Patents by Inventor Chyi-Shan Wang

Chyi-Shan Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7029603
    Abstract: A method of reinforcing a polymeric material with carbon nanofibers is provided in which carbon nanofibers are combined with a polymer and a solvent for the polymer to form a substantially homogeneous mixture, followed by removal of the solvent by evaporation or coagulation. The resulting conductive polymeric nanocomposite material exhibits high electrical and thermal conductivity, enhanced mechanical strength, abrasion resistance, and dimensional stability.
    Type: Grant
    Filed: October 31, 2003
    Date of Patent: April 18, 2006
    Assignee: University of Dayton
    Inventors: Chyi-Shan Wang, Max D. Alexander
  • Publication number: 20050272847
    Abstract: A method of making a polymeric nanocomposite material. The method includes combining nanosize materials, such as layered silicates, or nanosize sphered silica, with a polymer and a solvent to form a substantially homogeneous mixture, followed by removal of the solvent. The method forms a layered-silicate nanocomposite with an intercalated nanostructure with very large interplanar spacing or a combination of intercalated and exfoliated nanostructure.
    Type: Application
    Filed: May 23, 2005
    Publication date: December 8, 2005
    Inventors: Chyi-Shan Wang, Max Alexander, Chenggang Chen
  • Publication number: 20050127329
    Abstract: A method of reinforcing a polymeric material with nanosize materials is provided in which materials such as vapor grown carbon nanofibers, carbon nanotubes, layered silicates, nanosize sphered silica, or graphite nanoparticles are combined with a polymer and a solvent to form a substantially homogeneous mixture, followed by removal of the solvent by evaporation or coagulation. Depending on the nanosize materials used, the resulting polymeric nanocomposite material exhibits high electrical and thermal conductivity, enhanced mechanical strength, abrasion resistance, reduced gas permeation, and/or dimensional stability.
    Type: Application
    Filed: February 27, 2004
    Publication date: June 16, 2005
    Inventors: Chyi-Shan Wang, Max Alexander
  • Publication number: 20040089851
    Abstract: A method of reinforcing a polymeric material with carbon nanofibers is provided in which carbon nanofibers are combined with a polymer and a solvent for the polymer to form a substantially homogeneous mixture, followed by removal of the solvent by evaporation or coagulation. The resulting conductive polymeric nanocomposite material exhibits high electrical and thermal conductivity, enhanced mechanical strength, abrasion resistance, and dimensional stability.
    Type: Application
    Filed: October 31, 2003
    Publication date: May 13, 2004
    Inventors: Chyi-Shan Wang, Max D. Alexander
  • Patent number: 6680016
    Abstract: A method of reinforcing a polymeric material with carbon nanofibers is provided in which carbon nanofibers are combined with a polymer and a solvent for the polymer to form a substantially homogeneous mixture, followed by removal of the solvent by evaporation or coagulation. The resulting conductive polymeric nanocomposite material exhibits high electrical and thermal conductivity, enhanced mechanical strength, abrasion resistance, and dimensional stability.
    Type: Grant
    Filed: August 17, 2001
    Date of Patent: January 20, 2004
    Assignee: University of Dayton
    Inventors: Chyi-Shan Wang, Max D. Alexander
  • Publication number: 20030039816
    Abstract: A method of reinforcing a polymeric material with carbon nanofibers is provided in which carbon nanofibers are combined with a polymer and a solvent for the polymer to form a substantially homogeneous mixture, followed by removal of the solvent by evaporation or coagulation. The resulting conductive polymeric nanocomposite material exhibits high electrical and thermal conductivity, enhanced mechanical strength, abrasion resistance, and dimensional stability.
