Patents by Inventor Chung Sheung Yung
Chung Sheung Yung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11776930Abstract: A die bond head apparatus has a die bond head body coupled to a die bond head motion table, a die holder motion table mounted on the die bond head body and a die holder which is operative in use to secure a semiconductor die to a substrate. The die holder is positionable by the die holder motion table independently of the die bond head motion table.Type: GrantFiled: December 16, 2019Date of Patent: October 3, 2023Assignee: ASMPT SINGAPORE PTE. LTD.Inventors: Chung Sheung Yung, Pak Kin Leung
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Publication number: 20210183809Abstract: A die bond head apparatus has a die bond head body coupled to a die bond head motion table, a die holder motion table mounted on the die bond head body and a die holder which is operative in use to secure a semiconductor die to a substrate. The die holder is positionable by the die holder motion table independently of the die bond head motion table.Type: ApplicationFiled: December 16, 2019Publication date: June 17, 2021Inventors: Chung Sheung YUNG, Pak Kin LEUNG
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Patent number: 10861819Abstract: After a die is picked up with a bond head, a first optical system views and determines a position and orientation of the die relative to the bond head. Separately, a second optical system views and determines a position and orientation of the bonding location when the second optical system has its focal plane configured at a first distance from the second optical system. After the bond head is moved adjacent to the second optical system, the second optical system views and determines a position and orientation of the bond head when the second optical system has its focal plane configured at a second distance from the second optical system. The position and orientation of the die may then be adjusted to correct a relative offset between the die and the bonding location prior to depositing the die onto the bonding location.Type: GrantFiled: July 5, 2019Date of Patent: December 8, 2020Assignee: ASM TECHNOLOGY SINGAPORE PTE LTDInventors: Jiangwen Deng, Chung Sheung Yung, Wui Fung Sze
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Patent number: 8875979Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.Type: GrantFiled: May 4, 2012Date of Patent: November 4, 2014Assignee: ASM Technology Singapore Pte. Ltd.Inventors: Chung Sheung Yung, Chi Ming Chong, Gary Peter Widdowson
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Patent number: 8733539Abstract: A vibration feeding apparatus comprises a receptacle for holding and conveying components, and first and second linear motors coupled to the receptacle. The first and second linear motors are spaced from each other and have respective coils that are aligned parallel to each other. The first and second linear motors are operative to be driven at a first operation mode whereby to impart rotary vibration to the receptacle, and at a second operation mode whereby to impart linear vibration to the receptacle.Type: GrantFiled: April 17, 2012Date of Patent: May 27, 2014Assignee: ASM Technology Singapore Pte LtdInventors: Ping Kong Choy, Chung Sheung Yung, Ho Chi Wong, Chung Yin Lau
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Publication number: 20130292454Abstract: Disclosed is an apparatus for determining an alignment of a bondhead of a die bonder relative to a workchuck. Specifically, the apparatus comprises: i) a sensor configured to measure a distance between the bondhead and the sensor; and ii) a positioning device coupled to the sensor, the positioning device being configured to position the sensor relative to a plurality of locations on the bondhead facing the sensor. In particular, the sensor is operative to measure a set of distances between each of the plurality of locations on the bondhead and the sensor, the set of distances being for determining the alignment of the bondhead. A method of determining an alignment of a bondhead of a die bonder relative to a workchuck is also disclosed.Type: ApplicationFiled: May 4, 2012Publication date: November 7, 2013Applicant: ASM TECHNOLOGY SINGAPORE PTE. LTD.Inventors: Chung Sheung YUNG, Chi Ming CHONG, Gary Peter WIDDOWSON
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Publication number: 20130270070Abstract: A vibration feeding apparatus comprises a receptacle for holding and conveying components, and first and second linear motors coupled to the receptacle. The first and second linear motors are spaced from each other and have respective coils that are aligned parallel to each other. The first and second linear motors are operative to be driven at a first operation mode whereby to impart rotary vibration to the receptacle, and at a second operation mode whereby to impart linear vibration to the receptacle.Type: ApplicationFiled: April 17, 2012Publication date: October 17, 2013Inventors: Ping Kong CHOY, Chung Sheung YUNG, Ho Chi WONG, Chung Yin LAU
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Patent number: 8387851Abstract: An apparatus for aligning a bonding tool of a die bonder with respect to a bond stage is disclosed. The apparatus comprises: a connecting member to which the bonding tool is coupleable such that the connecting member is located between the bonding tool and a main body of a die bonder; and a plurality of actuators engaged to the connecting member. In particular, the plurality of actuators are actuable to rotate the connecting member and the bonding tool relative to the main body of the die bonder about a plurality of axes, to align the bonding tool with respect to the bond stage.Type: GrantFiled: May 4, 2012Date of Patent: March 5, 2013Assignee: ASM Technology Singapore Pte. Ltd.Inventors: Chung Sheung Yung, Shing Lui Lau, Chi Ming Chong, Gary Peter Widdowson
