Patents by Inventor Clark Nguyen

Clark Nguyen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240170290
    Abstract: Methods for selective deposition of precursor materials and related devices are provided. The methods comprise obtaining a structure. The structure comprises a non-dielectric material, and a dielectric material. The methods comprise contacting the structure with a molybdenum precursor under conditions, so as to obtain a molybdenum material on at least a portion of the non-dielectric material. The molybdenum material is not deposited on the dielectric material under the conditions.
    Type: Application
    Filed: November 6, 2023
    Publication date: May 23, 2024
    Inventors: Philip S. H. Chen, Shawn Duc Nguyen, Bryan Clark Hendrix
  • Publication number: 20070046398
    Abstract: Micromechanical structures having at least one lateral capacitive transducer gap filled with a dielectric and method of making same are provided. VHF and UHF MEMS-based vibrating micromechanical resonators filled with new solid dielectric capacitive transducer gaps to replace previously used air gaps have been demonstrated at 160 MHz, with Q's˜20,200 on par with those of air-gap resonators, and motional resistances (Rx's) more than 8× smaller at similar frequencies and bias conditions. This degree of motional resistance reduction comes about via not only the higher dielectric constant provided by a solid-filled electrode-to-resonator gap, but also by the ability to achieve smaller solid gaps than air gaps. These advantages with the right dielectric material may now allow capacitively-transduced resonators to match to the 50-377? impedances expected by off-chip components (e.g., antennas) in many wireless applications without the need for high voltages.
    Type: Application
    Filed: August 28, 2006
    Publication date: March 1, 2007
    Inventors: Clark Nguyen, Yu-Wei Lin, Sheng-Shian Li, Yuan Xie
  • Publication number: 20050206479
    Abstract: High-Q micromechanical resonator devices and filters utilizing same are provided. The devices and filters include a vibrating polysilicon micromechanical “hollow-disk” ring resonators obtained by removing quadrants of material from solid disk resonators, but purposely leaving intact beams or spokes of material with quarter-wavelength dimensions to non-intrusively support the resonators. The use of notched support attachments closer to actual extensional ring nodal points further raises the Q. Vibrating micromechanical hollow-disk ring filters including mechanically coupled resonators with resonator Q's greater than 10,000 achieve filter Q's on the order of thousands via a low-velocity coupling scheme. A longitudinally mechanical spring is utilized to attach the notched-type, low-velocity coupling locations of the resonators in order to achieve a extremely narrow passband.
    Type: Application
    Filed: January 21, 2005
    Publication date: September 22, 2005
    Inventors: Clark Nguyen, Sheng-Shian Li
  • Publication number: 20050174197
    Abstract: A micromechanical resonate device having an extensional wine-glass mode shape is described herein. Different embodiments of the device may employ vibrating polysilicon micromechanical ring resonators, utilizing a unique extensional wine-glass mode shape to achieve lower impedance than previous UHF resonators at frequencies as high as 1.2-GHz with a Q of 3,700, and 1.47-GHz (highest to date for polysilicon micromechanical resonators) with a Q of 2,300. The 1.2-GHz resonator exhibits a measured motional resistance of 560 k? with a dc-bias voltage of 20V, which is 6× lower than measured on radial contour mode disk counterparts at the same frequency, and which can be driven down as low as 2 k? when a dc-bias voltage of 100V and electrode-to-resonator gap spacing of 460 ? are used.
    Type: Application
    Filed: November 17, 2004
    Publication date: August 11, 2005
    Inventors: Clark Nguyen, Yuan Xie