Patents by Inventor Clyde Browning

Clyde Browning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reducing shot count in direct writing by a particle or photon beam
    Patent number: 10197909
    Abstract: A method for transferring a fractured pattern decomposed into elementary shapes, onto a substrate by direct writing by a particle or photon beam, comprises a step of identifying at least one elementary shape of the fractured pattern, called removable elementary shape, whose removal induces modifications of the transferred pattern within a preset tolerance envelope; a step of removing the removable shape or shapes from the fractured pattern to obtain a modified fractured pattern; and an exposure step, comprising exposing the substrate to a plurality of shots of a shaped particle or photon beam, each shot corresponding to an elementary shape of the modified fractured pattern. A computer program product for carrying out such a method is provided.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: February 5, 2019
    Inventors: Luc Martin, Thomas Quaglio, Matthieu Millequant, Clyde Browning, Serdar Manakli
  • METHOD OF REDUCING SHOT COUNT IN DIRECT WRITING BY A PARTICLE OR PHOTON BEAM
    Publication number: 20170097571
    Abstract: A method for transferring a fractured pattern decomposed into elementary shapes, onto a substrate by direct writing by a particle or photon beam, comprises a step of identifying at least one elementary shape of the fractured pattern, called removable elementary shape, whose removal induces modifications of the transferred pattern within a preset tolerance envelope; a step of removing the removable shape or shapes from the fractured pattern to obtain a modified fractured pattern; and an exposure step, comprising exposing the substrate to a plurality of shots of a shaped particle or photon beam, each shot corresponding to an elementary shape of the modified fractured pattern. A computer program product for carrying out such a method is provided.
    Type: Application
    Filed: October 5, 2016
    Publication date: April 6, 2017
    Inventors: Luc MARTIN, Thomas QUAGLIO, Matthieu MILLEQUANT, Clyde BROWNING, Serdar MANAKLI
  • WAFER AND METHOD OF FORMING ALIGNMENT MARKERS
    Publication number: 20090134496
    Abstract: A wafer comprises a multi-layer structure. The multi-layer structure includes a first device structure neighbouring an area for receiving alignment markers. A plurality of alignment markers extend into the multi-layer structure and are located within the area for receiving alignment markers. The plurality of alignment markers is arranged to prevent propagation of a crack, when occurring, beyond a material-dependent critical length in a part of the multi-layer structure corresponding to the area for receiving the alignment structure. The material-dependent critical length is associated with the part of the multi-layer structure.
    Type: Application
    Filed: July 6, 2006
    Publication date: May 28, 2009
    Applicant: Freescale Semiconductor, Inc.
    Inventors: Scott Warrick, Clyde Browning, Kevin Cooper, Cindy Goldberg, Brad Smith