substrate, a deformable layer and a conductive network pattern having a high aspect ratio such that at least one surface of the conductive network being exposed out of the deformable layer or the transparent substrate for contacting with an external structure while a large proportion thereof stays firmly integrated into the substrate. The present invention also relates to methods of fabricating a transparent conductive thin film including the structural features of the transparent conductive thin film of the present invention. Various optimizations of the present methods are also provided in the present invention for facilitating large area thin film fabrication and large scale production.Type: ApplicationFiled: July 12, 2017Publication date: October 11, 2018Inventors: Chung Pui Chan, Lai Fan Lai, Wing Hong Choi, Bin Zhang, Kwok Keung Paul Ho, Chien Chung, Chun Pong Lee
-
Publication number: 20180248178Abstract: Disclosed are composite anodes for a lithium ion battery containing carbon material core particles and a coating layer of LTO particles over the carbon material core particles, the coating layer of LTO particles at least partially covering the carbon material core particles. Also disclosed are anodes for a lithium ion battery containing activating treated surface modified graphite particles, wherein at least one of an inorganic acid or an oxidizing agent is used to treat and modify the surface of the graphite particles.Type: ApplicationFiled: February 24, 2017Publication date: August 30, 2018Inventors: Chung Pui Chan, Yeming Xu, Chao Cai, Kowk Keung Paul Ho
-
Publication number: 20180083161Abstract: The present invention provides transparent semiconducting films for constructing a translucent electrode that possess a high transparency and low sheet resistance. Further, the transparent semiconducting films have a high light diffusion property, which is capable to be a translucent front/back electrode in a light-emitting device for improving the light emission efficiency and a front/intermediate/back electrode in a multi-junction solar cell for improving the light trapping effect. Related fabrication method and how they are applied in different fields are also provided in the present invention.Type: ApplicationFiled: September 13, 2017Publication date: March 22, 2018Inventors: Chung Pui CHAN, Wing Hong CHOI, Kwok Keung Paul HO
-
Publication number: 20130042914Abstract: A solar cell including an upconverting luminescent material and a back reflecting layer is provided. The upconverting material can be located in any positions below the semiconductor layer of the solar cell. Therefore, the unabsorbed incident light, from the top direction, can be upconverted to light with shorter wavelengths and redirected by the back reflecting layer back to the semiconductor layer to increase the utilization rate of the incident light.Type: ApplicationFiled: August 19, 2011Publication date: February 21, 2013Applicant: Du Pont Apollo LimitedInventors: Chung-Pui CHAN, Hsieh-Hsin Yeh
-
Publication number: 20120192912Abstract: A solar cell array and a solar cell module with an extended area (Generally by increasing the width) active subcell are described. The solar cell array includes a fixing beam, at least one solar cell module and a fixing clip for fixing the at least one solar cell module on the fixing beam. The solar cell module further includes a dummy area formed on an edge of the solar cell module, a first active subcell formed next to the dummy area, and a second active subcell formed next to the first active subcell. The area of the first active subcell is larger than the area of the second active subcell to compensate for an area of the fixing clip overlapping on the first active subcell.Type: ApplicationFiled: January 28, 2011Publication date: August 2, 2012Applicant: Du Pont Apollo LimitedInventors: Hsieh-Hsin YEH, Chung-Pui Chan
-
Publication number: 20120171800Abstract: A method of sealing an electronic device is disclosed, comprising providing an assembly comprising first and second substrates in an opposed relationship, and an electronic device positioned between the first and second substrates; positioning a glass rod against or on the edge of the first and/or second substrate; and heating and softening the glass rod to form a hermetic seal between the first and second substrates and form a hermetically sealed electronic device.Type: ApplicationFiled: December 30, 2010Publication date: July 5, 2012Applicant: DU PONT APOLLO Ltd.Inventors: Stephen Yau Sang Cheng, Chui-Ling Yip, Chung-Pui Chan
-
Publication number: 20120049310Abstract: A thin film photoelectric conversion module is provided. The thin film photoelectric conversion module includes a substrate and a plurality of photoelectric conversion cells formed on the substrate and connected to each other in series to form a series-connected array. The thin film photoelectric conversion module further comprises a plurality of first electrode rows extending along a current flow direction and a resistive material electrically connected to adjacent two of the first electrode rows, wherein the resistive material has an electrical resistivity no less than 10?9 ohm-cm, wherein when the resistive material is a material different from that of the first electrode rows, the resistive material makes adjacent two of the first electrode rows at least partially connected, and when the resistive material is a material the same as that of the first electrode rows, the resistive material makes adjacent two of the first electrode rows partially connected.Type: ApplicationFiled: August 30, 2011Publication date: March 1, 2012Applicant: Du Pont Apollo LimitedInventors: Jia-Wei MA, Chung-Pui Chan, Tze-Kin Yuen, Hsieh-Hsin Yeh, Chen-Pang Fu, Hi-Ki Lam, Wa-Sze Tsang, Yang-Yang Zhou, Chi-Chiu Leung
-
Publication number: 20120000505Abstract: A thin film photoelectric conversion module is provided. The thin film photoelectric conversion module comprises a back electrode layer, a plurality of thin film photoelectric conversion cells, a front electrode layer and a plurality of opaque materials. The thin film photoelectric conversion cells are disposed on the back electrode layer in parallel to each other in a lengthwise direction. The front electrode layer is disposed on the thin film photoelectric conversion cells. Each of the opaque materials is disposed on a light-receiving surface of the front electrode layer and is traversing the thin film photoelectric conversion cells in a traversing direction to separate the thin film photoelectric conversion cells into a plurality of sub-arrays. In each of the sub-arrays, the thin film photoelectric conversion cells are connected in series along the traversing direction.Type: ApplicationFiled: July 1, 2011Publication date: January 5, 2012Applicant: Du Pont Apollo LimitedInventors: Chung-Pui CHAN, Hsieh-Hsin YEH