Patents by Inventor Craig A. St. Martin

Craig A. St. Martin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Configuration and method for positioning semiconductor device bond pads using additional process layers
    Patent number: 5384488
    Abstract: A semiconductor chip (12) includes a plurality of bond pads (16). A plurality of bond shelves (28) are located along opposed end edges (20, 22) of the chip (12). The bond pads (16) are oriented in selected areas remote from the bond shelves (28). A via (42) is formed through an insulating layer (38) to the surface of the bond pad (18) to provide electrical connection thereto. A metallization layer (44) is formed over the an insulating layer (38), filling the via (42). The metallization layer (44) is patterned and etched to form a patten of trace lines (18) spatially separated to connect each bond pad (16) to bond shelves (28).
    Type: Grant
    Filed: October 3, 1993
    Date of Patent: January 24, 1995
    Assignee: Texas Instruments Incorporated
    Inventors: Shahin Golshan, Craig A. St. Martin, Craig W. Rhodine