Abstract: An optical fiber transmission device includes a substrate, a photonic integrated circuit, and an optical fiber assembly. The photonic integrated circuit is disposed on an area of the substrate. The substrate has a protruding structure at an interface with an edge of the photonic integrated circuit. The optical fiber assembly includes an optical fiber and a ferrule that sleeves the optical fiber. The protruding structure of the substrate is configured to abut against the ferrule to limit the position of the optical fiber assembly in a vertical direction of the substrate, such that the protruding structure is a stopper for the optical fiber assembly in the vertical direction.

Abstract: An immersion-type heat dissipation structure having high density heat dissipation fins is provided, which includes a heat dissipation substrate and the plurality of sheet-like heat dissipation fins. A thickness of the heat dissipation substrate is from 2 mm to 6 mm, and a bottom surface of the heat dissipation substrate contacts a heating element immersed in a two-phase coolant. The sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. A length, a width, and a height of at least one of the sheet-like heat dissipation fins are from 60 mm to 120 mm, from 0.1 mm to 0.5 mm, and from 3 mm to 10 mm, respectively. Further, a distance between at least two of the sheet-like heat dissipation fins that are arranged in parallel to each other is from 0.1 mm to 0.5 mm.

Abstract: An optical fiber network device includes a fiber and a photonic integrated circuit. Fiber receives a first optical signal and transmits a second optical signal. A first wavelength of first optical signal is different from a second wavelength of second optical signal. Photonic integrated circuit includes a laser chip, a photodetector, a wavelength division multiplexing coupler, a first optical modulation element and a second optical modulation element. Laser chip is disposed on photonic integrated circuit, and is configured to generate first optical signal. Photodetector detects second optical signal. Wavelength division multiplexing coupler is configured to couple first optical signal to fiber, and receives second optical signal. First optical modulation element is coupled to wavelength division multiplexing coupler and laser chip, and is configured to modulate first optical signal.

Abstract: A two-phase immersion-type heat dissipation structure having high density heat dissipation fins is provided. The two-phase immersion-type heat dissipation structure having high density heat dissipation fins includes a heat dissipation substrate, a plurality of sheet-like heat dissipation fins, and a reinforcement structure. A bottom surface of the heat dissipation substrate is in contact with a heating element immersed in a two-phase coolant. The plurality of sheet-like heat dissipation fins are integrally formed on an upper surface of the heat dissipation substrate and arranged in high density. An angle between at least one of the sheet-like heat dissipation fins and the upper surface of the heat dissipation substrate is from 60° to 120°. At least one of the sheet-like heat dissipation fins has a length from 50 mm to 120 mm, a width from 0.1 mm to 0.35 mm, and a height from 2 mm to 8 mm.

Abstract: A data transmission system is disclosed. The data transmission system includes at least one signal processing device, at least one conversion device, at least one antenna device, and at least one flexible printed circuit board. The at least one signal processing device is configured to generate or receive at least one data. The at least one conversion device is configured to transform between the at least one data and an optical signal. The at least one antenna device is configured to obtain the at least one data according to the optical signal, and configured to receive or transmit the at least one data wirelessly. The at least one flexible printed circuit board includes at least one conductive layer and at least one optical waveguide layer. The at least one optical waveguide layer is configured to transmit the optical signal.

Abstract: A device includes: a complementary transistor including: a first transistor having a first source/drain region and a second source/drain region; and a second transistor stacked on the first transistor, and having a third source/drain region and a fourth source/drain region, the third source/drain region overlapping the first source/drain region, the fourth source/drain region overlapping the second source/drain region. The device further includes: a first source/drain contact electrically coupled to the third source/drain region; a second source/drain contact electrically coupled to the second source/drain region; a gate isolation structure adjacent the first and second transistors; and an interconnect structure electrically coupled to the first source/drain contact and the second source/drain contact.

