Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first interconnect dielectric layer arranged over a substrate. An interconnect wire extends through the first interconnect dielectric layer, and a barrier structure is arranged directly over the interconnect wire. The integrated chip further includes an etch stop layer arranged over the barrier structure and surrounds outer sidewalls of the barrier structure. A second interconnect dielectric layer is arranged over the etch stop layer, and an interconnect via extends through the second interconnect dielectric layer, the etch stop layer, and the barrier structure to contact the interconnect wire.

Abstract: A method of forming a semiconductor device structure is provided. The method includes forming a masking structure with first openings over a semiconductor substrate and correspondingly forming metal layers in the first openings. The method also includes recessing the masking structure to form second openings between the metal layers and forming a sacrificial layer surrounded by a first liner in each of the second openings. In addition, after forming a second liner over the sacrificial layer in each of the second openings, the method includes removing the sacrificial layer in each of the second openings to form a plurality of air gaps therefrom.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed herein. An exemplary method of forming a semiconductor device comprises receiving a structure including a substrate and a first hard mask over the substrate, the first hard mask having at least two separate portions; forming spacers along sidewalls of the at least two portions of the first hard mask with a space between the spacers; forming a second hard mask in the space; forming a first cut in the at least two portions of the first hard mask; forming a second cut in the second hard mask; and depositing a cut hard mask in the first cut and the second cut.

Abstract: In some embodiments, the present disclosure relates to a method of forming an interconnect. The method includes forming an etch stop layer (ESL) over a lower conductive structure and forming one or more dielectric layers over the ESL. A first patterning process is performed on the one or more dielectric layers to form interconnect opening and a second patterning process is performed on the one or more dielectric layers to increase a depth of the interconnect opening and expose an upper surface of the ESL. A protective layer is selectively formed on sidewalls of the one or more dielectric layers forming the interconnect opening. A third patterning process is performed to remove portions of the ESL that are uncovered by the one or more dielectric layers and the protective layer and to expose the lower conductive structure. A conductive material is formed within the interconnect opening.

Abstract: Some embodiments relate to an integrated chip including a plurality of conductive structures over a substrate. A first dielectric layer is disposed laterally between the conductive structures. A spacer structure is disposed between the first dielectric layer and the plurality of conductive structures. An etch stop layer overlies the plurality of conductive structures. The etch stop layer is disposed on upper surfaces of the spacer structure and the first dielectric layer.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first interconnect dielectric layer arranged over a substrate. An interconnect wire extends through the first interconnect dielectric layer, and a barrier structure is arranged directly over the interconnect wire. The integrated chip further includes an etch stop layer arranged over the barrier structure and surrounds outer sidewalls of the barrier structure. A second interconnect dielectric layer is arranged over the etch stop layer, and an interconnect via extends through the second interconnect dielectric layer, the etch stop layer, and the barrier structure to contact the interconnect wire.

Abstract: A semiconductor structure includes a conductive feature disposed over a semiconductor substrate, a via disposed in a first interlayer dielectric (ILD) layer over the conductive feature, and a metal-containing etch-stop layer (ESL) disposed on the via, where the metal-containing ESL includes a first metal and is resistant to etching by a fluorine-containing etchant. The semiconductor structure further includes a conductive line disposed over the metal-containing ESL, where the conductive line includes a second metal different from the first metal and is etchable by the fluorine-containing etchant, and where the via is configured to interconnect the conductive line to the conductive feature. Furthermore, the semiconductor structure includes a second ILD layer disposed over the first ILD layer.

Abstract: An input system and a method for an electronic device based on Chinese phonetic notation are provided. The input system includes a plurality of keys, a detecting unit, a filtering unit and a candidate character output unit. The keys are respectively arranged on two sides of a screen of the electronic device, and each of the keys respectively corresponding to two phonetic notation sets. Every time the detecting unit detects an operation on any of the keys, one of the phonetic notation sets corresponding to the operated key is chosen according to a direction of the operation. The filtering unit permutes the contents of all chosen phonetic notation sets so as to obtain at least one meaningful pronunciation. And according to a Chinese character database and the meaningful pronunciations, the candidate character output unit outputs at least one candidate character on the screen.

Abstract: A method for adjusting touch positions of software keyboard includes the following steps: a software keyboard is displayed on the touch screen. The preset characters are displayed respectively to receive at least one first touched position corresponding to each of the preset characters on the touch screen. A touched offset corresponding to each of the preset characters is calculated according to the at least one first touched position corresponding to each of the preset characters respectively. At least one touched boundary among each of the preset characters and the neighboring characters thereof is calculated according to the touched offset and the preset base center point corresponding to each of the preset characters respectively. A preset close-loop scope corresponding to each of the preset characters is calculated according to the touched boundaries respectively. Output characters according to the close-loop scopes touched.

Abstract: An event triggering method, system, and computer program product are provided, in which an optical spot trajectory tracking is utilized. Firstly, a cursor at a position on the surface of a screen is moved to a preset position through a first optical spot, then, the projecting of the first optical spot is stopped. Next, it is determined whether the preset position is a preset position of a command. Then, a second optical spot is projected to generate a light-triggered signal, and then a processing unit executes the command according to the light-triggered signal.

Abstract: An input system and a method for an electronic device based on Chinese phonetic notation are provided. The input system includes a plurality of keys, a detecting unit, a filtering unit and a candidate character output unit. The keys are respectively arranged on two sides of a screen of the electronic device, and each of the keys respectively corresponding to two phonetic notation sets. Every time the detecting unit detects an operation on any of the keys, one of the phonetic notation sets corresponding to the operated key is chosen according to a direction of the operation. The filtering unit permutes the contents of all chosen phonetic notation sets so as to obtain at least one meaningful pronunciation. And according to a Chinese character database and the meaningful pronunciations, the candidate character output unit outputs at least one candidate character on the screen.

Abstract: A lock and unlock function triggered by a touch panel of a hand-held device. The hand-held device detects a pattern input from the touch panel, and execute the lock/unlock function to enable or disable the keypad and the touch panel once the input pattern matches the specified pattern using a pattern recognition algorithm.

Abstract: A system and method is used to form a data packet for data synchronization. The data packet comprises a recognizing data and a content data. The recognizing data comprises a guard data and a pattern data. The system and method predetermines bits number of the pattern data, and permutes a plurality of recognizing data sets according to the bits number. Subsequently, the system and method transforms these recognizing data sets to a plurality of counting data sets using the bit mapping procedure. The system and method calculates a plurality of contrast parameter based on these counting data using the half-autocorrelation procedure, and chooses a chosen recognizing data having the smallest. contrast parameter. Finally, the system and method combines the chosen recognizing data and the content data to generate the data packet.