Abstract: A welding assembly includes an adapter, a diffuser, and a nozzle. The adapter includes an inner portion, a discharge portion, and an engagement portion. The discharge portion defines an outer periphery and at least one aperture. The diffuser defines a contact end, a diffusion end and an outer periphery. The contact end is engaged with the discharge portion of the adapter. The nozzle includes a discharge end, an engagement, end and an inner surface. The engagement end defines a groove and engages with the engagement portion of the adapter. The groove and the outer periphery of the diffuser defines at least one discharge passage within the engagement end of the nozzle. The inner portion of the adapter is in fluid communication with the inner surface of the nozzle through the aperture the discharge passage. Shielding gas is directed toward tip portion of the contact tip through the discharge passages.

Abstract: Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and conductive material stacked one upon another and a heating trace mounted on a surface of the SMPWB or between layers of dielectric material. A first value indicative of a temperature of the heating trace may be determined based on a measured electrical resistance of the heating trace. A difference between the first value and a second value indicative of a desired temperature of the heating trace may be determined. A particular current and a particular voltage may be applied to the heating trace based on the determined difference between the first value and the second value.

Abstract: In one embodiment, a first set of inputs which describe aspects of a device may be received. A second set of inputs may be automatically provided for a group of assessments, included in an analysis, based on the first set of inputs and information in at least one database. An analysis may be performed based on the second set of inputs to assess the reliability of the device. A report may be generated based on the performed analysis.

Abstract: Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and conductive material stacked one upon another and a heating trace mounted on a surface of the SMPWB or between layers of dielectric material. A first value indicative of a temperature of the heating trace may be determined based on a measured electrical resistance of the heating trace. A difference between the first value and a second value indicative of a desired temperature of the heating trace may be determined. A particular current and a particular voltage may be applied to the heating trace based on the determined difference between the first value and the second value.

Abstract: Methods and systems are provided for improving security, efficiency, access control, administrative monitoring, reliability as well as integrity of data transmission and remote application sharing over a network. Secure, stable network connections and efficient network transactions among multiple users are supported by an improved client-server architecture. A datagram schema is provided, which enables dynamic datagram switching in support of a multitude of applications and network services. Mobile intelligent data carriers are provided, allowing for the implementation of an authentication and encryption scheme. They may be used to target deliver applications to authorized user, thereby controlling the access to not only data but also applications. Biometrics and other suitable authentication methodologies may be employed in delivering the pervasive, user-centric network security solutions disclosed.