Abstract: Methods and apparatus for enabling data transmission using HARQ in IEEE 802.11 systems are described. A method is disclosed, performed by a transmitting device, comprising computing a plurality of redundancy frames based on a plurality of data frames, transmitting the plurality of data frames to a receiving device, and transmitting a set of the plurality of redundancy frames to the receiving device determined by the transmitting device in response to receiving acknowledgement. One embodiment includes a method determining failed data frames of the plurality of data frames, requesting a set of the plurality of redundancy frames, and recovering the failed data frame using a decoder employing hard decision inputs. Other embodiments include an apparatus in a receiver device implementing the method of decoding the failed data frames using a decoder employing soft decision inputs.

Abstract: Disclosed is a method of patterning a layered material. A layered material is provided, and a photoresist layer is formed thereon. The photoresist layer is patterned by a focused laser beam to expose a part of the layered material. The exposed layered material is etched to pattern the layered material.

Abstract: Disclosed is a method of patterning a layered material. A layered material is provided, and a photoresist layer is formed thereon. The photoresist layer is patterned by a focused laser beam to expose a part of the layered material. The exposed layered material is etched to pattern the layered material.

Abstract: A method and a mechanism for nano scale patterns with high aspect ratios etched on both photoresist layers and a carrier substrate and uses two complementary photoresist layers as an etch mask and the laser direct-write lithography technology to quickly fabricate large-size & nano scale patterns features (1) inorganic photoresist as material of a first layer of photoresist for nano scale patterns defined by laser beam direct-write lithography and (2) polymeric organic photoresist as material of a second layer of photoresist to thicken an etch mask because of effect of oxygen plasma, which has a higher etching rate on a polymeric organic photoresist layer but a lower one on an inorganic photoresist layer. For various materials of carrier substrates applied to the present invention, there are several types of Inductively Coupled Plasma-Reactive Ion Etching technologies available for nano scale patterns continuously transferred to a carrier substrate.

Abstract: A method for fabricating a roller mold is provided, including providing a roller substrate, wherein the roller substrate is a cylinder and has a curved surface. An inorganic resist layer is formed over the curved surface of the roller substrate. A laser exposure device is provided for irradiating the inorganic resist layer with a focused laser, causing phase change of the inorganic resist layer at exposed regions. The inorganic resist layer in the exposed regions is removed to form a nano-pattern over the roller substrate.

Abstract: A recording layer including a novel organic compound for a high density optical recording medium is provided. The information may be recorded on the recording layer at a 2× speed or higher speed with a relatively lower writing power so that heat distribution of the recording layer in the irradiated area is not likely to become steep both in time and space. The organic compound incorporated in the recording layer has the following general chemical structural formula (I).

Abstract: A recording layer including a novel organic dye compound (I) for a high density optical recording medium is provided. The organic dye compound (I) has the following general chemical structural formula: wherein [A]+ includes alkaline metal ion, wherein R1, R2, R3, R4, R5 and R6 each independently represent hydrogen, straight or branched C1-8 alkyl, C1-3 alkoxyl, halogen, nitro, benzyl group or substituted benzyl group wherein a substituent thereof is C1-2 alkyl, C1-2 alkoxyl, halogen or nitro. The organic dye compound (I) exhibits a maximum absorbance at a wavelength range of 400-550 nm.

Abstract: A recording layer including a novel organic dye compound (I) for a high density optical recording medium is provided. The organic dye compound (I) has the following general chemical structural formula: wherein R1, R2, R3, R4 and R5 each independently represent H, alkyl, halide, nitro, benzyl group or substituted benzyl group. The organic dye compound (I) exhibits a maximum absorbance at a wavelength range of 400-550 nm.

Abstract: A recording layer including a novel organic compound for a high density optical recording medium is provided. The information may be recorded on the recording layer at a 2× speed or higher speed with a relatively lower writing power so that heat distribution of the recording layer in the irradiated area is not likely to become steep both in time and space.

Abstract: A recording layer including a novel organic compound for a high density optical recording medium is provided. The information may be recorded on the recording layer at a 2× speed or higher speed with a relatively lower writing power so that heat distribution of the recording layer in the irradiated area is not likely to become steep both in time and space. The organic compound incorporated in the recording layer has the following general chemical structural formula (I).

Abstract: An inorganic resist material is provided, which is an incomplete oxide of a phase-change material. The oxygen content in the inorganic resist material is lower than the stoichiometric oxygen content of a complete oxide of the phase-change material, and a general formula of the inorganic resist material is A1-xOx, in which A represents the phase-change material, and x is between 5 at. % and 65 at. %. The inorganic resist material can be used to form line patterns or recording pits with size smaller than the exposure light spot by using the laser of conventional lithography process as an exposure source.

Abstract: A cable end connector assembly (100) comprises a Serial ATA cable end connector (1), a IEEE 1394b cable end connector (2), and a cable (3) inter-connecting the Serial ATA cable end connector and the IEEE 1394b cable end connector. The Serial ATA cable end connector includes an insulative housing (10), and a plurality of contacts (11) retained in the housing. The IEEE 1394b cable end connector includes an insulative housing (20), and a plurality of contacts (21) retained in the housing. The cable inter-connects the Serial ATA cable end connector and the 1394b cable end connector, the cable comprises, on a portion thereof, a metal braid (303) divided into a number of parts each soldered to a corresponding contact (11) of the Serial ATA.

Abstract: A dual band antenna for an electronic device includes a ground patch (10) having a connecting portion (101) and a bending portion (102), a first radiating branch (11) transversely extending from the connecting portion, and a second radiating branch (12) partly surrounding the first radiating branch and including a connecting patch (121) extending from the connecting portion and a radiating patch (120) extending from the connecting patch. The connecting portion, the first radiating branch and the connecting patch are located in a same first plane. The bending portion and the radiating patch respectively bend at predetermined angles to the first plane to form a bending structure adapted for an irregular installation space in the electronic device.

Abstract: A dual band antenna for an electronic device includes a ground patch (10) having a connecting portion (101) and a bending portion (102), a first radiating branch (11) transversely extending from the connecting portion, and a second radiating branch (12) partly surrounding the first radiating branch and including a connecting patch (121) extending from the connecting portion and a radiating patch (120) extending from the connecting patch. The connecting portion, the first radiating branch and the connecting patch are located in a same first plane. The bending portion and the radiating patch respectively bend at predetermined angles to the first plane to form a bending structure adapted for an irregular installation space in the electronic device.

Abstract: An antenna (1) includes a first radiating branch (20), a second radiating branch (30), a grounding plate (40), a linking segment (121), a connecting plate (60), and a feed cable (50). The first radiating branch is in a first plane and is provided to receive/transmit signals in a first frequency band. A feed point (21) is formed on the first radiating branch. The second radiating branch is in a second plane perpendicular to the first plane and is provided to receive/transmit signals in a second frequency band. The grounding plate is in a third plane facing the first plane for fixing and grounding the antenna. The feed cable includes a core conductor (51) and an outer shield conductor (53). The core conductor is electrically connected to the feed point for feeding signals into the antenna. The outer shield conductor is soldered to the grounding plate.