Patents by Inventor Chuong H. Diep

Chuong H. Diep has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160025426
    Abstract: A heat transfer device includes a body defining a fluid inlet and a fluid outlet, a fluid channel defined within the body, the fluid channel connected in fluid communication between the fluid inlet and the fluid outlet, and a plurality of pins disposed within the fluid channel such that flow passing through the fluid channel passes around the plurality of pins to facilitate heat transfer to the fluid from the body.
    Type: Application
    Filed: July 22, 2014
    Publication date: January 28, 2016
    Inventors: Jeremy M. Strange, Chuong H. Diep, Thomas E. Banach, Timothy D. Scull
  • Publication number: 20160025422
    Abstract: A heat transfer device includes a body defining a fluid inlet and fluid outlet, and a plurality of channels defined within the body in fluid communication between the fluid inlet and the fluid outlet, wherein the channels are interlaced and fluidly isolated from one another between the fluid inlet and the fluid outlet. The body can define a unitary matrix fluidly isolating the channels from one another between the fluid inlet and the fluid outlet.
    Type: Application
    Filed: July 22, 2014
    Publication date: January 28, 2016
    Inventors: Jeremy M. Strange, Thomas E. Banach, Chuong H. Diep
  • Publication number: 20160025423
    Abstract: A heat transfer device includes a body defining fluid inlet and fluid outlet. The body further defines a plurality of channels defined within the body in fluid connection between the fluid inlet and the fluid outlet, wherein the channels are fluidly isolated from one another between the fluid inlet and the fluid outlet.
    Type: Application
    Filed: July 22, 2014
    Publication date: January 28, 2016
    Inventors: Jeremy M. Strange, Chuong H. Diep, Thomas E. Banach
  • Patent number: 7044795
    Abstract: An electrical connector assembly includes a wire bundle having at least one wire with a metal shield surrounding at least a portion of the wire. The shield has an end portion and provides electromagnetic interference protection to the wire. A backshell includes a body and a cover secured to the body together defining an internal cavity with the wire at least partially arranged within the cavity. The backshell provides EMI protection for the portion of the wire bundle not covered by the shield. The backshell includes a hole in a wall of either the body or the cover with the end portion of the shield extending through the hole. The clamp is secured about the body and the cover with the end portion of the shield arranged between the clamp and the backshell grounding the shield to the backshell. The clamp forces the backshell into engagement with the wire bundle to provide strain relief for the wire bundle.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: May 16, 2006
    Assignee: Hamilton Sundstrand
    Inventor: Chuong H. Diep
  • Publication number: 20040198091
    Abstract: An electrical connector assembly includes a wire bundle having at least one wire with a metal shield surrounding at least a portion of the wire. The shield has an end portion and provides electromagnetic interference protection to the wire. A backshell includes a body and a cover secured to the body together defining an internal cavity with the wire at least partially arranged within the cavity. The backshell provides EMI protection for the portion of the wire bundle not covered by the shield. The backshell includes a hole in a wall of either the body or the cover with the end portion of the shield extending through the hole. The clamp is secured about the body and the cover with the end portion of the shield arranged between the clamp and the backshell grounding the shield to the backshell. The clamp forces the backshell into engagement with the wire bundle to provide strain relief for the wire bundle.
    Type: Application
    Filed: April 1, 2003
    Publication date: October 7, 2004
    Inventor: Chuong H. Diep