    Type: Application
    Filed: August 17, 2001
    Publication date: February 27, 2003
    Inventors: Chyi-Shan Wang, Max D. Alexander
  • Patent number: 6228922
    Abstract: A method is provided for forming a highly conductive metal-containing polymer fiber or sheet in which a polymer is immersed in a solution containing a metal precursor selected from organic or inorganic salts of copper, silver, aluminum, gold, iron and nickel. The metal precursor is then reduced by chemical, electrochemical, or thermal means such that conductive metal is incorporated into the polymer.
    Type: Grant
    Filed: January 19, 1999
    Date of Patent: May 8, 2001
    Assignee: The University of Dayton
    Inventors: Chyi-Shan Wang, Jar-Wha Lee, Richard A. Vaia
  • Patent number: 6228285
    Abstract: A method for processing thermally intractable rigid-chain polymers into shaped structural articles is provided. The method includes dissolving a rigid-chain polymer in sulfuric acid at a concentration and temperature sufficient to form a nematic liquid crystalline solution which is then formed into a shaped article and cooled to a solid. The solution undergoes a phase transformation upon cooling from a liquid crystalline phase to a solid phase containing crystal solvates. The method allows rigid-chain polymers to be formed into fibers, bulk structural components, fiber reinforced composites and other structural materials without undergoing significant shrinkage or deformation.
    Type: Grant
    Filed: June 3, 1998
    Date of Patent: May 8, 2001
    Assignee: The University of Dayton
    Inventors: Chyi-Shan Wang, Jar-Wha Lee
  • Patent number: 5770121
    Abstract: A method for preparing optical quality, thin films of polymers and co-polymers, as well as blends of such polymers or co-polymers with flexible polymers and co-polymers which comprises(a) preparing a solution of the polymer or co-polymer or blend in a suitable solvent;(b) forming a film from the solution;(c) cooling the thus-formed film to a temperature below the freezing point of the solvent; and(d) dissolving the solvent out of said film at a temperature below the melting point of the solvent.This method can be employed to prepare films of high optical clarity for electro-optical device applications. Because of their thermal stability, mechanical strength and chemical resistance, films prepared according to this method can also be used as filters and separation membranes.
    Type: Grant
    Filed: November 18, 1996
    Date of Patent: June 23, 1998
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Chyi-Shan Wang, Jar-Wha Lee, D. Mark Husband
  • Patent number: 5492666
    Abstract: A method for preparing optical quality, thin films of rigid-rod polymers and co-polymers, as well as blends of such polymers or co-polymers with flexible coil-like aromatic heterocyclic polymers and co-polymers which comprises(a) preparing a solution of the rigid-rod polymer or co-polymer or blend in a suitable solvent;(b) forming a film from the solution;(c) exposing the film to a non-solvent vapor for about 1 to 5 minutes per micron thickness in the finished film; and(d) coagulating the film in a non-solvent.This method can be employed to prepare films of high nonlinear optical susceptibility for electro-optical device applications. Because of their thermal stability, mechanical strength and chemical resistance, films prepared according to this method can also be used as filters and separation membranes.
    Type: Grant
    Filed: October 20, 1994
    Date of Patent: February 20, 1996
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Chyi-Shan Wang, Jar-Wha Lee, D. Mark Husband
  • Patent number: 5021517
    Abstract: A process for fabricating rod-like aromatic heterocyclic polymer-reinforced composite materials into shaped articles which comprises the steps of:(a) dissolving a rigid-rod aromatic heterocyclic polymer and a flexible, coil-like thermoplastic polymer in a common solvent at a concentration less than the critical concentration point of the solution;(b) extruding the solution resulting from step (a) into a liquid bath for removing the solvent;(c) placing the extrudate from step (b), in the liquid-wet state, into a mold, and consolidating the extrudate in the mold to provide a molded article;(d) drying the molded article resulting from step (c); and(e) compression molding the article to provide a fully consolidated, solid article.
    Type: Grant
    Filed: April 28, 1989
    Date of Patent: June 4, 1991
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Chyi-Shan Wang, Ivan J. Goldfarb, Thaddeus E. Helminiak