Abstract: A substrate includes a plurality of OLED, each having a conductor layer. A coating is formed over the OLEDs, the coating comprises a first inorganic layer formed over the OLED structures and at least partially over each of the contact layers, a buffer layer over the first inorganic layer, a second inorganic layer over the buffer layer, wherein the buffer layer comprises a first inorganic interface layer in contact with the first inorganic layer, a second inorganic interface layer in contact with the second inorganic layer, and an organic layer sandwiched between the first and second inorganic interface layers.

Abstract: A substrate includes a plurality of OLED, each having a conductor layer. A coating is formed over the OLEDs, the coating comprises a first inorganic layer formed over the OLED structures and at least partially over each of the contact layers, a buffer layer over the first inorganic layer, a second inorganic layer over the buffer layer, wherein the buffer layer comprises a first inorganic interface layer in contact with the first inorganic layer, a second inorganic interface layer in contact with the second inorganic layer, and an organic layer sandwiched between the first and second inorganic interface layers.

Abstract: A semiconductor wafer processing system in accordance with an embodiment of the present invention includes a loading station, a load lock, a process module, an intermediate process module, and a transport module which further includes a load chamber, a transfer chamber, and a pass-through chamber between the load chamber and the transfer chamber. The intermediate process module may be coupled to the load chamber, or both the load chamber and the transfer chamber. In one embodiment, the load lock is a single-wafer load lock capable of accommodating only a single wafer at a time to allow for fast pump down and vent cycles. In one embodiment, the pass-through chamber is configured as a cooling station to improve throughput for processes that require the wafer to be cooled in-between depositions, for example.

Abstract: A semiconductor wafer processing system in accordance with an embodiment of the present invention includes a loading station, a load lock, a process module, an intermediate process module, and a transport module which further includes a load chamber, a transfer chamber, and a pass-through chamber between the load chamber and the transfer chamber. The intermediate process module may be coupled to the load chamber, or both the load chamber and the transfer chamber. In one embodiment, the load lock is a single-wafer load lock capable of accommodating only a single wafer at a time to allow for fast pump down and vent cycles. In one embodiment, the pass-through chamber is configured as a cooling station to improve throughput for processes that require the wafer to be cooled in-between depositions, for example.

Abstract: A wafer processing system employing a single-wafer load lock with integrated cooling unit is disclosed. The small volume of the single-wafer load lock allows for fast pump down and vent cycles. By integrating a cooling unit within the load lock, system throughput is further increased by eliminating the need to move a newly processed wafer to a separate cooling unit before moving the wafer to the load lock.

Abstract: The mechanism comprises a magnetically coupled drive mechanism for transporting semiconductor wafers in a semiconductor wafer processing system. The mechanism includes an actuator within a cylinder that contains a set of magnets that drive a complementary set of magnets inside a carriage along a linear path. The carriage is limited to linear motion via a linear ball slide. The magnets in the actuator and carriage are magnetically coupled in such a way as to prevent angular rotation of the magnets within the actuator. Accordingly, driving elements in the actuator can be moved via rotation of a ball screw shaft coupled to a ball nut affixed to the actuator magnets.

Abstract: Bowing of semiconductor wafers during heating is reduced by heating the wafers in a gas with a thermal conductivity and mean free path greater than that of oxygen, or by heating the wafers in a processing chamber under a pressure less than 0.1 Torr. In one embodiment, the high thermal conductivity gas is helium and heating in the helium takes place at a pressure less than 2.4 Torr.

Abstract: A compact assembly of two magnetic couplers for coupling two coaxial angular shaft movements through a vacuum barrier. Each coupler includes two concentric rings of radially oriented magnets, arranged to provide magnetic coupling in a radial direction between corresponding magnets in the rings. A relatively large number of magnets in each ring ensures stiff coupling between rings, but unwanted circumferential coupling between adjacent magnets in each ring is minimized by the presence of a flux ring associated with each ring of magnets. The flux rings provide a return path for radial magnetic flux lines between the rings. Cross-coupling between the couplers is minimized by the presence of a magnetic shield on each ring of magnets. The shields permit the couplers to be located in close proximity on their common axis of rotation. For corrosion resistance, each ring of magnets on the vacuum side of the barrier is housed in a stainless steel enclosure.

Abstract: A technique for automatically compensating for differences in orientation of a workpiece, such as a rectangular substrate, a substrate cassette, a loadlock for accessing a vacuum chamber, and a substrate support on a robot mechanism. Sensors on the substrate support detect the position of a front edge of a substrate, a cassette or a loadlock, and measurements taken at the time the sensors are tripped by the edge are used to compute linear, angular and radial position corrections. More specifically, in moving a substrate from a cassette to the loadlock, the substrate support compensates for the orientation of the cassette, compensates for the orientation of the substrate within the cassette, and withdraws the substrate without contact with the cassette walls, and without the need for moving edge guides to orient the substrate.

Abstract: A method and apparatus for calibrating a robot for differences between the actual and predicted positions of a robot chamber with respect to the robot, and for differences between the actual and predicted positions of a processing chamber with respect to the robot. A substrate support on the robot is first moved angularly across a fixed sensor in the robot chamber, to detect the actual position of the sensor in terms of angle, and second is moved radially out across the fixed sensor to detect actual position in terms of radius with respect to a center of rotation. The difference, if any, between the actual and predicted positions of the sensor is used to calibrate a home position of the robot. A similar technique is used to calibrate the robot for any discrepancy between the actual and predicted positions of a processing chamber adjoining the robot chamber.

Abstract: A compact assembly of two magnetic couplers for coupling two coaxial angular shaft movements through a vacuum barrier. Each coupler includes two concentric rings of radially oriented magnets, arranged to provide magnetic coupling in a radial direction between corresponding magnets in the rings. A relatively large number of magnets in each ring ensures stiff coupling between rings, but unwanted circumferential coupling between adjacent magnets in each ring is minimized by the presence of a flux ring associated with each ring of magnets. The flux rings provide a return path for radial magnetic flux lines between the rings. Cross-coupling between the couplers is minimized by the presence of a magnetic shield on each ring of magnets. The shields permit the couplers to be located in close proximity on their common axis of rotation. For corrosion resistance, each ring of magnets on the vacuum side of the barrier is housed in a stainless steel enclosure.

Abstract: The foregoing and other objects of the invention are achieved by a drive system which includes a base and a support assembly for rotatably supporting one end of the first arm from said base and for raising and lowering the arm with respect to the base. A second arm has one end rotatably supported at the other end of the first arm and an effector mount is rotatably supported at the other end of the second arm. Drive structure mounted on said base rotate said support assembly. Drive structure mounted at the lower end of said support assembly raise and lower the arm. Drive structure for rotating said second arm and drive structure for rotating said effector are mounted at the upper end of said support. All of said drive structure are mounted within an enclosed housing.