Abstract: A semiconductor structure includes a die embedded in a molding material, the die having die connectors on a first side; a first redistribution structure at the first side of the die, the first redistribution structure being electrically coupled to the die through the die connectors; a second redistribution structure at a second side of the die opposing the first side; and a thermally conductive material in the second redistribution structure, the die being interposed between the thermally conductive material and the first redistribution structure, the thermally conductive material extending through the second redistribution structure, and the thermally conductive material being electrically isolated.

Abstract: A method and apparatus for simulating the functioning of various configurations of fabrication and test equipment within a manufacturing line creates a schedule for dispatching of the production lots to the manufacturing line. Based on the product mix forecast, the product volume forecast, the predicted sales schedule, the sales confidence, the actual sales order descriptions, and the product delivery schedule, a potential product dispatch schedule is established that enables a product to be fabricated within the manufacturing line. An equipment dispatch schedule for equipment employed in fabrication and testing of the product to be fabricated is defined according to the product dispatch schedule. The potential product dispatch schedule is then simulated based on the process and test equipment model. Upon completion of the simulation, the potential product dispatch schedule is assessed for optimization.