Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.

Abstract: Glass articles having a glass layer with a top a top surface, a bottom surface, and a thickness in the range of 10 microns to 200 microns, and having: a top polymeric coating layer disposed on the top surface of the glass layer with a thickness in the range of 0.1 microns to 10 microns; and/or a bottom polymeric coating layer disposed on the bottom surface of the glass layer with a thickness in the range of 0.1 microns to 10 microns. The glass articles may achieve a bend radius of 10 mm or less. The glass articles may have a shatter resistance defined by the capability of the glass article to avoid ejection of glass shard particles from the glass article upon bending to a failure bend radius.

Abstract: A glass ribbon includes a first major surface extending along a first plane. The glass ribbon includes a second major surface extending along a second plane substantially parallel to the first plane. A first thickness is defined between the first major surface and the second major surface along a thickness direction perpendicular to the first major surface. The first thickness is within a range from about 25 ?m to about 125 ?m. An edge surface extends between the first plane and the second plane. The edge surface comprises a height in the thickness direction that is less than the first thickness. Methods of manufacturing a glass ribbon are also provided.

Abstract: A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.