Abstract: A package structure including a semiconductor die, a redistribution layer structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution layer structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution layer structure includes a backside dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the backside dielectric layer and the inter-dielectric layers. The electronic device is disposed over the backside dielectric layer and electrically connected to an outermost redistribution conductive layer among the redistribution conductive layers, wherein the outermost redistribution conductive layer is embedded in the backside dielectric layer, and the backside dielectric layer comprises a ring-shaped recess covered by the outermost redistribution conductive layer.

Abstract: A package includes a frontside redistribution layer (RDL) structure, a semiconductor die on the frontside RDL structure, and a backside RDL structure on the semiconductor die including a first RDL, and a backside connector extending from a distal side of the first RDL and including a tapered portion having a width that decreases in a direction away from the first RDL, wherein the tapered portion includes a contact surface at an end of the tapered portion. A method of forming the package may include forming the backside redistribution layer (RDL) structure, attaching a semiconductor die to the backside RDL structure, forming an encapsulation layer around the semiconductor die on the backside RDL structure, and forming a frontside RDL structure on the semiconductor die and the encapsulation layer.

Abstract: An integrated fan-out package includes a first redistribution structure, a die, conductive structures, an encapsulant, and a second redistribution structure. The first redistribution structure has first regions and a second region surrounding the first regions. A metal density in the first regions is smaller than a metal density in the second region. The die is disposed over the first redistribution structure. The conductive structures are disposed on the first redistribution structure to surround the die. Vertical projections of the conductive structures onto the first redistribution structure fall within the first regions of the first redistribution structure. The encapsulant encapsulates the die and the conductive structures. The second redistribution structure is disposed on the encapsulant, the die, and the conductive structures.

Abstract: An antenna structure includes a ground element, a first radiation element, a second radiation element, a third radiation element, and a nonconductive support element. The first radiation element is coupled to a first grounding point on the ground element. The second radiation element has a feeding point. The second radiation element is adjacent to the first radiation element. The third radiation element is coupled to a second grounding point on the ground element. The third radiation element is adjacent to the second radiation element. The first radiation element, the second radiation element, and the third radiation element are disposed on the nonconductive support element. The second radiation element is at least partially surrounded by the first radiation element. The third radiation element is at least partially surrounded by the second radiation element.

Abstract: A wearable device includes a ground element, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, and a fifth radiation element. The first radiation element has a feeding point, and is coupled to a first grounding point on the ground element. A slot region is surrounded by the first radiation element and the ground element. The second radiation element is coupled to a second grounding point on the ground element. The third radiation element is coupled to the second grounding point. The third radiation element and the second radiation element substantially extend in opposite directions. The fourth radiation element and the fifth radiation element are disposed inside the slot region. An antenna structure is formed by the first radiation element, the second radiation element, the third radiation element, the fourth radiation element, and the fifth radiation element.

Abstract: A communication receiver includes a first signal processing circuit and a second signal processing circuit. The first signal processing circuit includes a first feedforward equalizer and a decision circuit. The first feedforward equalizer processes a received signal to generate a first equalized signal. The decision circuit performs hard decision upon the first equalized signal to generate a first symbol decision signal. The second signal processing circuit includes a second feedforward equalizer, a decision feedforward equalizer, and a first decision feedback equalizer. The second feedforward equalizer processes the first equalized signal to generate a second equalized signal. The decision feedforward equalizer processes the first symbol decision signal to generate a third equalized signal. The first decision feedback equalizer generates a second symbol decision signal according to the second equalized signal and the third equalized signal.

Abstract: A semiconductor package including a first semiconductor die, a second semiconductor die, a first insulating encapsulation, a dielectric layer structure, a conductor structure and a second insulating encapsulation is provided. The first semiconductor die includes a first semiconductor substrate and a through silicon via (TSV) extending from a first side to a second side of the semiconductor substrate. The second semiconductor die is disposed on the first side of the semiconductor substrate. The first insulating encapsulation on the second semiconductor die encapsulates the first semiconductor die. A terminal of the TSV is coplanar with a surface of the first insulating encapsulation. The dielectric layer structure covers the first semiconductor die and the first insulating encapsulation. The conductor structure extends through the dielectric layer structure and contacts with the through silicon via.

Abstract: An error detection and correction device includes a decision-feedback equalizer (DFE), a decision circuit, an error detection circuit, and an error correction circuit. The DFE equalizes a data signal to generate a first equalized signal. The decision circuit performs hard decision upon the first equalized signal to generate a symbol decision signal. The error detection circuit performs forward error detection at symbol positions of consecutive symbols included in the symbol decision signal to detect a head position of suspicious error that affects at least one symbol in the symbol decision signal. The error correction circuit performs error correction upon the symbol decision signal in response to the head position of the suspicious error that is detected by the error detection circuit.

Abstract: A treadmill contains a body, a support assembly, a resistance unit, and a stop strap. The body includes a holder and a circular running belt. The support assembly includes multiple posts and two columns, wherein each column having a slidable space, and the slidable space having two first chutes. A resistance unit includes two sliding devices, two limitation structures, and a force exerting element. The respective sliding device has a slider and multiple first rollers. The respective limitation structure includes two cylinder units, a resilient unit, a first fixing unit, and a second fixing unit. The force exerting element has two connection rods connected on two ends thereof, and the respective connection rod of the force exerting element is coupled with the coupling portion of the slider of the respective sliding device.

