Patents by Inventor Craig J. Carbone
Craig J. Carbone has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230335414Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: March 21, 2023Publication date: October 19, 2023Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 11610787Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: December 1, 2020Date of Patent: March 21, 2023Assignee: Brooks Automation US, LLCInventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20210175096Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: December 1, 2020Publication date: June 10, 2021Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C, BLAHNIK, Ho Yin Owen FONG
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Patent number: 10854478Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: December 20, 2019Date of Patent: December 1, 2020Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20200126820Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: December 20, 2019Publication date: April 23, 2020Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph A. KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 10541157Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: October 24, 2016Date of Patent: January 21, 2020Assignee: BROOKS AUTOMATION, INC.Inventors: Christopher Hofmeister, Martin R. Elliott, Alexander Krupyshev, Joseph Hallisey, Joseph Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20180226280Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: October 24, 2016Publication date: August 9, 2018Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Publication number: 20180114708Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: October 24, 2016Publication date: April 26, 2018Inventors: Christopher HOFMEISTER, Martin R. ELLIOTT, Alexander KRUPYSHEV, Joseph HALLISEY, Joseph KRAUS, William FOSNIGHT, Craig J. CARBONE, Jeffrey C. BLAHNIK, Ho Yin Owen FONG
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Patent number: 9478446Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: March 3, 2014Date of Patent: October 25, 2016Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20140178157Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: ApplicationFiled: March 3, 2014Publication date: June 26, 2014Applicant: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 8662812Abstract: A semiconductor processing tool is disclosed, the tool having a frame forming at least one chamber with an opening and having a sealing surface around a periphery of the opening, a door configured to interact with the sealing surface for sealing the opening, the door having sides perpendicular to the door sealing surface and perpendicular to a transfer plane of a substrate, and at least one drive located on the frame to a side of at least one of the sides that are substantially perpendicular to the door sealing surface and substantially perpendicular to the transfer plane of the substrate, the drive having actuators located at least partially in front of the sealing surface and the actuators being coupled to one of the sides of the door for moving the door from a sealed position. The at least one drive is located outside of a substrate transfer zone.Type: GrantFiled: September 24, 2012Date of Patent: March 4, 2014Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Patent number: 8272825Abstract: A substrate processing tool including a frame forming at least one isolatable chamber configured to hold a controlled atmosphere, at least two substrate supports located within each of the at least one isolatable chamber, each of the at least two substrate supports being stacked one above the other and configured to hold a respective substrate and a cooling unit communicably coupled to the at least two substrate supports such that the at least two substrate supports and cooling unit effect simultaneous conductive cooling of each of the respective substrates located on the at least two substrate supports.Type: GrantFiled: May 19, 2008Date of Patent: September 25, 2012Assignee: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Owen Fong
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Publication number: 20090016855Abstract: A substrate processing tool including a frame forming at least one isolatable chamber configured to hold a controlled atmosphere, at least two substrate supports located within each of the at least one isolatable chamber, each of the at least two substrate supports being stacked one above the other and configured to hold a respective substrate and a cooling unit communicably coupled to the at least two substrate supports such that the at least two substrate supports and cooling unit effect simultaneous conductive cooling of each of the respective substrates located on the at least two substrate supports.Type: ApplicationFiled: May 19, 2008Publication date: January 15, 2009Applicant: Brooks Automation, Inc.Inventors: Christopher Hofmeister, Martin R. Elliot, Alexander Krupyshev, Joseph Hallisey, Joseph A. Kraus, William Fosnight, Craig J. Carbone, Jeffrey C. Blahnik, Ho Yin Fong