Abstract: Various embodiments for an improved cutting instrument defining one or more angularly-oriented cutting fasciae having uniform cutting surfaces with reduced surface topography are disclosed.

Abstract: Chemical-mechanical polishing (CMP) systems comprising apparatus and methods which allow the physical and chemical characteristics of a CMP slurry to be monitored during the polishing process, both on the pad and in the fresh slurry, are provided. The methods and apparatus of the invention also furnish the CMP operator with real-time information about the polishing process, which can provide insight into various chemical and physical mechanisms involved in chemical-mechanical polishing. The data provided by the sensors also make available valuable information about the stability and reproducibility of the particular CMP process being observed.

Abstract: The invention is directed to a method for polishing a surface comprising tungsten carbide, comprising contacting a surface comprising tungsten carbide with an oxidizing agent, a polishing component, and a liquid carrier, and abrading at least a portion of the surface to polish the surface. The invention further provides a method for reconditioning a workpiece comprising tungsten carbide. The invention also provides a cutting tool insert having a highly polished surface.

Abstract: Chemical-mechanical polishing (CMP) systems comprising apparatus and methods which allow the physical and chemical characteristics of a CMP slurry to be monitored during the polishing process, both on the pad and in the fresh slurry, are provided. The methods and apparatus of the invention also furnish the CMP operator with real-time information about the polishing process, which can provide insight into various chemical and physical mechanisms involved in chemical-mechanical polishing. The data provided by the sensors also make available valuable information about the stability and reproducibility of the particular CMP process being observed.

Abstract: Methods for ameliorating tissue trauma from a surgical incision comprise making the surgical incision with a cutting instrument comprising a cutting instrument body defining two opposed sides and a direction of elongation, and having at least one cutting edge extending along the direction of elongation. The cutting edge defines an ultimate edge and two beveled faces adjacent the ultimate edge. The cutting edge of the cutting instrument has at least one characteristic selected from the group consisting of (a) a uniform ultimate edge having a maximum height deviation of 4 m or less along any 680 m segment of thereof; (b) each beveled face having a maximum height deviation of 4 m or less along any 680 m segment of thereof; and (c) each beveled face adjacent the ultimate edge having a root mean square surface roughness (Rq) of not more than about 200 nm. Improved cutting instruments are also provided.

Abstract: The invention is directed to a method for polishing a surface comprising tungsten carbide, comprising contacting a surface comprising tungsten carbide with an oxidizing agent, a polishing component, and a liquid carrier, and abrading at least a portion of the surface to polish the surface. The invention further provides a method for reconditioning a workpiece comprising tungsten carbide. The invention also provides a cutting tool insert having a highly polished surface.

Abstract: The invention is directed to a method for polishing a cutting edge on a cutting instrument, comprising contacting a cutting edge of a cutting instrument with a polishing pad and a chemical-mechanical polishing composition comprising particles of an abrasive, and a liquid carrier, wherein the abrasive is suspended in the liquid carrier, and abrading at least a portion of the cutting edge to polish the cutting edge. The invention further provides a cutting instrument having a highly uniform edge.

Abstract: The invention is directed to a method for polishing a cutting edge on a cutting instrument, comprising contacting a cutting edge of a cutting instrument with a polishing pad and a chemical-mechanical polishing composition comprising particles of an abrasive, and a liquid carrier, wherein the abrasive is suspended in the liquid carrier, and abrading at least a portion of the cutting edge to polish the cutting edge. The invention further provides a cutting instrument having a highly uniform edge.