Patents by Inventor Cindy R. Simpson

Cindy R. Simpson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming a semiconductor device
    Patent number: 6218302
    Abstract: An interconnect (60) is formed overlying a substrate (10). In one embodiment, an adhesion/barrier layer (81), a copper-alloy seed layer (42), and a copper film (43) are deposited overlying the substrate (10), and the substrate (10) is annealed. In an alternate embodiment, a copper film is deposited over the substrate, and the copper film is annealed. In yet another embodiment, an adhesion/barrier layer (81), a seed layer (82), a conductive film (83), and a copper-alloy capping film (84) are deposited over the substrate (10) to form an interconnect (92). The deposition and annealing steps can be performed on a common processing platform.
    Type: Grant
    Filed: July 21, 1998
    Date of Patent: April 17, 2001
    Assignee: Motorola Inc.
    Inventors: Gregor Braeckelmann, Ramnath Venkatraman, Matthew Thomas Herrick, Cindy R. Simpson, Robert W. Fiordalice, Dean J. Denning, Ajay Jain, Cristiano Capasso