Patents by Inventor Chung-Sheng Yuan
Chung-Sheng Yuan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240055424Abstract: A semiconductor structure includes a substrate and a stack of p-n junction structures embedded in the substrate. The semiconductor structure includes a semiconductor fin protruding from the substrate. The semiconductor structure includes a pair of source/drain structures disposed in the semiconductor fin. The semiconductor structure includes a gate structure over a channel region of the semiconductor fin and interposed between the pair of source/drain structures.Type: ApplicationFiled: February 7, 2023Publication date: February 15, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Chung Chen, Zi-Ang Su, Bo-Ting Chen, Chung-Sheng Yuan, Yi-Kan Cheng
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Publication number: 20230378054Abstract: A semiconductor cell structure includes a first complementary metal oxide silicon (CMOS) a second CMOS, a first conducting element, and a second conducting element. The first and second CMOSs are disposed on the substrate and a reference voltage is provided to the first CMOS and the second CMOS respectively through the first conducting element and the second conducting element. A product of a width of the first conducting element multiplied by a channel length of the first CMOS is positively related to a product of a width of the second conducting element multiplied by a channel length of the second CMOS.Type: ApplicationFiled: January 4, 2023Publication date: November 23, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chia-Chung CHEN, Wen-Shen CHOU, Yung-Chow PENG, Chung-Sheng YUAN, Yi-Kan CHENG
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Patent number: 11585831Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.Type: GrantFiled: August 18, 2020Date of Patent: February 21, 2023Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh, Chin-Chou Liu, Yun-Han Lee, Hung-Chih Lin
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Publication number: 20200379013Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.Type: ApplicationFiled: August 18, 2020Publication date: December 3, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh, Chin-Chou Liu, Yun-Han Lee, Hung-Chih Lin
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Patent number: 10782318Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.Type: GrantFiled: October 20, 2017Date of Patent: September 22, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh, Chin-Chou Liu, Yun-Han Lee, Hung-Chih Lin
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Patent number: 9952279Abstract: A three-dimensional integrated circuit testing apparatus comprises a probe card configured to couple a device-under-test of a three-dimensional integrated circuit with an automatic testing equipment board having a plurality of testing modules, wherein the probe card comprises a plurality of known good dies of the three-dimensional integrated circuit, a plurality of interconnects of the three-dimensional integrated circuit and a plurality of probe contacts, wherein the probe contacts are configured to couple the probe card with testing contacts of the device-under-test of the three-dimensional integrated circuit.Type: GrantFiled: December 21, 2012Date of Patent: April 24, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Hao Chen, Chung-Han Huang, Chung-Sheng Yuan, Ching-Fang Chen, Wen-Wen Hsieh, Meng-Lin Chung
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Publication number: 20180038894Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.Type: ApplicationFiled: October 20, 2017Publication date: February 8, 2018Inventors: Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh, Chin-Chou Liu, Yun-Han Lee, Hung-Chih Lin
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Patent number: 9817029Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.Type: GrantFiled: December 7, 2011Date of Patent: November 14, 2017Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mill-Jer Wang, Ching-Fang Chen, Sandeep Kumar Goel, Chung-Sheng Yuan, Chao-Yang Yeh, Chin-Chou Liu, Yun-Han Lee, Hung-Chih Lin
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Patent number: 9704766Abstract: An interposer of a package system includes a first probe pad disposed adjacent to a first surface of the interposer. A second probe pad is disposed adjacent to the first surface of the interposer. A first bump of a first dimension is disposed adjacent to the first surface of the interposer. The first bump is electrically coupled with the first probe pad. A second bump of the first dimension is disposed adjacent to the first surface of the interposer. The second bump is electrically coupled with the second probe pad. The second bump is electrically coupled with the first bump through a redistribution layer (RDL) of the interposer.Type: GrantFiled: May 27, 2011Date of Patent: July 11, 2017Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Sandeep Kumar Goel, Mill-Jer Wang, Chung-Sheng Yuan, Tom Chen, Chao-Yang Yeh, Chin-Chou Liu, Yun-Han Lee
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Patent number: 9613174Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.Type: GrantFiled: April 6, 2015Date of Patent: April 4, 2017Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Lee, Chung-Sheng Yuan, Chao-Yang Yeh, Wei-Cheng Wu, Ching-Fang Chen
