Abstract: Various circuit boards and systems are disclosed. In one aspect a system includes a circuit board and n differential signal via pairs. Each of the n differential signal via pairs has a first signal via and a second signal via and an electrical wall between the first signal via and the second signal via. There is a midline between every two adjacent differential via pairs. There are n ground return path vias. Each of the n ground return path vias is positioned substantially along one of the midlines and not on one of the electrical walls.

Abstract: Various circuit boards and systems are disclosed. In one aspect a system includes a circuit board and n differential signal via pairs. Each of the n differential signal via pairs has a first signal via and a second signal via and an electrical wall between the first signal via and the second signal via. There is a midline between every two adjacent differential via pairs. There are n ground return path vias. Each of the n ground return path vias is positioned substantially along one of the midlines and not on one of the electrical walls.

Abstract: In methods and circuits for using associated circuitry to enhance performance of a micro-electromechanical switch, one of the method embodiments is a contact conditioning process including applying a time-varying voltage to the control element of a closed switch. In another embodiment, a voltage profile applied to the control element of the switch can be tailored to improve the actuation speed or reliability of the switch. In another method embodiment, the performance of a switch may be evaluated by measuring a performance parameter, and corrective action initiated if the switch performance is determined to need improvement. An embodiment of a circuit for maintaining performance of a micro-electromechanical switch includes first and second signal line nodes, sensing circuitry coupled to the signal line nodes and adapted to sense a performance parameter value of the switch, and control circuitry operably coupled to at least one terminal of the switch.

Abstract: In methods and circuits for using associated circuitry to enhance performance of a micro-electromechanical switch, one of the method embodiments is a contact conditioning process including applying a time-varying voltage to the control element of a closed switch. In another embodiment, a voltage profile applied to the control element of the switch can be tailored to improve the actuation speed or reliability of the switch. In another method embodiment, the performance of a switch may be evaluated by measuring a performance parameter, and corrective action initiated if the switch performance is determined to need improvement. An embodiment of a circuit for maintaining performance of a micro-electromechanical switch includes first and second signal line nodes, sensing circuitry coupled to the signal line nodes and adapted to sense a performance parameter value of the switch, and control circuitry operably coupled to at least one terminal of the switch.

Abstract: In methods and circuits for using associated circuitry to enhance performance of a micro-electromechanical switch, one of the method embodiments is a contact conditioning process including applying a time-varying voltage to the control element of a closed switch. In another embodiment, a voltage profile applied to the control element of the switch can be tailored to improve the actuation speed or reliability of the switch. In another method embodiment, the performance of a switch may be evaluated by measuring a performance parameter, and corrective action initiated if the switch performance is determined to need improvement. An embodiment of a circuit for maintaining performance of a micro-electromechanical switch includes first and second signal line nodes, sensing circuitry coupled to the signal line nodes and adapted to sense a performance parameter value of the switch, and control circuitry operably coupled to at least one terminal of the switch.

Abstract: In methods and circuits for using associated circuitry to enhance performance of a micro-electromechanical switch, one of the method embodiments is a contact conditioning process including applying a time-varying voltage to the control element of a closed switch. In another embodiment, a voltage profile applied to the control element of the switch can be tailored to improve the actuation speed or reliability of the switch. In another method embodiment, the performance of a switch may be evaluated by measuring a performance parameter, and corrective action initiated if the switch performance is determined to need improvement. An embodiment of a circuit for maintaining performance of a micro-electromechanical switch includes first and second signal line nodes, sensing circuitry coupled to the signal line nodes and adapted to sense a performance parameter value of the switch, and control circuitry operably coupled to at least one terminal of the switch.

Abstract: In methods and circuits for using associated circuitry to enhance performance of a micro-electromechanical switch, one of the method embodiments is a contact conditioning process including applying a time-varying voltage to the control element of a closed switch. In another embodiment, a voltage profile applied to the control element of the switch can be tailored to improve the actuation speed or reliability of the switch. In another method embodiment, the performance of a switch may be evaluated by measuring a performance parameter, and corrective action initiated if the switch performance is determined to need improvement. An embodiment of a circuit for maintaining performance of a micro-electromechanical switch includes first and second signal line nodes, sensing circuitry coupled to the signal line nodes and adapted to sense a performance parameter value of the switch, and control circuitry operably coupled to at least one terminal of the switch.

Abstract: An apparatus and method of fabricating and operating a micro-electromechanical systems (MEMS) integrated optical structure is disclosed. Micro-optics is integrated with MEMS actuators to provide a building block for a micro-optical communication device. Such micro-optical communication device may realize a variety of optical communication systems including optical interconnects, laser communications, or fiber optic switches. In accordance with one aspect of the present invention, a micro-optical element such as a micro-lens is advantageously integrated with an actuator such as MEMS comb drive actuator to form a MEMS lens assembly. The MEMS lens assembly is further coupled to an optical source which may provide a MEMS integrated micro-optical communication device. This integration substantially obviates the generally needed external or manual positioning of the micro-optical element to align a light beam or an optical signal being emitted from the optical source.

Abstract: An apparatus and method for a micro-electromechanical systems (MEMS) actuator such as a MEMS two-dimensional electrostatic comb drive having springs being advantageously configured to provide relatively large movements in first and second directions. In one embodiment, a comb drive apparatus includes a first set of comb pairs; a second set of comb pairs coupled to the first set of comb pairs; a stage coupled to the first and second sets of comb pairs; a first plurality of springs interposed between the second set of comb pairs and the stage and between the second set of comb pairs and the first set of comb pairs for movably coupling the second set of comb pairs to the stage and to the first set of comb pairs; and a second plurality of springs interposed between the first set of comb pairs and the stage and between the first set of comb pairs and the second set of comb pairs for movably coupling the first set of comb pairs to the stage and to the second set of comb pairs.

