Patents by Inventor Cindy Chou

Cindy Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Low inductance power electronics assembly
    Patent number: 8279620
    Abstract: A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.
    Type: Grant
    Filed: December 7, 2009
    Date of Patent: October 2, 2012
    Assignee: GM Global Technology Operations LLC
    Inventors: Nicholas Hayden Herron, Brooks S. Mann, Mark D. Korich, Cindy Chou, David Tang, Douglas S. Carlson, Alan L. Barry
  • PRINTED CIRCUIT BOARD
    Publication number: 20110168435
    Abstract: A printed circuit board includes, but is not limited to, a plurality of electrically conductive layers and a plurality of dielectric layers. Each dielectric layer is interposed between adjacent conductive layers to form a body of alternate conductive layers and dielectric layers. At least one of the electrically conductive layers protrudes beyond an end of the body.
    Type: Application
    Filed: January 13, 2010
    Publication date: July 14, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: ALAN L. BARRY, ELI B. SMITH, BROOKS S. MANN, NICHOLAS HAYDEN HERRON, MARK D. KORICH, DAVID TANG, CINDY CHOU
  • LOW INDUCTANCE POWER ELECTRONICS ASSEMBLY
    Publication number: 20110069466
    Abstract: A power electronics assembly is provided. A first support member includes a first plurality of conductors. A first plurality of power switching devices are coupled to the first support member. A first capacitor is coupled to the first support member. A second support member includes a second plurality of conductors. A second plurality of power switching devices are coupled to the second support member. A second capacitor is coupled to the second support member. The first and second pluralities of conductors, the first and second pluralities of power switching devices, and the first and second capacitors are electrically connected such that the first plurality of power switching devices is connected in parallel with the first capacitor and the second capacitor and the second plurality of power switching devices is connected in parallel with the second capacitor and the first capacitor.
    Type: Application
    Filed: December 7, 2009
    Publication date: March 24, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: NICHOLAS HAYDEN HERRON, BROOKS S. MANN, MARK D. KORICH, CINDY CHOU, DAVID TANG, DOUGLAS S. CARLSON, ALAN L. BARRY