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Publication number: 20150213182Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.Type: ApplicationFiled: April 6, 2015Publication date: July 30, 2015Inventors: William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Lee, Chung-Sheng Yuan, Chao-Yang Yeh, Wei-Cheng Wu, Ching-Fang Chen
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Patent number: 9003338Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.Type: GrantFiled: March 15, 2013Date of Patent: April 7, 2015Assignee: Taiwan Semiconductor Manufacturing Company LimitedInventors: William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Lee, Chung-Sheng Yuan, Chao-Yang Yeh, Wei-Cheng Wu, Ching-Fang Chen
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Publication number: 20140282305Abstract: One or more techniques or systems for incorporating a common template into a system on chip (SOC) design are provided herein. For example, a common template mask set is generated based on a first set of polygon positions from a first vendor and a second set of polygon positions from a second vendor. A third party creates a third party SOC design using a set of design rules generated based on the common template mask set. The common template is fabricated based on the third party SOC design using the common template mask set. Because the common template is formed using the common template mask set and because the common template mask set is based on polygon positions from both the first vendor and the second vendor, a part can be connected to the SOC regardless of whether the part is sourced from the first vendor or the second vendor.Type: ApplicationFiled: March 15, 2013Publication date: September 18, 2014Applicant: Taiwan Semiconductor Manufacturing Company LimitedInventors: William Wu Shen, Yun-Han Lee, Chin-Chou Liu, Hsien-Hsin Lee, Chung-Sheng Yuan, Chao-Yang Yeh, Wei-Cheng Wu, Ching-Fang Chen
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Publication number: 20130147505Abstract: A testing probe structure for wafer level testing semiconductor IC packaged devices under test (DUT). The structure includes a substrate, through substrate vias, a bump array formed on a first surface of the substrate for engaging a probe card, and at least one probing unit on a second surface of the substrate. The probing unit includes a conductive probe pad formed on one surface of the substrate and at least one microbump interconnected to the pad. The pads are electrically coupled to the bump array through the vias. Some embodiments include a plurality of microbumps associated with the pad which are configured to engage a mating array of microbumps on the DUT. In some embodiments, the DUT may be probed by applying test signals from a probe card through the bump and microbump arrays without direct probing of the DUT microbumps.Type: ApplicationFiled: December 7, 2011Publication date: June 13, 2013Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Mill-Jer WANG, Ching-Fang CHEN, Sandeep Kumar GOEL, Chung-Sheng YUAN, Chao-Yang YEH, Chin-Chou LIU, Yun-Han LEE, Hung-Chih LIN
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Publication number: 20120273782Abstract: An interposer of a package system includes a first probe pad disposed adjacent to a first surface of the interposer. A second probe pad is disposed adjacent to the first surface of the interposer. A first bump of a first dimension is disposed adjacent to the first surface of the interposer. The first bump is electrically coupled with the first probe pad. A second bump of the first dimension is disposed adjacent to the first surface of the interposer. The second bump is electrically coupled with the second probe pad. The second bump is electrically coupled with the first bump through a redistribution layer (RDL) of the interposer.Type: ApplicationFiled: May 27, 2011Publication date: November 1, 2012Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Sandeep Kumar GOEL, Mill-Jer WANG, Chung-Sheng YUAN, Tom CHEN, Chao-Yang YEH, Chin-Chou LIU, Yun-Han LEE
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Patent number: 8276110Abstract: A method of designing an integrated circuit includes providing an integrated circuit design including a power network. A voltage drop mitigation system is provided, which includes a power strap enhancer configured to automatically find a source node and a terminal node in the power network. A redundant strap for the power network using the voltage drop mitigation system is added, wherein the redundant strap interconnects the source node and the terminal node. After the step of adding the redundant strap, dummy patterns may be added.Type: GrantFiled: January 22, 2010Date of Patent: September 25, 2012Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Dinesh Baviskar, Wen-Hao Chen, Chung-Sheng Yuan, Mark Shane Peng, Yun-Han Lee
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Publication number: 20110185331Abstract: A method of designing an integrated circuit includes providing an integrated circuit design including a power network. A voltage drop mitigation system is provided, which includes a power strap enhancer configured to automatically find a source node and a terminal node in the power network. A redundant strap for the power network using the voltage drop mitigation system is added, wherein the redundant strap interconnects the source node and the terminal node. After the step of adding the redundant strap, dummy patterns may be added.Type: ApplicationFiled: January 22, 2010Publication date: July 28, 2011Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Dinesh Baviskar, Wen-Hao Chen, Chung-Sheng Yuan, Mark Shane Peng, Yun-Han Lee