Patents by Inventor Chwen-Jiann Fang

Chwen-Jiann Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Detecting defects on a wafer
    Patent number: 9355208
    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes determining locations of all instances of a weak geometry in a design for a wafer. The locations include random, aperiodic locations. The weak geometry includes one or more features that are more prone to defects than other features in the design. The method also includes scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system. In addition, the method includes detecting defects in at least one instance of the weak geometry based on the output generated at two or more instances of the weak geometry in a single die on the wafer.
    Type: Grant
    Filed: July 1, 2014
    Date of Patent: May 31, 2016
    Assignee: KLA-Tencor Corp.
    Inventors: Eugene Shifrin, Ashok Kulkarni, Kris Bhaskar, Graham Michael Lynch, John Raymond Jordan, III, Chwen-Jiann Fang
  • Methods and Systems for Detecting Repeating Defects on Semiconductor Wafers Using Design Data
    Publication number: 20150012900
    Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes determining locations of all instances of a weak geometry in a design for a wafer. The locations include random, aperiodic locations. The weak geometry includes one or more features that are more prone to defects than other features in the design. The method also includes scanning the wafer with a wafer inspection system to thereby generate output for the wafer with one or more detectors of the wafer inspection system. In addition, the method includes detecting detects in at least one instance of the weak geometry based on the output generated at two or more instances of the weak geometry in a single die on the wafer.
    Type: Application
    Filed: July 1, 2014
    Publication date: January 8, 2015
    Inventors: Eugene Shifrin, Ashok Kulkarni, Kris Bhaskar, Graham Michael Lynch, John Raymond Jordan, III, Chwen-Jiann Fang