Abstract: Device comprising a carrier (100) and at least one cover (104) able to be bonded to the carrier to form with the carrier at least one cavity (114) having a controlled atmosphere around at least one component (102). In accordance with the invention, at least one of either the cover or the carrier is provided with at least one wedge (110) in fusible material and a strip of insulation (112) formed around said component, and before bonding, the wedge of fusible material is of sufficient thickness to prevent the strip of insulation (112) from coming into contact both with the cover and with the carrier when they are assembled together. Particular application to the encapsulation of electronic, mechanical or electromagnetic components.

Abstract: A process for manufacturing an anisotropic conducting film including an insulating film in which holes are formed. Conducting inserts are located in the holes. First ends of the inserts project from one side of the insulating film, from a substrate in which compartments are formed on one surface, corresponding to the distribution of inserts on the insulating film, the shape of the compartments being complementary to the shape of the first ends of the inserts. The manufacturing process includes the steps of using a substrate with compartments with a tipped finish, producing an insulating film above the substrate with holes facing the compartments, producing conducting inserts in the holes and the compartments, and separating the insulating film in which the conducting inserts are formed.

Abstract: An optically aligned optical component assembly. Each optical component has a plurality of first fastening studs. The surface of a support is provided with second fastening studs, where the second studs are formed with parts made of a material that can be soldered to the studs. The optical components are assembled onto the support using corresponding parts. The volume of each part is determined so that the components are optically aligned along a direction that is perpendicular to the surface of the support. This is especially used in the field of microelectronics.

Abstract: Support for an electrochemical deposit, comprising a substrate (120) and, on the latter, a plurality of first conductive surfaces (128) able to form electrodes, at least one second conductive surface (116) for forming a counterelectrode and means (130, 132, 133, 135) for connecting said first conductive surfaces and said second conductive surface to a voltage source.

Abstract: An apparatus for the propagation of microwaves, particularly ultrahigh frequency waves. A substrate has formed therein a cavity open on one of the sides of the substrate. A membrane is deposited on the substrate above the cavity. At least one transmission line is located on the membrane which is able to propagate an ultrahigh frequency wave. An integrated circuit for rigidifying the membrane is fixed to the transmission line or to the membrane on the side where the line is located.

Abstract: A heating device is provided for connecting by means of a melting material to a connection support at least one component mounted on the support in at least one connection region at the periphery of the support. The device locally heats the support and/or the component in the connection region. Particular utility for the present invention is found in the area of production of flat display screens, although other utilities are also contemplated.

Abstract: Three-dimensional multichip module.The invention relates to a three-dimensional or 3D multichip module having a plurality of bidimensional, elementary electronic modules (4a-4d), each incorporating at least one chip (10a-10d), a support (6a-6d) on which is placed the chip and a conductive interconnection network or array (8a-8d) covering an upper surface of the support. These elementary modules are substantially superimposed in a displaced manner (in the form of a staircase) and are interconnected by means of their interconnection networks and connection pads (12a-12d) placed on those parts of the elementary modules not covered by the upper elementary module.Application to the association of integrated circuits in microconnection technology.

Abstract: Flat electrical connecting cable with controlled electrical and thermal resistances.It comprises a flat insulating support, on which are installed connecting lines constituted by two superimposed layers. The first of them is constituted by a poor heat conducting material, such a manganin, while the second is discontinuous andis formed from a very good electric conducting material, such as copper. The segments on which the second layer is installed are thermally insulated an at uniform temperature. It is possible to vary the conductivity of the different layers by acting on the thickness and width thereof.This invention is applicable in industries such as cryogenics and space, as well as all applications functioning between a cold source and hot source, where it is wished to control the heat exchanges.

Abstract: A microconnector with a high density of contacts which make it possible to connect N parallel electrodes to N electrical conductors. The microconnector comprises a support able to receive the electrodes, N electrically conductive, flexible, elastic wires, respectively connected to the N conductors and fixed to an insulating part movable relative to said support in such a way that the wires are parallel and each of them can come into contact with a single electrode as a result of a displacement of the insulating part when the electrodes are fitted in the support. A cam is provided for moving the part in such a way as to bring about simultaneous contacts between the respective electrodes and wires. The microconnector can be used in connection with flat screen display means.