Patents by Inventor Conrad Lepe

Conrad Lepe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods for forming and protecting electrical interconnects and resultant assemblies
    Patent number: 7338149
    Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.
    Type: Grant
    Filed: June 24, 2005
    Date of Patent: March 4, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mohammad Akhavain, Joseph E. Scheffelin, Noah Lassar, Conrad Lepe
  • Methods for forming and protecting electrical interconnects and resultant assemblies
    Publication number: 20050248617
    Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.
    Type: Application
    Filed: June 24, 2005
    Publication date: November 10, 2005
    Inventors: Mohammad Akhavain, Joseph Scheffelin, Noah Lassar, Conrad Lepe
  • Methods for forming and protecting electrical interconnects and resultant assemblies
    Patent number: 6913343
    Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.
    Type: Grant
    Filed: April 30, 2003
    Date of Patent: July 5, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Mohammad Akhavain, Joseph E. Scheffelin, Noah Lassar, Conrad Lepe
  • Methods for forming and protecting electrical interconnects and resultant assemblies
    Publication number: 20040218009
    Abstract: The described embodiments relate to methods and systems for forming and protecting electrical interconnect assemblies. In one embodiment, an electrical interconnect assembly forming method forms an electrical interconnect between one or more conductors of a first support structure and one or more conductors of a second support structure. The method also distributes a generally flowable material over the electrical interconnect and exposes the generally flowable material to conditions sufficient to render the generally flowable material into a generally non-flowable state that provides fluid protection to the electrical interconnect and supports the electrical interconnect to reduce stress concentration at the electrical interconnect.
    Type: Application
    Filed: April 30, 2003
    Publication date: November 4, 2004
    Inventors: Mohammad Akhavain, Joseph E. Scheffelin, Noah Lassar, Conrad Lepe