Abstract: A treadmill contains: a body, a support assembly, a resistance unit, and a stop strap. The body includes a holder and a circular running belt. The support assembly includes multiple posts and two columns. The respective column has a slidable space, and the slidable space has two first chutes. A resistance unit includes two sliding devices, two limitation structures, and a force exerting element. The respective sliding device has a slider and multiple first rollers. The respective limitation structure includes two cylinder units, a resilient unit, a first fixing unit, and a second fixing unit. The force exerting element has two connection rods connected on two ends thereof, and the respective connection rod of the force exerting element is coupled with the coupling portion of the slider of the respective sliding device.

Abstract: A centrifugal rotor includes a support disk and a centrifugal carrier. The centrifugal carrier is assembled within the support disk. The centrifugal carrier includes an arc-shaped body, a sample application chamber, a sample metering chamber, a diluent chamber, a diluent metering chamber, a metering control member and a mixing chamber. The sample metering chamber is communicated with the sample application chamber. The sample metering chamber is positioned radially outward from the sample application chamber. The diluent metering chamber is communicated with the diluent chamber. The diluent metering chamber is positioned radially outward from diluent chamber. The metering control member is slidingly connected within or detachably fixed to the sample metering, chamber or the diluent metering chamber. The mixing chamber is communicated with the diluent metering chamber and the sample metering chamber respectively.

Abstract: A harmonic drive includes a circular spline, a cup-shaped flex spline meshed with the circular spline, a wave generator including an bearing mounted in the cup-shaped flex spline, an elliptical wheel mounted in the bearing and a coupling connected to the elliptical wheel so that an oil storage chamber is defined between the wave generator and the cup-shaped flex spline, and one or multiple stirrers connected to the coupling of the wave generator and drivable by the coupling to carry the storage lubricating oil out of the oil storage chamber for lubricating the bearing of the wave generator and the meshed tooth surfaces between the circular spline and the cup-shaped flex spline.

Abstract: A harmonic drive includes a circular spline, a cup-shaped flex spline meshed with the circular spline, a wave generator including an bearing mounted in the cup-shaped flex spline, an elliptical wheel mounted in the bearing and a coupling connected to the elliptical wheel so that an oil storage chamber is defined between the wave generator and the cup-shaped flex spline, and one or multiple stirrers connected to the coupling of the wave generator and drivable by the coupling to carry the storage lubricating oil out of the oil storage chamber for lubricating the bearing of the wave generator and the meshed tooth surfaces between the circular spline and the cup-shaped flex spline.

Abstract: A centrifugal rotor includes a rotor body, a diluent container, a piercing structure and a capping film. The rotor body has a receiving cavity. The diluent container is located within the receiving cavity and has a seal film. The piercing structure is located within the receiving cavity and in contact with the seal film. The capping film is located over the diluent container and the piercing structure for securing the diluent container and the piercing structure within the receiving cavity.

Abstract: A semiconductor structure and a method for forming the same are provided. The method includes following steps. A gate electrode layer is formed on a substrate. A spacer structure is formed on a sidewall of the gate electrode layer. A dielectric cap film is formed to cover the gate electrode layer and the spacer structure. A source/drain implantation is performed to the substrate with the dielectric cap film exposed to a condition of the source/drain implantation.

Abstract: A semiconductor structure and a method for forming the same are provided. The method includes following steps. A gate electrode layer is formed on a substrate. A spacer structure is formed on a sidewall of the gate electrode layer. A dielectric cap film is formed to cover the gate electrode layer and the spacer structure. A source/drain implantation is performed to the substrate with the dielectric cap film exposed to a condition of the source/drain implantation.

Abstract: A light module for a biochemical analyzing system includes a halogen light source emitting light beams, which are guided through a first light path and a second light path and then combined to go through a first beam splitter, so as to analyze a biochemical sample. The first light path includes a plurality of reflective mirrors and a first filter lens, and the first filter lens is used to attenuate an orange band light of the halogen light source. The second light path includes a second filter lens, and the second filter lens is used to attenuate the lights of the halogen light source except the ultraviolet light band.

Abstract: A centrifugal rotor includes a support disk and a centrifugal carrier. The centrifugal carrier is assembled within the support disk. The centrifugal carrier includes an arc-shaped body, a sample application chamber, a sample metering chamber, a diluent chamber, a diluent metering chamber, a metering control member and a mixing chamber. The sample metering chamber is communicated with the sample application chamber. The sample metering chamber is positioned radially outward from the sample application chamber. The diluent metering chamber is communicated with the diluent chamber. The diluent metering chamber is positioned radially outward from diluent chamber. The metering control member is slidingly connected within or detachably fixed to the sample metering, chamber or the diluent metering chamber. The mixing chamber is communicated with the diluent metering chamber and the sample metering chamber respectively.

Abstract: A centrifugal rotor includes a rotor body, a diluent container, a piercing structure and a capping film. The rotor body has a receiving cavity. The diluent container is located within the receiving cavity and has a seal film. The piercing structure is located within the receiving cavity and in contact with the seal film. The capping film is located over the diluent container and the piercing structure for securing the diluent container and the piercing structure within the receiving cavity.

Abstract: An analytical system for performing centrifugal analysis on a working fluid with different components includes a uniform-dividing unit with a reduced cross section to divide the working fluid, a separating unit connected to the uniform-dividing unit, and a detecting unit. The detecting unit includes a detection compartment and a constant-quantity region connected to the separating unit through a separation channel. When rotating the uniform-dividing unit, the working fluid located at the uniform-dividing unit is transmitted to and separated by the separating unit, thereby causing one component of the working fluid to be separated from the other component and transmitted to the detection compartment through the constant-quantity region. With constant-quantity region, the detection compartment can be prevented from flushing by the excess of the separated component, and thus yield of product detection can be increased and different assays detection is carried out with a small sample volume at the same time.