Abstract: A movable die component for a press device includes a plate body having a workpiece engagement surface configured to engage a workpiece formed by the press device. The plate body has a plurality of internal pockets completely enclosed by the plate body. Optionally, the plate body may be formed by an additive manufacturing process, such as by forming a plurality of direct metal laser sintering layers. The direct metal laser sintering layers may include a lower layer, a plurality of middle layers, and an upper layer with the internal pockets being provided in the middle layers, and with the lower layer covering a bottom of each internal pocket and the upper layer coving a top of each internal pocket.

Abstract: A movable die component for a press device includes a plate body having a workpiece engagement surface configured to engage a workpiece formed by the press device. The plate body has a plurality of internal pockets completely enclosed by the plate body. Optionally, the plate body may be formed by an additive manufacturing process, such as by forming a plurality of direct metal laser sintering layers. The direct metal laser sintering layers may include a lower layer, a plurality of middle layers, and an upper layer with the internal pockets being provided in the middle layers, and with the lower layer covering a bottom of each internal pocket and the upper layer coving a top of each internal pocket.

Abstract: A power terminal having a unitary connector body. The body includes at least one opening therethrough. The opening is configured to receive an electrically conductive member. The body further includes a recess configured to receive a cap portion of the electrically conductive member. The connector body has an electrically insulative coating on at least a portion of a surface thereof. The insulative coating provides sufficient electrical insulation to substantially prevent electrical communication between the electrically conductive member and the connector body. A method for fabricating a power terminal is also provided.

Abstract: A header assembly includes an insulative housing having a plurality of walls defining an interior cavity extending along a mating axis, and a plurality of contacts within the cavity and extending through one of the walls to an exterior of the housing for surface mounting to a circuit board. The insulative housing includes at least one alignment rib extending on an exterior surface thereof in a direction substantially perpendicular to the mating axis. The contacts are formed against and abutting the alignment rib, thereby ensuring coplanarity of the contacts for surface mounting to a circuit board.

Abstract: A electrical connector system comprising a plug assembly and a socket assembly. The plug assembly includes a plurality of conductive pads. The socket assembly includes a first set of spring contacts and a second set of spring contacts. The first set of spring contacts are oriented in a direction opposing an orientation of the second set of spring contacts. Each spring contact within the first and second sets of spring contacts contact one of the plurality of conductive pads.

Abstract: A socket assembly configured to be reflow soldered to a circuit board comprising a perimeter frame having a central open area surrounded by perimeter walls. The socket assembly may be configured to be surface mounted on a circuit board, wherein at least one of the perimeter walls includes a post extending downward therefrom. The socket assembly also comprises a base fit into the open area of the perimeter frame. The base is separate and distinct from the socket frame. The base has a post hole therein positioned to mate with the post. Additionally, the socket assembly comprises contacts held by the base, and solder balls provided on a bottom of the base. The solder balls engage the contacts and, prior to, and after, soldering, extend beyond a bottom of the socket frame.

Abstract: A socket assembly configured to be reflow soldered to a circuit board comprising a perimeter frame having a central open area surrounded by perimeter walls. The socket assembly may be configured to be surface mounted on a circuit board, wherein at least one of the perimeter walls includes a post extending downward therefrom. The socket assembly also comprises a base fit into the open area of the perimeter frame. The base is separate and distinct from the socket frame. The base has a post hole therein positioned to mate with the post. Additionally, the socket assembly comprises contacts held by the base, and solder balls provided on a bottom of the base. The solder balls engage the contacts and, prior to, and after, soldering, extend beyond a bottom of the socket frame.

Abstract: A electrical connector system comprising a plug assembly and a socket assembly. The plug assembly includes a plurality of conductive pads. The socket assembly includes a first set of spring contacts and a second set of spring contacts. The first set of spring contacts are oriented in a direction opposing an orientation of the second set of spring contacts. Each spring contact within the first and second sets of spring contacts contact one of the plurality of conductive pads.