Abstract: A method and apparatuses for device control performed by a first device to control services provided by a service providing device is provided. The method includes connecting, through out-of-band communication, to a second device that includes identification information related to the service providing device, receiving, through the out-of-band communication, the identification information related to the service providing device from the second device, executing at least one application related to the identification information, and connecting, through in-band communication, to the service providing device using the identification information, and controlling, from the first device, services provided by the service providing device.

Abstract: A method and a system in which a second device provides a service along with an external device via a first device is provided. The method includes, when a service connection to at least one external device has failed, searching for the first device that will relay service data for the external device, transmitting a relay request signal to the first device, and transmitting the service data for the external device to the first device, wherein the transmitted service data is converted by the first device, and wherein the converted service data is provided to the external device.

Abstract: A gateway apparatus for wireless communication is provided. The gateway apparatus includes an interface to which a plurality of electronic devices within a first range connect wirelessly, and a controller configured to provide a communication connection using a frequency band to each of the plurality of electronic devices so that each of the electronic devices connected to the interface is enabled for wireless communication, to split the frequency band into a plurality of bands respectively corresponding to the plurality of electronic devices connected to the interface when it is determined that communication interference occurs between the electronic devices, and to allocate the split bands to the respective electronic devices to control the electronic devices to perform communications through the split bands.

Abstract: A method and apparatuses for device control performed by a first device to control services provided by a service providing device is provided. The method includes connecting, through out-of-band communication, to a second device that includes identification information related to the service providing device, receiving, through the out-of-band communication, the identification information related to the service providing device from the second device, executing at least one application related to the identification information, and connecting, through in-band communication, to the service providing device using the identification information, and controlling, from the first device, services provided by the service providing device.

Abstract: A method and a system in which a second device provides a service along with an external device via a first device is provided. The method includes, when a service connection to at least one external device has failed, searching for the first device that will relay service data for the external device, transmitting a relay request signal to the first device, and transmitting the service data for the external device to the first device, wherein the transmitted service data is converted by the first device, and wherein the converted service data is provided to the external device.

Abstract: A gateway apparatus for wireless communication is provided. The gateway apparatus includes an interface to which a plurality of electronic devices within a first range connect wirelessly, and a controller configured to provide a communication connection using a frequency band to each of the plurality of electronic devices so that each of the electronic devices connected to the interface is enabled for wireless communication, to split the frequency band into a plurality of bands respectively corresponding to the plurality of electronic devices connected to the interface when it is determined that communication interference occurs between the electronic devices, and to allocate the split bands to the respective electronic devices to control the electronic devices to perform communications through the split bands.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.

Abstract: A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed.