Abstract: An injection moldable composition, comprising: A) a silicone resin (I) [R13SiO1/2]a[R2R3SiO2/2]b[SiO4/2]c, wherein R1, R2, and R3 are hydrocarbyl, hydrocarbyloxy, or hydroxyl, at least one of R2 or R3 is alkenyl, subscripts a, b, and c are each >0 and a+b+c=1, B) 0 to 90% (w/w), based on the weight of A) and B), of a silicone resin (II) [R43SiO1/2]d[SiO4/2]e wherein R4 is hydrocarbyl, hydrocarbyloxy, or hydroxyl, at least one of R4 is alkenyl, subscripts d and e are each >0, and d+e=1, C) a siloxane polymer having formula (III), [R53SiO1/2]fR6R7SiO2/2]g. wherein R5-7 are hydrocarbyl or hydroxyl, at least one of R5-7 is alkenyl, subscripts f and g are each >0, and f+g=1, D) a silicone crosslinker having at least two silicon-bonded hydrogen atoms per molecule, and E) a hydrosilylation catalyst, wherein the ratio of silicon-bonded hydrogen atoms to carbon-carbon double bonds is from 1.2 to 2.2.

Abstract: An injection moldable composition, comprising: A) a silicone resin (I) [R13SiO1/2]a[R2R3SiO2/2]b[SiO4/2]c, wherein R1, R2, and R3 are hydrocarbyl, hydrocarbyloxy, or hydroxyl, at least one of R2 or R3 is alkenyl, subscripts a, b, and c are each >0 and a+b+c=1, B) 0 to 90% (w/w), based on the weight of A) and B), of a silicone resin (II) [R43SiO1/2]d[SiO4/2]e wherein R4 is hydrocarbyl, hydrocarbyloxy, or hydroxyl, at least one of R4 is alkenyl, subscripts d and e are each >0, and d+e=1, C) a siloxane polymer having formula (III), [R53SiO1/2]fR6R7SiO2/2]g. wherein R5-7 are hydrocarbyl or hydroxyl, at least one of R5-7 is alkenyl, subscripts f and g are each >0, and f+g=1, D) a silicone crosslinker having at least two silicon-bonded hydrogen atoms per molecule, and E) a hydrosilylation catalyst, wherein the ratio of silicon-bonded hydrogen atoms to carbon-carbon double bonds is from 1.2 to 2.2.

Abstract: A method for producing silicon carbide substrates fit for epitaxial growth in a standard epitaxial chamber normally used for silicon wafers processing. Strict limitations are placed on any substrate that is to be processed in a chamber normally used for silicon substrates, so as to avoid contamination of the silicon wafers. To take full advantage of standard silicon processing equipment, the SiC substrates are of diameter of at least 150 mm. For proper growth of the SiC boule, the growth crucible is made to have interior volume that is six to twelve times the final growth volume of the boule. Also, the interior volume of the crucible is made to have height to width ratio of 0.8 to 4.0. Strict limits are placed on contamination, particles, and defects in each substrate.

Abstract: A method for producing silicon carbide substrates fit for epitaxial growth in a standard epitaxial chamber normally used for silicon wafers processing. Strict limitations are placed on any substrate that is to be processed in a chamber normally used for silicon substrates, so as to avoid contamination of the silicon wafers. To take full advantage of standard silicon processing equipment, the SiC substrates are of diameter of at least 150 mm. For proper growth of the SiC boule, the growth crucible is made to have interior volume that is six to twelve times the final growth volume of the boule. Also, the interior volume of the crucible is made to have height to width ratio of 0.8 to 4.0. Strict limits are placed on contamination, particles, and defects in each substrate.

Abstract: A method for producing silicon carbide substrates fit for epitaxial growth in a standard epitaxial chamber normally used for silicon wafers processing. Strict limitations are placed on any substrate that is to be processed in a chamber normally used for silicon substrates, so as to avoid contamination of the silicon wafers. To take full advantage of standard silicon processing equipment, the SiC substrates are of diameter of at least 150 mm. For proper growth of the SiC boule, the growth crucible is made to have interior volume that is six to twelve times the final growth volume of the boule. Also, the interior volume of the crucible is made to have height to width ratio of 0.8 to 4.0. Strict limits are placed on contamination, particles, and defects in each substrate.

Abstract: A method for producing silicon carbide substrates fit for epitaxial growth in a standard epitaxial chamber normally used for silicon wafers processing. Strict limitations are placed on any substrate that is to be processed in a chamber normally used for silicon substrates, so as to avoid contamination of the silicon wafers. To take full advantage of standard silicon processing equipment, the SiC substrates are of diameter of at least 150 mm. For proper growth of the SiC boule, the growth crucible is made to have interior volume that is six to twelve times the final growth volume of the boule. Also, the interior volume of the crucible is made to have height to width ratio of 0.8 to 4.0. Strict limits are placed on contamination, particles, and defects in each substrate.