Abstract: A power adapter has a solenoid actuated retaining latch controlled by an electronic circuit that detects the presence or absence of AC mains voltage. When the assembled AC-DC adapter and plug assembly are removed from the wall, the latch detects removal and unlocks the plug assembly for easy removal without undue force required by the user. The circuit is designed for minimal power consumption, and the solenoid only consumes power when it is engaging or disengaging the latch.

Abstract: A power adapter has a solenoid actuated retaining latch controlled by an electronic circuit that detects the presence or absence of AC mains voltage. When the assembled AC-DC adapter and plug assembly are removed from the wall, the latch detects removal and unlocks the plug assembly for easy removal without undue force required by the user. The circuit is designed for minimal power consumption, and the solenoid only consumes power when it is engaging or disengaging the latch.

Abstract: A power adapter has a solenoid actuated retaining latch controlled by an electronic circuit that detects the presence or absence of AC mains voltage. When the assembled AC-DC adapter and plug assembly are removed from the wall, the latch detects removal and unlocks the plug assembly for easy removal without undue force required by the user. The circuit is designed for minimal power consumption, and the solenoid only consumes power when it is engaging or disengaging the latch.

Abstract: A power adapter has a solenoid actuated retaining latch controlled by an electronic circuit that detects the presence or absence of AC mains voltage. When the assembled AC-DC adapter and plug assembly are removed from the wall, the latch detects removal and unlocks the plug assembly for easy removal without undue force required by the user. The circuit is designed for minimal power consumption, and the solenoid only consumes power when it is engaging or disengaging the latch.

Abstract: Methods, systems, and computer-readable media are disclosed for volume and stress testing bank/credit processing systems. In one implementation, the example system can be configured to include at least one subsystem configured to generate a plurality of data packages. In this example each data package of the plurality can include one of a plurality of simulated financial transactions. The example system can be configured to include at least one subsystem configured to transmit the plurality of data packages to a target database operable to perform at least one of the simulated financial transactions included in one of the plurality of data packages. In this example, the example system can also be configured to include at least one subsystem configured to monitor performance characteristics of the target database as it processes the plurality of data packages.

Abstract: A method and apparatus for dissipating heat from an electronic device is described. The method and apparatus provides a scalable, cost effective, highly efficient, universally applied thermal solution for high heat generating electronic components. In one embodiment, a housing attaches over a heat sink for an electronic device. Various cooling attachments can be attached to this housing to provide a multitude of air flow enhancers. The cooling attachments are designed to provide a thermal engineer or a system integrator with several options for cooling an electronic component. The cooling attachments can be placed in multiple configurations to provide unique thermal solutions. In another embodiment, a kit of parts for a cooling system is provided. The kit of parts includes a housing and a variety of cooling attachments.

Abstract: A method and apparatus for dissipating heat from an electronic device is described. The method and apparatus provides a scalable, cost effective, highly efficient, universally applied thermal solution for high heat generating electronic components. In one embodiment, a housing attaches over a heat sink for an electronic device. Various cooling attachments can be attached to this housing to provide a multitude of air flow enhancers. The cooling attachments are designed to provide a thermal engineer or a system integrator with several options for cooling an electronic component. The cooling attachments can be placed in multiple configurations to provide unique thermal solutions. In another embodiment, a kit of parts for a cooling system is provided. The kit of parts includes a housing and a variety of cooling attachments.

Abstract: A method and apparatus for dissipating heat from an electronic device is described. The method and apparatus provides a scalable, cost effective, highly efficient, universally applied thermal solution for high heat generating electronic components. In one embodiment, a housing attaches over a heat sink for an electronic device. Various cooling attachments can be attached to this housing to provide a multitude of air flow enhancers. The cooling attachments are designed to provide a thermal engineer or a system integrator with several options for cooling an electronic component. The cooling attachments can be placed in multiple configurations to provide unique thermal solutions. In another embodiment, a kit of parts for a cooling system is provided. The kit of parts includes a housing and a variety of cooling attachments.

Abstract: A chassis which comprises a first frame and a second frame is provided. The first frame includes a front surface and a pair of first flanges formed on opposing edges of the front surface. The second frame includes a pair of side surfaces. Each side surface has an edge with a second flange and a plurality of aligned guide elements. The second flanges and the guide elements define guide channels for slidably receiving the first flanges. A cover assembly for the chassis comprises a panel having a first inner surface, a hook, and a standoff projecting from the first inner surface. The hook has a leg portion and an arm portion which may be inserted into a slot in one of the surfaces of the chassis.

Abstract: A chassis which comprises a first frame and a second frame is provided. The first frame includes a front surface and a pair of first flanges formed on opposing edges of the front surface. The second frame includes a pair of side surfaces. Each side surface has an edge with a second flange and a plurality of aligned guide elements. The second flanges and the guide elements define guide channels for slidably receiving the first flanges. A cover assembly for the chassis comprises a panel having a first inner surface, a hook, and a standoff projecting from the first inner surface. The hook has a leg portion and an arm portion which may be inserted into a slot in one of the surfaces of the chassis.

Abstract: A chassis which comprises a first frame and a second frame is provided. The first frame includes a front surface and a pair of first flanges formed on opposing edges of the front surface. The second frame includes a pair of side surfaces. Each side surface has an edge with a second flange and a plurality of aligned guide elements. The second flanges and the guide elements define guide channels for slidably receiving the first flanges. A cover assembly for the chassis comprises a panel having a first inner surface, a hook, and a standoff projecting from the first inner surface. The hook has a leg portion and an arm portion which may be inserted into a slot in one of the surfaces of the chassis.