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Patent number: 8256103Abstract: A die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted includes a pick-and-place tool movable along a pick-up axis for picking up the die from the adhesive tape and a die ejector comprising an ejector shaft including an ejector pin. The ejector pin is movable parallel to the pick-up axis to raise the die from the adhesive tape to facilitate pick-up of the die by the pick-and-place tool. At least one movable table to which the ejector shaft is operatively coupled is actuable by at least one piezoelectric actuator which is connected to the movable table via a flexure. Actuation by the piezoelectric actuator forces the movable table and ejector shaft to move in directions which are perpendicular to the pick-up axis for alignment of the ejector pin with the die pick-up tool along the pick-up axis.Type: GrantFiled: March 5, 2010Date of Patent: September 4, 2012Assignee: ASM Assembly Automation LtdInventors: Ping Kong Choy, Chung Sheung Yung, Hon Yu Ng
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Publication number: 20110214282Abstract: A die detachment apparatus for detaching a die from an adhesive tape on which the die is mounted includes a pick-and-place tool movable along a pick-up axis for picking up the die from the adhesive tape and a die ejector comprising an ejector shaft including an ejector pin. The ejector pin is movable parallel to the pick-up axis to raise the die from the adhesive tape to facilitate pick-up of the die by the pick-and-place tool. At least one movable table to which the ejector shaft is operatively coupled is actuable by at least one piezoelectric actuator which is connected to the movable table via a flexure. Actuation by the piezoelectric actuator forces the movable table and ejector shaft to move in directions which are perpendicular to the pick-up axis for alignment of the ejector pin with the die pick-up tool along the pick-up axis.Type: ApplicationFiled: March 5, 2010Publication date: September 8, 2011Inventors: Ping Kong CHOY, Chung Sheung YUNG, Hon Yu NG
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Patent number: 7845543Abstract: An apparatus for bonding dice onto one or more substrates placed on a base comprises a first bond head and a second bond head. Each bond head incorporates a bonding tool which is configured for holding a die and both bond heads are driven by at least one linear motion actuator towards the substrate. The first and second bond heads are mounted on a stand and each comprises a locking mechanism which is operative to lock the bond head to the stand, and a compliant mechanism that is actuable to exert a bonding force on the bonding tool to bond each die to the substrate after the bond head has been locked to the stand.Type: GrantFiled: November 17, 2009Date of Patent: December 7, 2010Assignee: ASM Assembly Automation LtdInventors: Chung Sheung Yung, Ping Kong Choy, Hon Yu Ng
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Patent number: 7649333Abstract: A damping apparatus is provided for a positioning stage that is operative to move and position an object along a motion axis. The damping apparatus comprises a motion transformation device operative to rotate the positioning stage about a rotary axis that is substantially perpendicular to the motion axis, in response to forces generated to the positioning stage during acceleration or deceleration thereof. Resilient elements connected to the positioning stage serve to reduce transmission of vibration generated from the positioning stage.Type: GrantFiled: January 15, 2007Date of Patent: January 19, 2010Assignee: ASM Assembly Automation Ltd.Inventors: Ping Kong Joseph Choy, Siu Wing Or, Chung Sheung Yung, Chou Kee Peter Liu, Lai Wa Helen Chan-Wong
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Patent number: 7462960Abstract: An ultrasonic transducer driver has a giant magnetostrictive element, a fastener for holding the giant magnetostrictive element under mechanical pressure, a first field generator for providing a magnetic bias field, a second field generator for providing a magnetic drive field and a magnetic circuit for channelling the magnetic fields in the magnetostrictive element. An ultrasonic transducer for a bonding apparatus has a horn having a bonding tool at its smaller end and a mounting barrel adjoined onto it. The driver coupled to the larger end of the horn.Type: GrantFiled: January 5, 2004Date of Patent: December 9, 2008Assignee: The Hong Kong Polytechnic UniversityInventors: Siu Wing Or, Chung Sheung Yung, Helen Lai Wa Chan-Wong
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Publication number: 20080169781Abstract: A damping apparatus is provided for a positioning stage that is operative to move and position an object along a motion axis. The damping apparatus comprises a motion transformation device operative to rotate the positioning stage about a rotary axis that is substantially perpendicular to the motion axis, in response to forces generated to the positioning stage during acceleration or deceleration thereof. Resilient elements connected to the positioning stage serve to reduce transmission of vibration generated from the positioning stage.Type: ApplicationFiled: January 15, 2007Publication date: July 17, 2008Inventors: Ping Kong Joseph CHOY, Siu Wing OR, Chung Sheung YUNG, Chou Kee Peter LIU, Lai Wa Helen CHAN-WONG