Abstract: An electronic device, such as a filter or phase shifter, for example, includes a substrate, and a MEMS capacitor on the substrate and having a plurality of selectable capacitance values. The MEMS capacitor preferably includes a lower capacitor electrode on the substrate, and a movable bridge including end portions connected to the substrate laterally adjacent the lower capacitor electrode. The movable bridge may also include a conductive medial portion between the end portions defining an upper capacitor electrode suspended above the lower capacitor electrode and being movable between an upper position and a lower position by an electrostatic force generated between the capacitor electrodes. The upper and lower positions provide respective low and high selectable capacitance values.

Abstract: An apparatus and method of fabricating and operating a micro-electromechanical systems (MEMS) integrated optical structure is disclosed. Micro-optics is integrated with MEMS actuators to provide a building block for a micro-optical communication device. Such micro-optical communication device may realize a variety of optical communication systems including optical interconnects, laser communications, or fiber optic switches. In accordance with one aspect of the present invention, a micro-optical element such as a micro-lens is advantageously integrated with an actuator such as MEMS comb drive actuator to form a MEMS lens assembly. The MEMS lens assembly is further coupled to an optical source which may provide a MEMS integrated micro-optical communication device. This integration substantially obviates the generally needed external or manual positioning of the micro-optical element to align a light beam or an optical signal being emitted from the optical source.

Abstract: A system and method for producing uniform energy dissipation in display pixels with widely varying electrical characteristics in order to equalize light output and improve yield within a matrix addressable display panel. The present invention is implemented within a driver circuit utilizing the concept of current integration. A reference voltage, which is proportional to the most efficient pixel within the display is compared to the energy dissipated within a particular pixel during illumination of that pixel. A current mirror circuit supplies a current equivalent to the current provided to the object pixel to an integrator circuit resulting in a rising voltage within the integrator circuit. The rising voltage is proportional to the energy being dissipated within the current pixel. Once the rising voltage is equal to or greater than the reference voltage, current is removed from the object pixel.

Abstract: A wireless telephone network includes a distribution network having fixed stations and wireless digital telephones linked by radio to the fixed stations, an integrated services digital public switching telephone network to which each fixed station is connected by a user to user signaling channel, service control points connected to the public switching telephone network and each having a wireless telephone service subscriber database and a call processing device, and a service management system having a reference database. The network is maintained on a centralized basis by transmitting a maintenance message from a fixed station to a service control point over the user to user signaling channel in response to the fixed station detecting a fault, generating a maintenance ticket at the service control point, transmitting the maintenance ticket to the service control point, and storing the maintenance ticket in the database.

Abstract: A plurality of thin flat parallel positioned thermal conductive fins adapted to be connected to an object and a gas passageway passing between adjacent fins and extending between the top of the fins and opposite sides. Gas guides are positioned between adjacent fins at the center of the plurality of fins and redirect the outlet end of the passageways normal to the inlet ends of the passageways. Alternately positioned fins face in opposing directions. The fins may be integrally formed or individually formed. A thermal conductive base may be provided at the bottom of the plurality of fins for connection to an electronic package.

Abstract: An apparatus and method for measuring the electric properties of solid matter which provides data for determining the polarizability of the electron distributions contained therein is disclosed. A sample of the solid to be studied is placed between the plates of a capacitor where it acts as a dielectric. The sample is excited by the interaction of electromagnetic radiation with an atomic species contained in the sample. The voltage induced across the capacitor is then measured as a function of time with the aid of a high Q circuit tuned to a frequency related to the frequency of the applied electromagnetic energy.

Abstract: A plurality of thin flat parallel positioned thermal conductive fins adapted to be connected to an object and a gas passageway passing between adjacent fins and extending between the top of the fins and opposite sides. Gas guides are positioned between adjacent fins at the center of the plurality of fins and redirect the outlet end of the pasageways normal to the inlet ends of the passageways. Alternately positioned fins face in opposing directions. The fins may be integrally formed or individually formed. A thermal conductive base may be provided at the bottom of the plurality of fins for connection to an electronic package.

Abstract: An automatic Q-spoiler comprising at least one Josephson tunnel junction connected in an LC circuit for flow of resonant current therethrough. When in use in a system for detecting the magnetic resonance of a gyromagnetic particle system, a high energy pulse of high frequency energy irradiating the particle system will cause the critical current through the Josephson tunnel junctions to be exceeded, causing the tunnel junctions to act as resistors and thereby damp the ringing of the high-Q detection circuit after the pulse. When the current has damped to below the critical current, the Josephson tunnel junctions revert to their zero-resistance state, restoring the Q of the detection circuit and enabling the low energy magnetic resonance signals to be detected.

Abstract: A low noise radiofrequency amplifier (10), using a dc SQUID (superconducting quantum interference device) as the input amplifying element. The dc SQUID (11) and an input coil (12) are maintained at superconductivity temperatures in a superconducting shield (13), with the input coil (12) inductively coupled to the superconducting ring (17) of the dc SQUID (11). A radiofrequency signal from outside the shield (13) is applied to the input coil (12), and an amplified radiofrequency signal is developed across the dc SQUID ring (17) and transmitted to exteriorly of the shield (13). A power gain of 19.5.+-.0.5 dB has been achieved with a noise temperature of 1.0.+-.0.4 K. at a frequency of 100 MHz.