Abstract: An antenna structure includes a main ground plane, a protruding ground plane, a feeding radiation element, a connection radiation element, a shorting radiation element, a first radiation element, and a second radiation element. The protruding ground plane is coupled to the main ground plane. The feeding radiation element has a feeding point. The connection radiation element is coupled to the feeding radiation element. The connection radiation element is further coupled through the shorting radiation element to the protruding ground plane. The first radiation element is coupled to the feeding radiation element. The second radiation element is coupled to the connection radiation element. The protruding ground plane further includes an extension portion. The first radiation element is adjacent to the extension portion of the protruding ground plane.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: A wearable device includes a frame element and a dielectric substrate. The frame element includes a first metal element, a second metal element, and a third metal element. A first gap is provided between the first metal element and the second metal element. A second gap is provided between the second metal element and the third metal element. A third gap is provided between the third metal element and the first metal element. The dielectric substrate is surrounded by the first metal element, the second metal element, and the third metal element. A first antenna element is formed by the first metal element. A second antenna element is formed by the second metal element. A third antenna element is formed by the third metal element.

Abstract: In a LED lamp structure and an illuminating module thereof, the illuminating module includes a circuit board, a flat plate LED, an electrical pin and a packaging colloid. The circuit board has a length, a first and a second side formed at two sides of the length. The flat plate LED is fixed and electrically connected with the circuit board, bulges at the first side, and includes a substrate and at least one LED grain assembled on the substrate. The flat plate LED can emit omnidirectional light because the substrate is made of transparent material. The electrical pin is fixed and electrically connected with the circuit board and bulges at the second side. The packaging colloid covers the circuit board and the flat plate LED and has a rectangular plastic block. Thereby, the LED lamp structure can remain traditional appearance of a halogen lamp, for collecting and focusing light.

Abstract: A replaceable optical module lamp includes a light-emitting module, a circuit board, a sealing layer, and an optical module. The circuit board and the light-emitting module are electrically connected to each other. The sealing layer encloses the light-emitting module and the circuit board and includes a first assembling structure. The optical module is assembled to the sealing layer and is provided with an assembling hole. The assembling hole of the optical module is surroundingly connected to the sealing layer, so that the light-emitting module is disposed in the optical module. The optical module is provided with a second assembling structure detachably assembled to the first assembling structure to facilitate replacement. Accordingly, cost is reduced, and the optical module can be replaced with ease.

Abstract: In a LED lamp structure and an illuminating module thereof, the illuminating module includes a circuit board, a flat plate LED, an electrical pin and a packaging colloid. The circuit board has a length, a first and a second side formed at two sides of the length. The flat plate LED is fixed and electrically connected with the circuit board, bulges at the first side, and includes a substrate and at least one LED grain assembled on the substrate. The flat plate LED can emit omnidirectional light because the substrate is made of transparent material. The electrical pin is fixed and electrically connected with the circuit board and bulges at the second side. The packaging colloid covers the circuit board and the flat plate LED and has a rectangular plastic block. Thereby, the LED lamp structure can remain traditional appearance of a halogen lamp, for collecting and focusing light.

Abstract: A light emitting diode bulb includes a driving circuit board, a lighting unit, and a housing. The driving circuit board has one or more extending parts formed on one side, and a group of electrically connecting pins are disposed on the other side. An electrode is attached to one surface of each of the extending parts. The lighting unit is electrically connected to the electrodes. The housing packages the driving circuit board and the lighting unit, the electrically connected pins extend beyond the housing. The light emitting bulb has advantages of easy manufacture and low cost since the driving circuit board is electrically connected to the lighting unit directly and the housing then packages the driving circuit board and the lighting unit.

Abstract: A LED lamp includes an LED module and thermo-conductive members. The LED module has a transparent base, a plurality of LEDs mounted on the transparent base and a transparent film covering the LEDs. The transparent base has thermo-conductive sections and electro-conductive sections. The thermo-conductive members are attached on the thermo-conductive sections. Thereby, the invention can omnidirectionally emit light and has great effect of heat dissipation.

Abstract: A lighting module includes a main circuit board, a plurality of lighting units, and a driving unit. The main circuit board forms a plurality of through holes. Each lighting unit includes a transparent substrate, a circuit layer, a plurality of light emitting diode (LED) dies, and a transparent resin layer. The transparent substrates are arranged on the main circuit board, and then a predetermined angle spans between a first surface of each transparent substrate and the main circuit board. The circuit layer and the LED dies are placed on the first surface, and the LED dies are electrically connected to the circuit layer. The transparent resin layer covers the LED dies. The driving unit includes a driving circuit board including a plurality of protrusions. The protrusions are respectively inserted into the through holes such that the driving circuit board is substantially perpendicular to the main board.

