Patents by Inventor Chung-tien Lee

Chung-tien Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240178002
    Abstract: A method includes forming a material layer over a substrate, forming a first hard mask (HM) layer over the material layer, forming a first trench, along a first direction, in the first HM layer. The method also includes forming first spacers along sidewalls of the first trench, forming a second trench in the first HM layer parallel to the first trench, by using the first spacers to guard the first trench. The method also includes etching the material layer through the first trench and the second trench, removing the first HM layer and the first spacers, forming a second HM layer over the material layer, forming a third trench in the second HM layer. The third trench extends along a second direction that is perpendicular to the first direction and overlaps with the first trench. The method also includes etching the material layer through the third trench.
    Type: Application
    Filed: February 5, 2024
    Publication date: May 30, 2024
    Inventors: Yung-Sung Yen, Chung-Ju Lee, Chun-Kuang Chen, Chia-Tien Wu, Ta-Ching Yu, Kuei-Shun Chen, Ru-Gun Liu, Shau-Lin Shue, Tsai-Sheng Gau, Yung-Hsu Wu
  • Patent number: 11929331
    Abstract: The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chin-Shen Lin, Wan-Yu Lo, Meng-Xiang Lee, Hao-Tien Kan, Kuo-Nan Yang, Chung-Hsing Wang
  • Patent number: 4928432
    Abstract: A rods precision cutting-off and end surface grinding machine consisting chiefly of a set each of drive device, cut-off device, end surface grinding device and rods chucking device, which is chiefly characterized by the following operations: to put the controlling lever of rods chucking device in the central position of T-slot on the right side wall of housing body and move the said lever in the right horizontal direction along the said slot so that the arced cam at the front end of said lever pushes the secondary chuck body to open its mouth to receive a rod, then to move the said lever back to its original position and then up and down along the said T-slot so that the pincer fixture of rods chucking device can chuck the rod to be precisely cut off by the cut-off device and then the end surface of said rod cut off is precisely ground by the end surface grinding device, therefore, the rod can be precisely cut off or shortened and the end surface thereof can be ground and flattened at the same time.
    Type: Grant
    Filed: August 29, 1988
    Date of Patent: May 29, 1990
    Inventors: Chin-lung Yang, Chung-tien Lee