Abstract: A device may generate, using a random telegraph signal (RTS) noise generator, a simulated RTS noise as input to a transistor included in an electronic circuit. The device may determine, based on the simulated RTS noise input to the transistor, a simulated output signal from the transistor.

Abstract: One or more circuit arrangements and techniques for modeling are provided. In some embodiments, a circuit arrangement includes at least one of a first current source, a second current source, a first diode, a second diode, and a switching component. In some embodiments, the switching component includes a bipolar junction transistor (BJT). In some embodiments, the circuit arrangement is integrated into a metal oxide semiconductor (MOS) device. When the circuit arrangement is integrated into a MOS device, at least one of a substrate current leakage, a junction breakdown, or a diode reverse recovery (DRR) effect is predictable for the MOS device.

Abstract: In some embodiments, in a method, a netlist is received. The netlist comprises a subcircuit that comprises a device and a rule check module. The rule check module specifies a plurality of terminals of the device subject to an operating space, and at least one parameter that controls a non-rectangular boundary of the operating space. The netlist is simulated to obtain simulation data associated with the terminals of the device. The operating space that has the non-rectangular boundary is formed by using the at least one parameter. The simulation data is checked against the operating space. A situation in which the checked simulation data does not fall within the operating space is reflected.

Abstract: In some embodiments, in a method, a netlist is received. The netlist comprises a subcircuit that comprises a device and a rule check module. The rule check module specifies a plurality of terminals of the device subject to an operating space, and at least one parameter that controls a non-rectangular boundary of the operating space. The netlist is simulated to obtain simulation data associated with the terminals of the device. The operating space that has the non-rectangular boundary is formed by using the at least one parameter. The simulation data is checked against the operating space. A situation in which the checked simulation data does not fall within the operating space is reflected.

Abstract: One or more circuit arrangements and techniques for modeling are provided. In some embodiments, a circuit arrangement includes at least one of a first current source, a second current source, a first diode, a second diode, and a switching component. In some embodiments, the switching component includes a bipolar junction transistor (BJT). In some embodiments, the circuit arrangement is integrated into a metal oxide semiconductor (MOS) device. When the circuit arrangement is integrated into a MOS device, at least one of a substrate current leakage, a junction breakdown, or a diode reverse recovery (DRR) effect is predictable for the MOS device.

Abstract: Each of a method for determining a parasitic capacitance and an apparatus for determining the parasitic capacitance provides for an experimental correlation within a parasitic capacitance model of a series of conductor layer nominal dimensions and spacings with a process related deviation to provide a series of conductor layer actual dimensions and spacings. The method and the apparatus further provide for determining the parasitic capacitance while employing the conductor layer actual dimensions and spacings. The parasitic capacitance is thus determined with enhanced accuracy.

Abstract: A method of characterizing gate leakage current in the fabrication of integrated circuits is described. A MOSFET model is provided including a gate electrode deposed over a gate oxide layer on a substrate and source and drain regions associated with the gate electrode. Device current is measured at four terminals simultaneously wherein one of the terminals is a drain terminal. The other terminals are the source, gate, and substrate. The portion of the device current measured at the drain terminal that is contributed by gate current is evaluated. The evaluated gate current contribution is subtracted from the drain terminal current measurement to obtain pure drain current. Fitting procedures are performed to obtain curves for the device currents. The pure drain current is used to extract mobility model parameters.

Abstract: Each of a method for determining a parasitic capacitance and an apparatus for determining the parasitic capacitance provides for an experimental correlation within a parasitic capacitance model of a series of conductor layer nominal dimensions and spacings with a process related deviation to provide a series of conductor layer actual dimensions and spacings. The method and the apparatus further provide for determining the parasitic capacitance while employing the conductor layer actual dimensions and spacings. The parasitic capacitance is thus determined with enhanced accuracy.