Abstract: A globular illuminant device includes a hemispherical carrier, a circuit layer, a plurality of LED dies, an enclosure resin, and a hemispherical cover. The hemispherical carrier includes a carrying surface, a first cambered surface, and a first protrusion including a first surface. The circuit layer is placed on the first surface and the carrying surface. The LED dies are electrically connected to the circuit layer. The enclosure resin covers the LED dies. The hemispherical cover includes a joining surface, a second cambered surface, and a recess formed on the joining surface and concave toward second cambered surface. The hemispherical cover is assembled with the hemispherical carrier such that the joining surface is in contacted with the carrying surface while the LED dies and the enclosure resin are disposed within the recess.

Abstract: A LED lighting fixture includes a control circuit board, a plurality of lighting modules and a light reflective shield. Each one of the lighting modules includes a transparent substrate disposed of a plurality of LED chips; each one of the transparent substrates is electrically connected to the control circuit board, and the LED chips are electrically connected to the control circuit board via the transparent substrate. One side of each one of the transparent substrates is arranged adjacent to each other such that the transparent substrates are disposed in a radial pattern. The light reflective shield is for accommodating the control circuit board therein and surrounding the lighting modules. Therefore, the LED lighting fixture of the present invention is able to generate a uniformly distributed illumination while reducing the heat generated by the LED chips.

Abstract: A lighting module includes a main circuit board, a plurality of lighting units, and a driving unit. The main circuit board forms a plurality of through holes. Each lighting unit includes a transparent substrate, a circuit layer, a plurality of light emitting diode (LED) dies, and a transparent resin layer. The transparent substrates are arranged on the main circuit board, and then a predetermined angle spans between a first surface of each transparent substrate and the main circuit board. The circuit layer and the LED dies are placed on the first surface, and the LED dies are electrically connected to the circuit layer. The transparent resin layer covers the LED dies. The driving unit includes a driving circuit board including a plurality of protrusions. The protrusions are respectively inserted into the through holes such that the driving circuit board is substantially perpendicular to the main board.

Abstract: A globular illuminant device includes a hemispherical carrier, a circuit layer, a plurality of LED dies, an enclosure resin, and a hemispherical cover. The hemispherical carrier includes a carrying surface, a first cambered surface, and a first protrusion including a first surface. The circuit layer is placed on the first surface and the carrying surface. The LED dies are electrically connected to the circuit layer. The enclosure resin covers the LED dies. The hemispherical cover includes a joining surface, a second cambered surface, and a recess formed on the joining surface and concave toward second cambered surface. The hemispherical cover is assembled with the hemispherical carrier such that the joining surface is in contacted with the carrying surface while the LED dies and the enclosure resin are disposed within the recess.

Abstract: A LED lamp includes an LED module and thermo-conductive members. The LED module has a transparent base, a plurality of LEDs mounted on the transparent base and a transparent film covering the LEDs. The transparent base has thermo-conductive sections and electro-conductive sections. The thermo-conductive members are attached on the thermo-conductive sections. Thereby, the invention can omnidirectionally emit light and has great effect of heat dissipation.

Abstract: An illuminant device includes a lighting module and a first transparent heat-dissipating component. The lighting module includes a transparent substrate, a circuit layer, a plurality of light emitting diode (LED) dies, a first transparent resin layer, and a second transparent resin layer. The transparent substrate includes a first surface and a second surface opposite to the first surface. The circuit layer is placed on the first surface. The LED dies are placed on the first surface and electrically connected to the circuit layer. The first transparent resin layer is disposed on the first surface and covers the light emitting diode dies. The second transparent resin layer is disposed on the second surface and corresponding to the first transparent resin layer. The first transparent heat-dissipating component is arranged on the first transparent resin layer and opposite to the transparent substrate.

Abstract: A lamp holder includes an insulating lamp base, a pair of lead frames and an LED strip assembly. The insulating lamp base has two spaced apart through holes. The pair of lead frames is separately inserted in the two through holes. Each lead frame includes a heat conducting section and a supporting section. One end of the heat conducting section is inserted in the through hole, and the other end of the heat conducting section is connected with the supporting section. The two heat conducting sections are extended from the insulating lamp base to separate the two supporting sections from a surface of the insulating lamp base with a distance. The LED strip assembly includes a transparent carrier board, a plural of LED chips and a first transparent glue layer .The transparent carrier board is disposed crossing the two supporting sections.