Patents by Inventor Colin Wei Hong CHUNG

Colin Wei Hong CHUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230331543
    Abstract: Provided is a MEMS device and an electro-acoustic transducer. The MEMS device includes: a substrate having a cavity passing through the substrate; a diaphragm connected to the substrate and covers the cavity. The diaphragm includes oppositely arranged first and second membranes. The first membrane is on one side of the second membrane facing away from the cavity and includes a first protrusion extending away from the second membrane, the first protrusion has a first groove opening towards the second membrane. The second membrane includes a second protrusion extending away from the first membrane and opposite to the first protrusion, the second protrusion has a second groove opening towards the first membrane. By providing first and second protrusions on first and second diaphragms to form a corrugated diaphragm, the internal stress and stiffness of the diaphragm decreases, which effectively increases the mechanical sensitivity of the MEMS device.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 19, 2023
    Inventors: Yannick Pierre Kervran, Euan James Boyd, Colin Robert Jenkins, Colin Wei Hong Chung, Scott Lyall Cargill
  • Patent number: 11743634
    Abstract: An MEMS microphone includes a substrate including a back volume provided inside the substrate and an opening provided at an upper surface of the substrate to communicate the back volume; a sensing device provided at an inner side wall of the back volume; a first cantilever provided inside the back volume and including end portions coupling with the sensing device; a first membrane provided at the opening; a second membrane provided inside the back volume; and second cantilevers, each of which includes a first end mechanically supporting the first cantilever, and a second end connected to the second membrane. By suspending the first cantilever on the second cantilevers, the end portions of the first cantilever always couple with a preset position of the sensing device. Thus, the DC offset of the displacement of the membrane can be prevented.
    Type: Grant
    Filed: May 20, 2021
    Date of Patent: August 29, 2023
    Assignee: AAC Acoustic Technologies (Shenzhen) Co., Ltd.
    Inventors: Euan James Boyd, Anup Patel, Colin Wei Hong Chung
  • Publication number: 20220377453
    Abstract: An MEMS microphone includes a substrate including a back volume provided inside the substrate and an opening provided at an upper surface of the substrate to communicate the back volume; a sensing device provided at an inner side wall of the back volume; a first cantilever provided inside the back volume and including end portions coupling with the sensing device; a first membrane provided at the opening; a second membrane provided inside the back volume; and second cantilevers, each of which includes a first end mechanically supporting the first cantilever, and a second end connected to the second membrane. By suspending the first cantilever on the second cantilevers, the end portions of the first cantilever always couple with a preset position of the sensing device. Thus, the DC offset of the displacement of the membrane can be prevented.
    Type: Application
    Filed: May 20, 2021
    Publication date: November 24, 2022
    Inventors: Euan James Boyd, Anup Patel, Colin Wei Hong Chung
  • Patent number: 11267695
    Abstract: Micro-electro-mechanical system (MEMS) devices are disclosed, including a MEMS device comprising a semiconductor die including integrated circuitry, a structure mounted on the semiconductor die and covering at least a portion of the circuitry, the structure defining a space between the structure and the at least a portion of the circuitry, and a transducer including a membrane, the transducer located outside of the space.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: March 8, 2022
    Assignee: Cirrus Logic, Inc.
    Inventors: James Thomas Deas, Colin Wei Hong Chung, Marek Sebastian Piechocinski
  • Publication number: 20200055726
    Abstract: Micro-electro-mechanical system (MEMS) devices are disclosed, including a MEMS device comprising a semiconductor die including integrated circuitry, a structure mounted on the semiconductor die and covering at least a portion of the circuitry, the structure defining a space between the structure and the at least a portion of the circuitry, and a transducer including a membrane, the transducer located outside of the space.
    Type: Application
    Filed: April 12, 2018
    Publication date: February 20, 2020
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: James Thomas DEAS, Colin Wei Hong CHUNG, Marek Sebastian PIECHOCINSKI
  • Patent number: 10266393
    Abstract: The application describes MEMS transducers having a vent structure provided in a flexible membrane of the vent structure The vent structure comprises at least one moveable portion and the vent structure is configured such that, in response to a differential pressure across the vent structure, the moveable portion is rotatable about first and second axes of rotation, which axes of rotation extend in the plane of the membrane.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: April 23, 2019
    Assignee: Cirrus Logic, Inc.
    Inventors: Colin Wei Hong Chung, Scott Lyall Cargill, Colin Robert Jenkins
  • Publication number: 20170217761
    Abstract: The application describes MEMS transducers having a vent structure provided in a flexible membrane of the vent structure The vent structure comprises at least one moveable portion and the vent structure is configured such that, in response to a differential pressure across the vent structure, the moveable portion is rotatable about first and second axes of rotation, which axes of rotation extend in the plane of the membrane.
    Type: Application
    Filed: January 24, 2017
    Publication date: August 3, 2017
    Applicant: Cirrus Logic International Semiconductor Ltd.
    Inventors: Colin Wei Hong CHUNG, Scott Lyall CARGILL, Colin Robert JENKINS