Abstract: A cargo bracing device includes a fixing member and a driving member. Mainly the fixing member possesses a connecting plate easily fitted with one end of an elastic device, and a locking plate easily fitted with another end of the elastic device. So the locking plate can be restored with dynamic force provided by the elastic device deposited between the connecting plate and the locking plate. The driving member includes two wings respectively having one end formed as a hook collaborating with a latch of a driven plate to enable the driving member combined with or detached from the fixing member. Similar to the fixing member, an elastic device is easily installed between an actuating plate and a connecting bar of the driving member, providing dynamic force for restoring the actuating plate. Therefore the cargo bracing device can be easily assembled, even with automatic equipments.

Abstract: A method for burning MAC address is used to burn a MAC address into a network card in the course of making a network card. The method includes the following steps: Stores a plurality of MAC addresses in a burning platform. The burning platform sends a MAC address to a burning device, and then burns the MAC address to a network card through the burning device. When the burning process finishes, the burning platform reads the contents of the network card, and compares the reading contents to the burning contents. If the result is correct, the burning platform sends the MAC address and a serial number of the network card to a server, and compares them to serial numbers and MAC addresses being stored in the server to prevent the MAC address being reused.

Abstract: A method for burning a BIOS chip (108) and a network card chip (107) that are attached on a motherboard (106), includes the steps of: storing a plurality of MAC addresses in a burning device (102); loading a BIOS file and a network card file into the burning device; sending the BIOS file from the burning device to a burning card (104), and burning the BIOS file into the BIOS chip via the burning card; the burning device sending the network card file which includes a MAC address from the burning device to the burning card, and burning the network card file into the network card chip via the burning card; and verifying whether the BIOS chip and the network card chip have been burned correctly.

Abstract: A bike stem with angle adjustable includes a drum shaped inner insertion body contained in a linking base provide to a body of the stem; an accommodation portion disposed in the linking base to receive the drum shaped inner insertion body also indicates a drum shape; a spacing is defined between the drum shaped inner insertion body when received in the accommodation portion and a top of the linking base; the drum shaped inner insertion body is inserted and secured onto a fork; a cover is disposed externally to the linking base; a spacing defined between the drum shaped inner insertion body and the drum shaped accommodation portion of the linking base permits the stem to execute longitudinal swing for angular adjustment for the stem to achieve easy adjustment and provide more functionalities.

Abstract: A method for burning a BIOS chip (108) and a network card chip (107) that are attached on a motherboard (106), includes the steps of: storing a plurality of MAC addresses in a burning device (102); loading a BIOS file and a network card file into the burning device; sending the BIOS file from the burning device to a burning card (104), and burning the BIOS file into the BIOS chip via the burning card; the burning device sending the network card file which includes a MAC address from the burning device to the burning card, and burning the network card file into the network card chip via the burning card; and verifying whether the BIOS chip and the network card chip have been burned correctly.

Abstract: A method for burning BIOS comprises the steps of: (1) providing a corrupted motherboard with a corrupted BIOS attached; (2) providing a burning device for receiving the corrupted motherboard; (3) providing a BIOS burning card for receiving a burning instruction from the burning device to start burning; (4) the BIOS burning card detecting the corrupted BIOS whether the corrupted BIOS is blank, if the corrupted BIOS being not blank, erasing the corrupted BIOS; (5) the BIOS burning card sending information to the corrupted BIOS to burn the corrupted BIOS; and (6) verifying the corrupted BIOS.

Abstract: A method for burning MAC address is used to burn a MAC address into a network card in the course of making a network card. The method includes the following steps: Stores a plurality of MAC addresses in a burning platform. The burning platform sends a MAC address to a burning device, and then burns the MAC address to a network card through the burning device. When the burning process finishes, the burning platform reads the contents of the network card, and compares the reading contents to the burning contents. If the result is correct, the burning platform sends the MAC address and a serial number of the network card to a server, and compares them to serial numbers and MAC addresses being stored in the server to prevent the MAC address being reused.