Patents by Inventor Cornelia Kang-I Tsang
Cornelia Kang-I Tsang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11424152Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The release layer comprises at least one additive that adjusts a frequency of electro-magnetic radiation absorption property of the release layer. The additive comprises, for example, a 355 nm chemical absorber and/or chemical absorber for one of more wavelengths in a range comprising 600 nm to 740 nm. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.Type: GrantFiled: February 3, 2020Date of Patent: August 23, 2022Assignee: International Business Machines CorporationInventors: Paul S. Andry, Bing Dang, Jeffrey Donald Gelorme, Li-Wen Hung, John U. Knickerbocker, Cornelia Kang-I Tsang
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Patent number: 10381255Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.Type: GrantFiled: December 10, 2018Date of Patent: August 13, 2019Assignee: International Business Machines CorporationInventors: Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Kang-I Tsang
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Patent number: 10297479Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.Type: GrantFiled: January 11, 2017Date of Patent: May 21, 2019Assignee: International Business Machines CorporationInventors: Bing Dang, John U. Knickerbocker, Cornelia Kang-I Tsang
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Publication number: 20190115243Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.Type: ApplicationFiled: December 10, 2018Publication date: April 18, 2019Inventors: Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Kang-I Tsang
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Patent number: 10224229Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.Type: GrantFiled: July 21, 2016Date of Patent: March 5, 2019Assignee: International Business Machines CorporationInventors: Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Kang-I Tsang
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Patent number: 10103450Abstract: Package structures are provided for integrally packaging antennas with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an RFIC chip, and an antenna package bonded to the RFIC chip. The antenna package includes a glass substrate, at least one planar antenna element formed on a first surface of the glass substrate, a ground plane formed on a second surface of the glass substrate, opposite the first surface, and an antenna feed line formed through the glass substrate and connected to the at least one planar antenna element. The antenna package is bonded to a surface of the RFIC chip using a layer of adhesive material.Type: GrantFiled: August 10, 2016Date of Patent: October 16, 2018Assignee: International Business Machines CorporationInventors: Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter Jerome Sorce, Cornelia Kang-I Tsang
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Patent number: 9897627Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.Type: GrantFiled: March 25, 2017Date of Patent: February 20, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia Kang-I Tsang
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Patent number: 9851379Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.Type: GrantFiled: March 25, 2017Date of Patent: December 26, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia Kang-I Tsang
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Publication number: 20170199222Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.Type: ApplicationFiled: March 25, 2017Publication date: July 13, 2017Inventors: Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia Kang-I Tsang
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Publication number: 20170199227Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.Type: ApplicationFiled: March 25, 2017Publication date: July 13, 2017Inventors: Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia Kang-I Tsang
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Publication number: 20170125268Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiationType: ApplicationFiled: January 11, 2017Publication date: May 4, 2017Inventors: Bing Dang, John U. Knickerbocker, Cornelia Kang-I Tsang
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Patent number: 9636782Abstract: Structures and methods are provided for temporarily bonding handler wafers to device wafers using bonding structures that include one or more releasable layers which are laser-ablatable using mid-wavelength infrared radiation.Type: GrantFiled: March 27, 2014Date of Patent: May 2, 2017Assignee: International Business Machines CorporationInventors: Bing Dang, John U. Knickerbocker, Cornelia Kang-I Tsang
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Patent number: 9606142Abstract: A test probe structure having a planar surface and contact locations matched to test hardware is provided. The fabrication of the test probe structure addresses problems related to the possible deformation of base substrates during manufacture. Positional accuracy of contact locations and planarity of base substrates is achieved using dielectric layers, laser ablation, injection molded solder or redistribution layer wiring, and planarization techniques.Type: GrantFiled: September 24, 2014Date of Patent: March 28, 2017Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Bing Dang, John U. Knickerbocker, Jae-Woong Nah, Robert E. Trzcinski, Cornelia Kang-I Tsang
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Patent number: 9586291Abstract: Methods are provided to form adhesive materials that are used to temporarily bond handler wafers to device wafers, and which enable mid-wavelength infrared laser ablation release techniques to release handler wafers from device wafers.Type: GrantFiled: March 27, 2014Date of Patent: March 7, 2017Assignee: GLOBALFOUNDRIES INCInventors: Bing Dang, John U. Knickerbocker, Eric Peter Lewandowski, Cornelia Kang-I Tsang
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Publication number: 20160352023Abstract: Package structures are provided for integrally packaging antennas with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an RFIC chip, and an antenna package bonded to the RFIC chip. The antenna package includes a glass substrate, at least one planar antenna element formed on a first surface of the glass substrate, a ground plane formed on a second surface of the glass substrate, opposite the first surface, and an antenna feed line formed through the glass substrate and connected to the at least one planar antenna element. The antenna package is bonded to a surface of the RFIC chip using a layer of adhesive material.Type: ApplicationFiled: August 10, 2016Publication date: December 1, 2016Inventors: Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter Jerome Sorce, Cornelia Kang-I Tsang
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Publication number: 20160329233Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.Type: ApplicationFiled: July 21, 2016Publication date: November 10, 2016Inventors: Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Kang-I Tsang
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Patent number: 9472859Abstract: Package structures are provided for integrally packaging antennas with semiconductor RFIC (radio frequency integrated circuit) chips to form compact integrated radio/wireless communications systems that operate in the millimeter-wave and terahertz frequency ranges. For example, a package structure includes an RFIC chip, and an antenna package bonded to the RFIC chip. The antenna package includes a glass substrate, at least one planar antenna element formed on a first surface of the glass substrate, a ground plane formed on a second surface of the glass substrate, opposite the first surface, and an antenna feed line formed through the glass substrate and connected to the at least one planar antenna element. The antenna package is bonded to a surface of the RFIC chip using a layer of adhesive material.Type: GrantFiled: May 20, 2014Date of Patent: October 18, 2016Assignee: International Business Machines CorporationInventors: Bing Dang, Duixian Liu, Jean-Olivier Plouchart, Peter Jerome Sorce, Cornelia Kang-I Tsang
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Publication number: 20160133486Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.Type: ApplicationFiled: November 7, 2014Publication date: May 12, 2016Inventors: Paul S. Andry, Russell A. Budd, Bing Dang, Li-Wen Hung, John U. Knickerbocker, Cornelia Kang-I Tsang
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Publication number: 20160133495Abstract: The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The penetration depths of the adhesive and ablation layers are selected such that no more than a negligible amount of the ablation fluence reaches the surface of the device wafer.Type: ApplicationFiled: September 3, 2015Publication date: May 12, 2016Inventors: Paul S. Andry, Jeffrey D. Gelorme, Cornelia Kang-I Tsang, Bucknell C. Webb
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Publication number: 20160133497Abstract: The absorption properties of both an adhesive layer and an ablation layer are employed to facilitate debonding of a device wafer and a glass handler without damaging the device wafer. The penetration depths of the adhesive and ablation layers are selected such that no more than a negligible amount of the ablation fluence reaches the surface of the device wafer.Type: ApplicationFiled: November 7, 2014Publication date: May 12, 2016Inventors: Paul S. Andry, Jeffrey D. Gelorme, Cornelia Kang-I Tsang, Bucknell C. Webb