Abstract: A heating assembly includes: a liquid guiding element; and a heating element arranged on a vaporization surface formed by the liquid guiding element, the heating element being energizable to generate heat. The heating element includes a first heating part and a second heating part. A temperature coefficient of resistance of the first heating part is greater than a temperature coefficient of resistance of the second heating part. The first heating part and the second heating part form an electrical connection structure.

Abstract: This application discloses an optical module. A circuit board is provided with a first heat dissipation member. One end of the first heat dissipation member is attached with an optical chip, with a lens assembly covering the optical chip. The other end extends outwardly from a coverage region of the lens assembly, so that heat generated by the optical chip is diffused to outside of the lens assembly. One end of the first heat dissipation member away from the lens assembly is provided with a second heat dissipation member whose upper surface being provided with a thermally conductive member. An upper surface of the thermally conductive member is thermally coupled with an upper enclosure. The second heat dissipation member conducts the heat diffused by the first heat dissipation member to the upper enclosure via the thermally conductive member. Thus, heat dissipation is achieved via the upper enclosure.