Abstract: Various implementations include a steam cabinet. The steam cabinet includes at least one chamber wall, a door, at least one heating element, at least one steam generator, a supply fan, and an exhaust fan. The at least one chamber wall defines a processing chamber. The door is for allowing access to the processing chamber. The at least one heating element is configured to provide heat to the processing chamber. The at least one steam generator is configured to provide steam to the processing chamber. The supply fan has a supply fan inlet and a supply fan outlet. The supply fan outlet is in fluid communication with the at least one heating element and the processing chamber. The exhaust fan has an exhaust fan inlet and an exhaust fan outlet. The exhaust fan inlet is in fluid communication with the processing chamber.

Abstract: A memory module is disclosed which is constructed using partially defective synchronous memory devices, such as SDRAM components. The multiple partially defective SDRAM components are configured to provide a reliable and nondefective memory module that takes advantage of the manner in which defective cells are localized on each SDRAM component.

Abstract: A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the daughter boards have mounted connectors so that the boards can be electronically and mechanically interconnected with another board.

Abstract: Memory module using partially defective synchronous memory devices, such as SDRAM components. Multiple partially defective SDRAM components are configured to provide a reliable and nondefective memory module that takes advantage of the manner in which defective cells are localized on each SDRAM component.

Abstract: The use of a partially defective memory array to create a non-defective memory array. In a manner transparent to the memory controller, an address decoder is used to make a large memory array look like a smaller, non-defective memory array.

Abstract: The use of a partially defective memory array to create a non-defective memory array. In a manner transparent to the memory controller, an address decoder is used to make a large memory array look like a smaller, non-defective memory array.

Abstract: A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the daughter boards have mounted connectors so that the boards can be electronically and mechanically interconnected with another board.

Abstract: Memory module using partially defective synchronous memory devices, such as SDRAM components. Multiple partially defective SDRAM components are configured to provide a reliable and nondefective memory module that takes advantage of the manner in which defective cells are localized on each SDRAM component.

Abstract: A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the daughter boards have mounted connectors so that the boards can be electrically and mechanically interconnected with another board.

Abstract: Memory module using partially defective synchronous memory devices, such as SDRAM components. Multiple partially defective SDRAM components are configured to provide a reliable and nondefective memory module that takes advantage of the manner in which defective cells are localized on each SDRAM component.

Abstract: A stacked printed circuit board memory module in which a plurality of daughter circuit boards can be stacked onto a primary circuit board. The primary board and each of the plurality of daughter boards have electronic memory ICs mounted on the respective surfaces. The primary board and each of the daughter boards have mounted connectors so that the boards can be electrically and mechanically interconnected with another board.