Patents by Inventor Craig Damon Hillman

Craig Damon Hillman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Surface mount testing system
    Patent number: 7839157
    Abstract: Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and conductive material stacked one upon another and a heating trace mounted on a surface of the SMPWB or between layers of dielectric material. A first value indicative of a temperature of the heating trace may be determined based on a measured electrical resistance of the heating trace. A difference between the first value and a second value indicative of a desired temperature of the heating trace may be determined. A particular current and a particular voltage may be applied to the heating trace based on the determined difference between the first value and the second value.
    Type: Grant
    Filed: January 18, 2007
    Date of Patent: November 23, 2010
    Assignee: DfR Solutions, LLC
    Inventors: Craig Damon Hillman, Nathan John Blattau, Danko Dmitrievich Priimak
  • Product reliability analysis
    Patent number: 7689945
    Abstract: In one embodiment, a first set of inputs which describe aspects of a device may be received. A second set of inputs may be automatically provided for a group of assessments, included in an analysis, based on the first set of inputs and information in at least one database. An analysis may be performed based on the second set of inputs to assess the reliability of the device. A report may be generated based on the performed analysis.
    Type: Grant
    Filed: September 13, 2006
    Date of Patent: March 30, 2010
    Assignee: D&R Solutions, LLC
    Inventors: Craig Damon Hillman, Nathan John Blattau
  • Surface Mount Testing System
    Publication number: 20080175298
    Abstract: Embodiments may include a method and an apparatus for inducing degradation through temperature cycling of a solder joint or a component on a surface mount printed wiring board (SMPWB) coupon. The coupon may include alternating layers of dielectric material and conductive material stacked one upon another and a heating trace mounted on a surface of the SMPWB or between layers of dielectric material. A first value indicative of a temperature of the heating trace may be determined based on a measured electrical resistance of the heating trace. A difference between the first value and a second value indicative of a desired temperature of the heating trace may be determined. A particular current and a particular voltage may be applied to the heating trace based on the determined difference between the first value and the second value.
    Type: Application
    Filed: January 18, 2007
    Publication date: July 24, 2008
    Inventors: Craig Damon Hillman, Nathan John Blattau, Danko Dmitrievich Priimak