Patents by Inventor Chun-Yang Su

Chun-Yang Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip package having a flexible substrate
    Patent number: 10168582
    Abstract: A chip package includes a flexible substrate, a chip, a pressure-proof member and a reinforcement sheet. The chip and the pressure-proof member are located on a first surface of the flexible substrate, and the reinforcement sheet is located on a second surface of the flexible substrate. The pressure-proof member at least includes a pair of pressure-proof ribs which are located outside of the chip oppositely. The pressure-proof ribs located outside the chip can protect the chip from the damage caused by the pressure of other component (e.g. curved panel) except the chip package.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: January 1, 2019
    Assignee: CHIPBOND TECHNOLOGY CORPORATION
    Inventors: Chun-Yang Su, Jhao-Shin Wang, Nian-Cih Yang, Xin-Wei Lo