Abstract: A method and a system for providing source evidence in support of information to be used for conducting a transaction, such as a fairness opinion to be used for a mergers and acquisitions (M&A) transaction, is provided. The method includes displaying, on a screen, a plurality of fields that relate to the transaction; receiving first user inputs that correspond to some of the fields; prompting the user to provide source evidence that relates to the received first user inputs; receiving a second user input that activates a button for accessing a document library; displaying a list of documents included in the document library; receiving third user inputs that correspond to respective documents selected by the user; displaying a content of each selected document; receiving fourth user inputs that correspond to screenshots of respective portions of the displayed content; and automatically linking the screenshots to the corresponding fields.

Abstract: A method and a system for providing source evidence in support of information to be used for conducting a transaction, such as a fairness opinion to be used for a mergers and acquisitions (M&A) transaction, is provided. The method includes displaying, on a screen, a plurality of fields that relate to the transaction; receiving first user inputs that correspond to some of the fields; prompting the user to provide source evidence that relates to the received first user inputs; receiving a second user input that activates a button for accessing a document library; displaying a list of documents included in the document library; receiving third user inputs that correspond to respective documents selected by the user; displaying a content of each selected document; receiving fourth user inputs that correspond to screenshots of respective portions of the displayed content; and automatically linking the screenshots to the corresponding fields.

Abstract: A method and a system for providing source evidence in support of information to be used for conducting a transaction, such as a fairness opinion to be used for a mergers and acquisitions (M&A) transaction, is provided. The method includes displaying, on a screen, a plurality of fields that relate to the transaction; receiving first user inputs that correspond to some of the fields; prompting the user to provide source evidence that relates to the received first user inputs; receiving a second user input that activates a button for accessing a document library; displaying a list of documents included in the document library; receiving third user inputs that correspond to respective documents selected by the user; displaying a content of each selected document; receiving fourth user inputs that correspond to screenshots of respective portions of the displayed content; and automatically linking the screenshots to the corresponding fields.

Abstract: An LVDS device wherein driver and receiver functionalities are integrated in the same package, signals are routed from the individual driver and receiver elements inside the package such that all inputs are one side of the package, and all outputs are on the opposite side of the package, allowing for an optimized signal flow through the package. All required capacitors and resistors are integrated inside the package; no external electronic components are required. All of the above novelties also contribute to a 6:1 reduction in size compared to current state-of-the-art, for the same number of communication channels. Embodiments include a packaging topology adaptable to extreme environments, including radiation tolerant to 300 kRad (based on the die technology), so that module operational temperature is in a range of ?55° C. to +100° C. and storage temperature can be as low as ?184° C.

Abstract: An LVDS device wherein driver and receiver functionalities are integrated in the same package, signals are routed from the individual driver and receiver elements inside the package such that all inputs are one side of the package, and all outputs are on the opposite side of the package, allowing for an optimized signal flow through the package. All required capacitors and resistors are integrated inside the package; no external electronic components are required. All of the above novelties also contribute to a 6:1 reduction in size compared to current state-of-the-art, for the same number of communication channels. Embodiments include a packaging topology adaptable to extreme environments, including radiation tolerant to 300 kRad (based on the die technology), so that module operational temperature is in a range of ?55° C. to +100° C. and storage temperature can be as low as ?184° C.